SCHEMBL2203676

SCHEMBL2203676

O=P(O)(O)C(N1CCCN(C(P(=O)(O)O)P(=O)(O)O)CCCN(C(P(=O)(O)O)P(=O)(O)O)CCC1)P(=O)(O)O

nearest known ligand 0.85

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
FDPS P14324 3/20 0.85
ANPEP P15144 1/20 0.35
ERAP2 Q6P179 1/20 0.35
MMP1 P03956 1/20 0.32
MMP2 P08253 1/20 0.32
MMP3 P08254 1/20 0.32
MMP9 P14780 1/20 0.32
MAPT P10636 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2472093 0.92 FDPS (1.00) FDPSANPEPERAP2MMP1MMP2
N-(Hexamethyleneimino)Methylenebisphosphonic Acid SCHEMBL12309768 0.92 FDPS (1.00) FDPSANPEPERAP2MMP1MMP2
SCHEMBL898693 0.88 FDPS (0.75) FDPSANPEPERAP2MMP2
SCHEMBL203348 0.88 FDPS (0.75) FDPSANPEPERAP2MMP2
SCHEMBL3080928 0.88 FDPS (0.75) FDPSANPEPERAP2MMP2
SCHEMBL15005243 0.82 FDPS (0.59) FDPSANPEPERAP2
SCHEMBL10346154 0.80 FDPS (0.84) FDPS
SCHEMBL9356971 0.79 FDPS (0.62) FDPS
Thiomorpholinomethylenediphosphonic Acid SCHEMBL1471965 0.77 FDPS (1.00) FDPS
SCHEMBL26029597 0.77 FDPS (0.60) FDPS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 125 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230295537-A1 MICROELECTRONIC DEVICE CLEANING COMPOSITION ENTEGRIS, INC. 2023-09-21 US claimed
WO-2023069409-A1 SELECTIVE WET ETCH COMPOSITION AND METHOD ENTEGRIS, INC. (US) 2023-04-27 WO claimed
US-20230121639-A1 SELECTIVE WET ETCH COMPOSITION AND METHOD ENTEGRIS, INC. 2023-04-20 US claimed
EP-4136273-A1 METHOD AND COMPOSITION FOR ETCHING MOLYBDENUM Entegris, Inc. (US) 2023-02-22 EP claimed
US-20230030323-A1 METHOD AND COMPOSITION FOR ETCHING MOLYBDENUM MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT 2023-02-02 US claimed
US-20210324525-A1 METHOD AND COMPOSITION FOR ETCHING MOLYBDENUM MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT 2021-10-21 US claimed
WO-2021211708-A1 METHOD AND COMPOSITION FOR ETCHING MOLYBDENUM ENTEGRIS, INC. (US) 2021-10-21 WO claimed
US-11124746-B2 Post CMP cleaning composition ENTEGRIS, INC. (US) 2021-09-21 US claimed
US-11085011-B2 Post CMP cleaning compositions for ceria particles ENTEGRIS, INC. (US) 2021-08-10 US claimed
US-10731109-B2 Post chemical mechanical polishing formulations and method of use ENTEGRIS, INC. (US) 2020-08-04 US claimed
US-8557757-B2 Multipurpose acidic, organic solvent based microelectronic cleaning composition AVANTOR PERFORMANCE MATERIALS, INC. (US) 2013-10-15 US claimed
EP-2401352-B1 STRIPPING COMPOSITIONS FOR CLEANING ION IMPLANTED PHOTORESIST FROM SEMICONDUCTOR DEVICE WAFERS AVANTOR PERFORMANCE MAT INC (US) 2013-06-12 EP claimed
WO-2013058770-A1 NON-AMINE POST-CMP COMPOSITION AND METHOD OF USE ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2013-04-25 WO claimed
US-20100261632-A1 NON-FLUORIDE CONTAINING COMPOSITION FOR THE REMOVAL OF RESIDUE FROM A MICROELECTRONIC DEVICE ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2010-10-14 US claimed
US-20080050513-A1 PREVENTION OF QUANTUM DOT QUENCHING ON METAL SURFACES CAMBRIOS TECHNOLOGIES CORPORATION (US) 2008-02-28 US claimed
US-7235227-B2 Paramagnetic particles that provide improved relaxivity BARNES-JEWISH HOSPITAL (US) 2007-06-26 US claimed
EP-1326951-B1 STABILIZED ALKALINE COMPOSITIONS FOR CLEANING MICROELECTRONIC SUBSTRATES MALLINCKRODT BAKER INC (US) 2005-02-02 EP claimed
US-20030215392-A1 Paramagnetic particles that provide improved relaxivity KEREOS, INC. 2003-11-20 US claimed
US-6599370-B2 Stabilized alkaline compositions for cleaning microelectronic substrates MALLINCKRODT INC. 2003-07-29 US claimed
US-20020077259-A1 Stabilized alkaline compositions for cleaning microlelectronic substrates AVANTOR PERFORMANCE MATERIALS, LLC 2002-06-20 US claimed