SCHEMBL22160243

SCHEMBL22160243

C=CCc1cc(C(=O)O)c2ccccc2c1C(=O)O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HMGB1 P09429 1/20 0.44
CXCL12 P48061 1/20 0.44
HPGD P15428 2/20 0.44
HSD17B10 Q99714 2/20 0.44
CYP2C9 P11712 1/20 0.44
TSHR P16473 1/20 0.44
ALOX12 P18054 1/20 0.44
ATIC P31939 1/20 0.44
KDM4E B2RXH2 4/20 0.40
MEN1 O00255 3/20 0.40
KMT2A Q03164 3/20 0.40
ALDH1A1 P00352 2/20 0.40
CYP1A2 P05177 1/20 0.40
GLA P06280 1/20 0.40
CYP2C19 P33261 1/20 0.40
ME2 P23368 1/20 0.39
ME1 P48163 1/20 0.39
ME3 Q16798 1/20 0.39
POLB P06746 1/20 0.38
MAPT P10636 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29793830 1.00 HMGB1 (0.44) HMGB1CXCL12HPGDHSD17B10CYP2C9
SCHEMBL29793884 0.84 XDH (0.39) HPGDTSHRKDM4EMEN1KMT2A
SCHEMBL21409540 0.84 XDH (0.39) HPGDTSHRKDM4EMEN1KMT2A
SCHEMBL2880041 0.81 MEN1 (0.56) HPGDHSD17B10KDM4EMEN1KMT2A
SCHEMBL2638537 0.80 HPGD (0.49) HMGB1CXCL12HPGDHSD17B10CYP2C9
SCHEMBL2535160 0.78 PTGDR (0.36) HMGB1CXCL12HPGDHSD17B10TSHR
SCHEMBL487677 0.76 KDM4E (0.49) HPGDHSD17B10KDM4EMEN1KMT2A
SCHEMBL9741180 0.76 ME2 (0.49) HMGB1CXCL12HPGDHSD17B10KDM4E
Benzene SCHEMBL27083018 0.76 FOLH1 (0.55) HMGB1HPGDTSHRKDM4EKMT2A
SCHEMBL89060 0.76 FOLH1 (0.55) HMGB1HPGDTSHRKDM4EKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11901249-B2 Curable composition and cured product thereof DIC CORPORATION (JP) 2024-02-13 US disclosed
US-11873356-B2 Curable composition and cured product thereof DIC CORPORATION (JP) 2024-01-16 US disclosed
CN-112119104-B Epoxy (meth) acrylate resin composition, curable resin composition, cured product, and article DIC株式会社 2023-09-29 CN disclosed
CN-111918890-B Curable composition and cured product thereof DIC株式会社 2023-07-07 CN disclosed
CN-111971323-B Curable composition and cured product thereof DIC株式会社 2023-04-21 CN disclosed
CN-111918891-B Curable composition and cured product thereof DIC株式会社 2023-02-28 CN disclosed
CN-112105661-B Acid group-containing (meth) acrylate resin composition, curable resin composition, cured product, and resin material for solder resist DIC株式会社 2023-02-24 CN disclosed
US-11548977-B2 Active ester resin and composition and cured product using the same DIC CORPORATION (JP) 2023-01-10 US disclosed
CN-110770202-B Active ester resin, and composition and cured product using same DIC株式会社 2022-12-16 CN disclosed
CN-115210213-A Active ester, curable resin composition, and cured product DIC株式会社 2022-10-18 CN disclosed
CN-112119104-A Epoxy (meth) acrylate resin composition, curable resin composition, cured product, and article DIC株式会社 2020-12-22 CN disclosed
CN-112105661-A Acid group-containing (meth) acrylate resin composition, curable resin composition, cured product, insulating material, resin material for solder resist, and protective member DIC株式会社 2020-12-18 CN disclosed
CN-111971323-A Curable composition and cured product thereof DIC株式会社 2020-11-20 CN disclosed
CN-111936526-A Curable composition and cured product thereof DIC株式会社 2020-11-13 CN disclosed
CN-111918891-A Curable composition and cured product thereof DIC株式会社 2020-11-10 CN disclosed
CN-111918890-A Curable composition and cured product thereof DIC株式会社 2020-11-10 CN disclosed
US-20200216603-A1 ACTIVE ESTER RESIN AND COMPOSITION AND CURED PRODUCT USING THE SAME DIC CORPORATION (JP) 2020-07-09 US disclosed
US-20200207700-A1 ACTIVE ESTER COMPOUND AND COMPOSITION AND CURED PRODUCT OBTAINED USING THE SAME DIC CORPORATION (JP) 2020-07-02 US disclosed
CN-110770202-A Active ester resin, and composition and cured product using same DIC株式会社 2020-02-07 CN disclosed
CN-110770203-A Active ester compound, and composition and cured product using same DIC株式会社 2020-02-07 CN disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20200207700-A1 ACTIVE ESTER COMPOUND AND COMPOSITION AND CURED PRODUCT OBTAINED USING THE SAME CRAT, CYP19A1, EP300 HMGB1 2757/4885CXCL12 4766/4885HPGD 1932/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.