SCHEMBL2220918

SCHEMBL2220918

C=C(C)C(=O)OC(C)OCC.C=C(C)C(=O)OCC1CO1.C=C(C)C(=O)OCc1ccccc1

nearest known ligand 0.51

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.51
MGLL Q99685 6/20 0.41
CYP1A2 P05177 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2221235 0.92 ALDH1A1 (0.47) ALDH1A1MGLLCYP1A2
SCHEMBL3004576 0.90 ALDH1A1 (0.42) ALDH1A1MGLLCYP1A2
Isobutane SCHEMBL28244327 0.88 ALDH1A1 (0.62) ALDH1A1MGLLCYP1A2
SCHEMBL3007166 0.88 ALDH1A1 (0.46) ALDH1A1
SCHEMBL16632271 0.87 ALDH1A1 (0.68) ALDH1A1MGLL
Ethylene Glycol SCHEMBL28112088 0.84 ALDH1A1 (0.62) ALDH1A1MGLL
SCHEMBL2221927 0.82 ALDH1A1 (0.40) ALDH1A1
SCHEMBL2219775 0.82 ALDH1A1 (0.33) ALDH1A1
SCHEMBL3062591 0.81 ALDH1A1 (0.58) ALDH1A1MGLL
SCHEMBL2220444 0.80 ALDH1A1 (0.57) ALDH1A1MGLL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8932800-B2 Positive photosensitive resin composition and method for forming cured film using the same FUJIFILM CORPORATION (JP) 2015-01-13 US disclosed
US-8771907-B2 Positive photosensitive resin composition and method of forming cured film from the same FUJIFILM CORPORATION (JP) 2014-07-08 US disclosed
EP-2447774-B1 Positive photosensitive resin composition and method of forming cured film from the same FUJIFILM CORP (JP) 2014-02-26 EP disclosed
US-20130071787-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING CURED FILM USING THE SAME FUJIFILM CORPORATION (KP) 2013-03-21 US disclosed
EP-2557456-A2 Positive photosensitive resin composition and method of forming cured film from the same Fujifilm Corporation (JP) 2013-02-13 EP disclosed
US-8329380-B2 Positive photosensitive resin composition and method for forming cured film using the same FUJIFILM CORPORATION (JP) 2012-12-11 US disclosed
EP-2447774-A1 Positive photosensitive resin composition and method of forming cured film from the same Fujifilm Corporation (JP) 2012-05-02 EP disclosed
US-20110177302-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM FROM THE SAME FUJIFILM CORPORATION (JP) 2011-07-21 US disclosed
EP-2261737-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM FROM THE SAME FUJIFILM Corporation (JP) 2010-12-15 EP disclosed
US-20100173246-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING CURED FILM USING THE SAME FUJIFILM CORPORATION (JP) 2010-07-08 US disclosed
EP-2154571-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM THEREFROM Fujifilm Corporation (JP) 2010-02-17 EP disclosed