SCHEMBL220962

SCHEMBL220962

O=C(OCCOCCOC(=O)C(O)c1ccccc1)C(=O)c1ccccc1

nearest known ligand 0.45

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
LMNA P02545 4/20 0.45
CES2 O00748 3/20 0.45
CES1 P23141 3/20 0.45
KDM4E B2RXH2 2/20 0.42
MAPK1 P28482 1/20 0.41
SMN1; SMN2 Q16637 2/20 0.40
ALDH1A1 P00352 4/20 0.38
MAPT P10636 2/20 0.38
KMT2A Q03164 2/20 0.38
CHRM2 P08172 3/20 0.38
CHRM1 P11229 3/20 0.38
CHRM3 P20309 3/20 0.38
CHRM4 P08173 2/20 0.37
TDP1 Q9NUW8 1/20 0.37
NPSR1 Q6W5P4 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4738628 0.95 LMNA (0.49) LMNACES2CES1KDM4EMAPK1
SCHEMBL28353809 0.87 LMNA (0.52) LMNACES2CES1KDM4EMAPK1
SCHEMBL30478610 0.86 CES2 (0.50) LMNACES2CES1KDM4EMAPK1
SCHEMBL665971 0.86 CES2 (0.50) LMNACES2CES1KDM4EMAPK1
SCHEMBL3312136 0.86 CES2 (0.50) LMNACES2CES1KDM4EMAPK1
SCHEMBL13982035 0.86 CES2 (0.50) LMNACES2CES1KDM4EMAPK1
SCHEMBL28633705 0.85 TDP1 (0.41) LMNACES2CES1MAPK1SMN1; SMN2
SCHEMBL424944 0.81 KDM4E (0.46) LMNACES2CES1KDM4EMAPK1
SCHEMBL29038439 0.81 LMNA (0.46) LMNACES2CES1KDM4EMAPK1
SCHEMBL4738627 0.80 CES2 (0.56) LMNACES2CES1KDM4EMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1245 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4684812-A1 3D PRINTING INK COMPOSITION AND 3D PRINTING MOLDED ARTICLE FORMED BY CURING SAME Aldaver Inc. (KR) 2026-01-28 EP claimed
US-12157842-B2 Photocurable adhesive compositions HENKEL AG & CO. KGAA (DE) 2024-12-03 US claimed
CN-115340834-B Explosion-proof membrane and preparation method thereof 新纶电子材料(常州)有限公司 2024-05-28 CN claimed
EP-3630855-B1 LOW-VISCOSITY PHOTOCURABLE ADHESIVE COMPOSITIONS HENKEL AG & CO KGAA (DE) 2024-05-01 EP claimed
WO-2024049214-A1 METHOD FOR MANUFACTURING ELECTRODE LAMINATE 주식회사 엘지에너지솔루션 2024-03-07 WO claimed
CN-116529900-A Double slit die for simultaneous electrode slurry coating and insulating solution coating and coating method using the same 株式会社LG新能源 2023-08-01 CN claimed
EP-4209277-A1 DOUBLE SLOT DIE FOR SIMULTANEOUSLY PERFORMING ELECTRODE SLURRY COATING AND INSULATING LIQUID COATING, AND COATING METHOD USING SAME LG Energy Solution, Ltd. (KR) 2023-07-12 EP claimed
WO-2023096070-A1 DOUBLE SLOT DIE FOR SIMULTANEOUSLY PERFORMING ELECTRODE SLURRY COATING AND INSULATING LIQUID COATING, AND COATING METHOD USING SAME 주식회사 엘지에너지솔루션 2023-06-01 WO claimed
CN-115340834-A Explosion-proof membrane and preparation method thereof 新纶电子材料(常州)有限公司 2022-11-15 CN claimed
US-11491711-B2 Method of making 3D printed objects using two distinct light sources PHOTOCENTRIC LIMITED (GB) 2022-11-08 US claimed
EP-2182410-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PHOTOSENSITIVE RESIN PRODUCT, PHOTOSENSITIVE RESIN FILM, CURED PHOTOSENSITIVE RESIN FILM PRODUCT, AND OPTICAL WAVEGUIDE PRODUCED BY USING THOSE PRODUCTS Hitachi Chemical Company, Ltd. (JP) 2010-05-05 EP claimed
US-20100027950-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN CURED MATTER, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE RESIN FILM CURED MATTER AND OPTICAL WAVEGUIDE OBTAINED BY USING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-02-04 US claimed
US-20090312453-A1 Composition for Alignment Film Having Excellent Adhesiveness LG CHEM, LTD. (KR) 2009-12-17 US claimed
EP-2053087-A1 RESIN COMPOSITION FOR OPTICAL USE, RESIN MATERIAL FOR OPTICAL USE USING THE SAME, OPTICAL FILTER FOR IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY DEVICE Hitachi Chemical Co., Ltd. (JP) 2009-04-29 EP claimed
WO-2008079519-A1 PHOTOSENSITIVE COMPOSITION WITH LOW YELLOWING UNDER UV-LIGHT AND SUNLIGHT EXPOSURE CLAST TRADING LIMITED (CN) 2008-07-03 WO claimed
WO-2008073664-A1 POLY(ETHYLENEOXIDE) SILOXANE GEL ELECTROLYTES UCHICAGO ARGONNE, LLC (US) 2008-06-19 WO claimed
US-20080134492-A1 POLY(ETHYLENEOXIDE) SILOXANE GEL ELECTROLYTES UCHICAGO ARGONNE, LLC 2008-06-12 US claimed
WO-2008060109-A1 COMPOSITION FOR ALIGNMENT FILM HAVING EXCELLENT ADHESIVENESS LG CHEM, LTD. (KR) 2008-05-22 WO claimed
US-7309550-B2 Photosensitive composition with low yellowing under UV-light and sunlight exposure CHEMENCE, INC. (US) 2007-12-18 US claimed
US-20070099119-A1 Photosensitive composition with low yellowing under UV-light and sunlight exposure CHEMENCE, INC. 2007-05-03 US claimed