SCHEMBL2206526

SCHEMBL2206526

[O-][n+]1ccc(NO)c2ccccc21

nearest known ligand 0.37

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
MITF O75030 1/20 0.35
MAPT P10636 1/20 0.35
CHKA P35790 3/20 0.32
RAB9A P51151 1/20 0.32
RCE1 Q9Y256 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL31238197 0.98 MITF (0.34) MITFMAPTCHKARAB9ARCE1
SCHEMBL10647924 0.81 MAPT (0.38) MITFMAPTCHKA
SCHEMBL29154707 0.78 RXFP1 (0.49) MAPT
SCHEMBL1193736 0.74 IDO1 (0.44) MITFMAPTRAB9ARCE1
SCHEMBL15193690 0.72 MITF (0.31) MITFMAPT
SCHEMBL6827498 0.71 MAPT (0.38) MITFMAPTRAB9ARCE1
SCHEMBL633559 0.71 RAB9A (0.36) MITFMAPTRAB9ARCE1
SCHEMBL3367760 0.71 RAB9A (0.61) MITFMAPTRAB9ARCE1
SCHEMBL450730 0.69 CHKA (0.46) MITFMAPTCHKARAB9A
SCHEMBL7155648 0.69 MITF (0.37) MITFMAPTRAB9ARCE1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111058069-A Plating solution for electroplating tin alloy 上村工业株式会社 2020-04-24 CN claimed
US-20200123673-A1 ELECTROLYTIC TIN ALLOY PLATING SOLUTION C. UYEMURA & CO., LTD. (JP) 2020-04-23 US claimed
US-7981578-B2 Additive containing photoconductors XEROX CORPORATION (US) 2011-07-19 US claimed
US-20090246660-A1 ADDITIVE CONTAINING PHOTOCONDUCTORS XEROX CORPORATION (US) 2009-10-01 US claimed
US-5100768-A Photoresists for integrated circuits, polyvinyl phenol and nitrogen containing heterocycle KABUSHIKI KAISHA TOSHIBA (JP) 1992-03-31 US claimed
EP-0397474-A2 Photosensitive composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-11-14 EP claimed
CN-111058069-A Plating solution for electroplating tin alloy 上村工业株式会社 2020-04-24 CN disclosed
US-20200123673-A1 ELECTROLYTIC TIN ALLOY PLATING SOLUTION C. UYEMURA & CO., LTD. (JP) 2020-04-23 US disclosed
US-20150010928-A1 MEANS AND METHODS FOR ASSESSING AN ENDOCRINE DISEASE OR DISORDER BASF SE (DE) 2015-01-08 US disclosed
EP-2815236-A1 MEANS AND METHODS FOR ASSESSING AN ENDOCRINE DISEASE OR DISORDER BASF SE (DE) 2014-12-24 EP disclosed
WO-2013121380-A1 MEANS AND METHODS FOR ASSESSING AN ENDOCRINE DISEASE OR DISORDER BASF SE (DE) 2013-08-22 WO disclosed
US-7989129-B2 Hydroxyquinoline containing photoconductors XEROX CORPORATION (US) 2011-08-02 US disclosed
CN-101538545-B Lactobacillus salivarius and food composition thereof FAZHENG REN 2011-07-20 CN disclosed
EP-1521520-A2 METHODS FOR DEVELOPING ANIMAL MODELS Center for the Advancement of Health and Bioscience (US) 2005-04-13 EP disclosed
WO-2004000011-A2 METHODS FOR DEVELOPING ANIMAL MODELS CENTER FOR THE ADVANCEMENT OF HEALTH AND BIOSCIENCE (US) 2003-12-31 WO disclosed
US-20030237104-A1 Methods for developing animal models CENTER FOR THE ADVANCEMENT OF HEALTH AND BIOSCIENCES 2003-12-25 US disclosed
EP-0335597-B1 USE OF A POLYPEPTIDE IN THE PREPARATION OF A COMPOSITION FOR THE TREATMENT OF PANCREATITIS ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1993-05-26 EP disclosed
US-5100768-A Photoresists for integrated circuits, polyvinyl phenol and nitrogen containing heterocycle KABUSHIKI KAISHA TOSHIBA (JP) 1992-03-31 US disclosed
EP-0397474-A2 Photosensitive composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-11-14 EP disclosed
EP-0335597-A2 Use of a polypeptide in the preparation of a composition for the treatment of pancreatitis ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1989-10-04 EP disclosed