SCHEMBL2209912

SCHEMBL2209912

NS(N)(=O)(c1ccccc1)c1ccccc1

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.35
CA1 P00915 2/20 0.35
CA2 P00918 2/20 0.35
CA7 P43166 2/20 0.35
CA9 Q16790 2/20 0.35
CYP3A4 P08684 2/20 0.33
CYP2C19 P33261 2/20 0.33
TDP1 Q9NUW8 2/20 0.33
POLB P06746 1/20 0.33
PARP1 P09874 1/20 0.33
MAPT P10636 1/20 0.33
RECQL P46063 1/20 0.33
BLM P54132 1/20 0.33
PMP22 Q01453 1/20 0.33
HSD17B10 Q99714 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
BBOX1 O75936 1/20 0.33
EHMT2 Q96KQ7 1/20 0.33
EHMT1 Q9H9B1 1/20 0.33
CA12 O43570 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4632090 0.69 TSHR (0.35) TSHRTDP1HSD17B10BBOX1EHMT2
SCHEMBL17963728 0.69 TSHR (0.35) TSHRBBOX1EHMT2EHMT1CA4
SCHEMBL10639940 0.69 NPSR1 (0.38) TSHRCA1CA2CA7CA9
Benzene SCHEMBL28958130 0.69 TSHR (0.39) TSHRCA1CA2CA7CA9
SCHEMBL278265 0.69 TSHR (0.39) TSHRCA1CA2CA7CA9
SCHEMBL3684648 0.69 TSHR (0.35) TSHRCYP3A4TDP1BBOX1EHMT2
SCHEMBL8733256 0.66 SMN1; SMN2 (0.36) TSHRCYP3A4CYP2C19TDP1POLB
SCHEMBL17400778 0.65 LMNA (0.32) TSHRBBOX1EHMT2EHMT1LMNA
SCHEMBL5042529 0.65 CES1 (0.33) TSHRCA1CA2CA7CA9
SCHEMBL9051640 0.63 TP53 (0.38) TSHRPOLBMAPTL3MBTL1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116102851-A Halogen-free copper-clad plate with CTI of more than 600V and preparation method thereof 林州致远电子科技有限公司 2023-05-12 CN claimed
US-4170684-A ENAMEL LACQUERS FOR WIRES DR. BECK & CO. A.G. (DE) 1979-10-09 US claimed
US-4145334-A POLYESTER IMIDE RESINS DR. BECK & CO., A.G. (DE) 1979-03-20 US claimed
CN-116102851-A Halogen-free copper-clad plate with CTI of more than 600V and preparation method thereof 林州致远电子科技有限公司 2023-05-12 CN disclosed
WO-2023074646-A1 RESIN-COATED METAL FOIL, PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE 株式会社レゾナック 2023-05-04 WO disclosed
US-11553593-B2 Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board SHOWA DENKO MATERIALS CO., LTD. (JP) 2023-01-10 US disclosed
CN-109526241-B Solid electrolyte composition, sheet and battery, and related manufacturing method and polymer 富士胶片株式会社 2022-07-01 CN disclosed
CN-111133073-B Composition for forming temporary adhesive layer and temporary adhesive layer 日产化学株式会社 2022-06-03 CN disclosed
CN-109565931-B Composite film for electronic device using high-frequency band signal, printed wiring board, and method for manufacturing the same 昭和电工材料株式会社 2022-04-29 CN disclosed
CN-110099974-B Composition for forming protective layer on substrate 日产化学株式会社 2022-02-25 CN disclosed
CN-109476924-B Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same 昭和电工材料株式会社 2022-02-18 CN disclosed
EP-0129958-A2 Linear polyester amide imides and their use as insulators in tinnable and solderable magnet wires Phelps Dodge Industries, Inc. (US) 1985-01-02 EP disclosed
EP-0017905-B1 POLYURETHANE UREAS WITH AROMATIC SULFUR-CONTAINING UREA GROUPS AND PROCESS FOR THEIR PREPARATION BAYER AG (DE) 1983-10-12 EP disclosed
US-4267232-A P-CRESOL SOLUBILITY; HEAT RESISTANCE DR. BECK & CO. AKTIENGESELLSCHAFT (DE) 1981-05-12 US disclosed
EP-0017905-A1 Polyurethane ureas with aromatic sulfur-containing urea groups and process for their preparation BAYER AG (DE) 1980-10-29 EP disclosed
US-4224206-A Water soluble essentially linear polymer having a plurality of amide, imide and ester groups therein, and a method of making the same and applying the same to substrates PHELPS DODGE INDUSTRIES, INC. (US) 1980-09-23 US disclosed
US-4170684-A ENAMEL LACQUERS FOR WIRES DR. BECK & CO. A.G. (DE) 1979-10-09 US disclosed
US-4145334-A POLYESTER IMIDE RESINS DR. BECK & CO., A.G. (DE) 1979-03-20 US disclosed
US-4145351-A POLYESTERS DR. BECK & CO. AG (DE) 1979-03-20 US disclosed
US-4141886-A Essentially linear polymer having a plurality of amide, imide, and ester groups therein and a method of making the same PHELPS DODGE INDUSTRIES, INC. (US) 1979-02-27 US disclosed