Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CD44 | P16070 | 1/20 | 0.50 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.48 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.48 |
| ▸ | MYC | P01106 | 1/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.47 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.47 |
| ▸ | HPGD | P15428 | 2/20 | 0.47 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.47 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.42 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.42 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.42 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.42 |
| ▸ | G6PD | P11413 | 1/20 | 0.42 |
| ▸ | CASP7 | P55210 | 1/20 | 0.42 |
| ▸ | CASP6 | P55212 | 1/20 | 0.42 |
| ▸ | MAPK14 | Q16539 | 4/20 | 0.41 |
| ▸ | MAPK13 | O15264 | 2/20 | 0.41 |
| ▸ | MAPK12 | P53778 | 2/20 | 0.41 |
| ▸ | MAPK11 | Q15759 | 2/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28001982 | 0.87 | CYP2C9 (0.51) | CD44CYP2C9CYP3A4KMT2AALDH1A1 | |
| SCHEMBL2704894 | 0.87 | ALDH1A1 (0.48) | CYP2C9CYP3A4KMT2AMYCALDH1A1 | |
| SCHEMBL2760394 | 0.86 | GAA (0.58) | KMT2AMYCALDH1A1HSD17B10MAPK14 | |
| SCHEMBL6353075 | 0.85 | AKR1C3 (0.56) | ALDH1A1SMN1; SMN2MAPK14MAPK13MAPK12 | |
| SCHEMBL29442190 | 0.84 | CD44 (0.48) | CD44CYP2C9MYCALDH1A1KDM4E | |
| SCHEMBL704587 | 0.84 | CD44 (0.48) | CD44CYP2C9CYP3A4KMT2AMYC | |
| SCHEMBL29413052 | 0.84 | CD44 (0.48) | CD44CYP2C9CYP3A4KMT2AMYC | |
| SCHEMBL158431 | 0.84 | CD44 (0.48) | CD44CYP2C9MYCALDH1A1KDM4E | |
| SCHEMBL130355 | 0.84 | KDM4E (0.61) | CD44CYP2C9CYP3A4KMT2AMYC | |
| SCHEMBL29367017 | 0.84 | KDM4E (0.61) | CD44CYP2C9CYP3A4KMT2AMYC |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118139742-A | Resin-coated metal foil, printed wiring board, method for manufacturing the same, and semiconductor package | 株式会社力森诺科 | 2024-06-04 | — | — | CN | disclosed |
| US-11827789-B2 | Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof | RESONAC CORPORATION (JP) | 2023-11-28 | — | — | US | disclosed |
| WO-2023074646-A1 | RESIN-COATED METAL FOIL, PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2023-05-04 | — | — | WO | disclosed |
| US-11553593-B2 | Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2023-01-10 | — | — | US | disclosed |
| US-11331888-B2 | Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-05-17 | — | — | US | disclosed |
| CN-109565931-B | Composite film for electronic device using high-frequency band signal, printed wiring board, and method for manufacturing the same | 昭和电工材料株式会社 | 2022-04-29 | — | — | CN | disclosed |
| CN-109476924-B | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same | 昭和电工材料株式会社 | 2022-02-18 | — | — | CN | disclosed |
| CN-108699408-B | Adhesive film for multilayer printed wiring board | 昭和电工材料株式会社 | 2021-11-05 | — | — | CN | disclosed |
| US-20210235582-A1 | RESIN FILM FOR INTERLAYER INSULATING LAYER WITH SUPPORT, MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD | RESONAC CORPORATION (JP) | 2021-07-29 | — | — | US | disclosed |
| US-11049825-B2 | Method for producing semiconductor device | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2021-06-29 | — | — | US | disclosed |
| US-20120178332-A1 | Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method Thereof | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2012-07-12 | — | — | US | disclosed |
| EP-1876873-B1 | PROCESS FOR PRODUCING DOUBLE-SIDED FLEXIBLE PRINTED BOARD AND DOUBLE-SIDED FLEXIBLE PRINTED BOARD | NIPPON KAYAKU KK (JP) | 2011-07-27 | — | — | EP | disclosed |
| US-7517553-B2 | Adhesive aid composition | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2009-04-14 | — | — | US | disclosed |
| US-20090056982-A1 | Process for producing a double-sided flexible printed board and double-sided flexible printed board | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2009-03-05 | — | — | US | disclosed |
| US-7384683-B2 | Substrate for flexible printed wiring board and method for manufacturing the same | UNITIKA LTD. (JP) | 2008-06-10 | — | — | US | disclosed |
| EP-1876873-A1 | PROCESS FOR PRODUCING DOUBLE-SIDED FLEXIBLE PRINTED BOARD AND DOUBLE-SIDED FLEXIBLE PRINTED BOARD | Nippon Kayaku Kabushiki Kaisha (JP) | 2008-01-09 | — | — | EP | disclosed |
| US-20070071984-A1 | Substrate for flexible printed wiring board and method for manufacturing the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2007-03-29 | — | — | US | disclosed |
| US-20070026227-A1 | Adhesive aid composition | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2007-02-01 | — | — | US | disclosed |
| EP-1666556-A1 | ADHESIVE AID COMPOSITION | Nippon Kayaku Kabushiki Kaisha (JP) | 2006-06-07 | — | — | EP | disclosed |
| EP-1667501-A1 | SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME | UNITIKA LTD. (JP) | 2006-06-07 | — | — | EP | disclosed |