SCHEMBL2215565

SCHEMBL2215565

COc1c(N)cccc1Cc1cccc(N)c1OC

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.41
ADRA2B P18089 1/20 0.41
PTGS1 P23219 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
TSHR P16473 2/20 0.39
MAPK1 P28482 2/20 0.39
GAA P10253 2/20 0.39
MAPT P10636 2/20 0.39
HTT P42858 1/20 0.39
CYP3A4 P08684 2/20 0.37
PIK3CA P42336 1/20 0.37
KDM4E B2RXH2 3/20 0.36
CA12 O43570 1/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
CA14 Q9ULX7 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
RAB9A P51151 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9850983 0.87 HTR1A (0.44) ALDH1A1ADRA2BPTGS1TDP1SMN1; SMN2
SCHEMBL5830851 0.85 GABRA1 (0.41) ALDH1A1ADRA2BPTGS1TDP1TSHR
SCHEMBL11436863 0.85 ALDH1A1 (0.40) ALDH1A1ADRA2BPTGS1TDP1TSHR
SCHEMBL30377562 0.85 GABRA1 (0.41) ALDH1A1ADRA2BPTGS1TDP1TSHR
SCHEMBL31226399 0.83 ALDH1A1 (0.39) ALDH1A1ADRA2BPTGS1TDP1TSHR
Hydrochloric Acid SCHEMBL7563580 0.83 KMT2A (0.42) ALDH1A1TSHRMAPK1GAAMAPT
SCHEMBL31347507 0.82 TAAR1 (0.53) CA12CA1CA2CA14TAAR1
SCHEMBL11206775 0.82 CA12 (0.40) ALDH1A1ADRA2BPTGS1TDP1GAA
SCHEMBL358326 0.81 ALDH1A1 (0.52) ALDH1A1ADRA2BPTGS1TDP1TSHR
SCHEMBL27805201 0.80 CA12 (0.39) ALDH1A1ADRA2BPTGS1TDP1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11827789-B2 Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof RESONAC CORPORATION (JP) 2023-11-28 US disclosed
US-11553593-B2 Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board SHOWA DENKO MATERIALS CO., LTD. (JP) 2023-01-10 US disclosed
US-11331888-B2 Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor SHOWA DENKO MATERIALS CO., LTD. (JP) 2022-05-17 US disclosed
US-20210235582-A1 RESIN FILM FOR INTERLAYER INSULATING LAYER WITH SUPPORT, MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD RESONAC CORPORATION (JP) 2021-07-29 US disclosed
US-11049825-B2 Method for producing semiconductor device SHOWA DENKO MATERIALS CO., LTD. (JP) 2021-06-29 US disclosed
US-20200194391-A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2020-06-18 US disclosed
US-10544305-B2 Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same HITACHI CHEMICAL COMPANY, LTD. (JP) 2020-01-28 US disclosed
EP-3553816-A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE Hitachi Chemical Co., Ltd. (JP) 2019-10-16 EP disclosed
US-20190283373-A1 COMPOSITE FILM FOR ELECTRONIC DEVICES USING HIGH FREQUENCY BAND SIGNALS, PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR RESONAC CORPORATION (JP) 2019-09-19 US disclosed
US-20190284395-A1 THERMOSETTING RESIN COMPOSITION, INTERLAYER INSULATION RESIN FILM, COMPOSITE FILM, PRINTED WIRING BOARD, AND PRODUCTION METHOD THEREOF RESONAC CORPORATION (JP) 2019-09-19 US disclosed
EP-1876873-B1 PROCESS FOR PRODUCING DOUBLE-SIDED FLEXIBLE PRINTED BOARD AND DOUBLE-SIDED FLEXIBLE PRINTED BOARD NIPPON KAYAKU KK (JP) 2011-07-27 EP disclosed
US-20090056982-A1 Process for producing a double-sided flexible printed board and double-sided flexible printed board NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2009-03-05 US disclosed
US-7384683-B2 Substrate for flexible printed wiring board and method for manufacturing the same UNITIKA LTD. (JP) 2008-06-10 US disclosed
EP-1876873-A1 PROCESS FOR PRODUCING DOUBLE-SIDED FLEXIBLE PRINTED BOARD AND DOUBLE-SIDED FLEXIBLE PRINTED BOARD Nippon Kayaku Kabushiki Kaisha (JP) 2008-01-09 EP disclosed
US-20070071984-A1 Substrate for flexible printed wiring board and method for manufacturing the same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2007-03-29 US disclosed
EP-1667501-A1 SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME UNITIKA LTD. (JP) 2006-06-07 EP disclosed
US-4428785-A DIISOCYANATE CROSSLINKER NISSAN MOTOR CO., LTD. (JP) 1984-01-31 US disclosed
EP-0027973-B1 A BINDER FOR A POLYDIENE COMPOSITE PROPELLANT NISSAN MOTOR CO., LTD. (JP) 1983-11-09 EP disclosed
EP-0027973-A1 A binder for a polydiene composite propellant NISSAN MOTOR CO., LTD. (JP) 1981-05-06 EP disclosed
US-4053446-A PROCESS FOR PREPARING HIGH TEAR-STRENGTH POLYDIENE POLYURETHANE BRIDGESTONE TIRE COMPANY, LTD. (JA) 1977-10-11 US disclosed