SCHEMBL22147283

SCHEMBL22147283

CC(C)(C)c1csc2ccc(CC(C)(C)c3ccc4sc5ccccc5c4c3)cc12

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTPN22 Q9Y2R2 2/20 0.38
PTPN7 P35236 1/20 0.38
DUSP3 P51452 1/20 0.38
PTPN12 Q05209 1/20 0.38
APEX1 P27695 1/20 0.34
GPR3 P46089 1/20 0.33
MAPT P10636 4/20 0.33
ALDH1A1 P00352 3/20 0.33
RAB9A P51151 3/20 0.33
HPGD P15428 2/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
KDM4E B2RXH2 2/20 0.32
CYP1A2 P05177 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
HCRTR1 O43613 1/20 0.31
HCRTR2 O43614 1/20 0.31
DHODH Q02127 1/20 0.31
GABRP O00591 1/20 0.31
GABRD O14764 1/20 0.31
GABRA1 P14867 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22939799 0.84 ALDH1A1 (0.41) PTPN22PTPN7DUSP3PTPN12APEX1
SCHEMBL25616570 0.83 PTPN22 (0.38) PTPN22PTPN7DUSP3PTPN12APEX1
SCHEMBL26192598 0.81 MAPT (0.41) PTPN22PTPN7DUSP3PTPN12APEX1
SCHEMBL21084699 0.81 MAPT (0.41) PTPN22PTPN7DUSP3PTPN12APEX1
SCHEMBL24817882 0.80 PTPN22 (0.37) PTPN22PTPN7DUSP3PTPN12APEX1
SCHEMBL20371931 0.80 RAB9A (0.33) RAB9ACYP2A6
SCHEMBL19068389 0.78 PTPN7 (0.34) PTPN22PTPN7DUSP3PTPN12APEX1
SCHEMBL24601597 0.78 RAB9A (0.38) PTPN22PTPN7DUSP3PTPN12GPR3
SCHEMBL24450352 0.76 PTPN7 (0.36) PTPN22PTPN7DUSP3PTPN12APEX1
SCHEMBL20696581 0.74 GPR3 (0.48) PTPN22PTPN7DUSP3PTPN12GPR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200201185-A1 HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS SAMSUNG SDI CO., LTD. (KR) 2020-06-25 US disclosed