SCHEMBL3007166

SCHEMBL3007166

C=C(C)C(=O)OC(C)OCC.C=C(C)C(=O)OCc1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.46
L3MBTL1 Q9Y468 4/20 0.40
LMNA P02545 2/20 0.40
MAPK1 P28482 2/20 0.39
TDP1 Q9NUW8 2/20 0.39
KMT2A Q03164 2/20 0.39
SLC6A2 P23975 1/20 0.39
SLC6A3 Q01959 1/20 0.39
FFAR1 O14842 1/20 0.39
SLC15A1 P46059 1/20 0.38
SMN1; SMN2 Q16637 2/20 0.38
PPARG P37231 1/20 0.38
PPARD Q03181 1/20 0.38
PPARA Q07869 1/20 0.38
MAPT P10636 1/20 0.38
TSHR P16473 3/20 0.37
CYP3A4 P08684 1/20 0.37
MEN1 O00255 1/20 0.37
ATM Q13315 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2221927 0.93 ALDH1A1 (0.40) ALDH1A1L3MBTL1LMNAMAPK1TDP1
SCHEMBL2220918 0.88 ALDH1A1 (0.51) ALDH1A1
SCHEMBL632240 0.86 ALDH1A1 (0.46) ALDH1A1LMNAKMT2AMAPTTSHR
SCHEMBL2219388 0.86 ALDH1A1 (0.36) ALDH1A1L3MBTL1LMNAFFAR1SLC15A1
SCHEMBL8988235 0.86 ALDH1A1 (0.45) ALDH1A1L3MBTL1LMNAMAPK1TDP1
SCHEMBL18106793 0.84 ALDH1A1 (0.46) ALDH1A1L3MBTL1LMNAMAPK1TDP1
SCHEMBL2219775 0.84 ALDH1A1 (0.33) ALDH1A1L3MBTL1LMNAKMT2ATSHR
SCHEMBL27953370 0.83 ALDH1A1 (0.51) ALDH1A1L3MBTL1LMNAMAPK1TDP1
Methacrylic Acid SCHEMBL28158162 0.83 ALDH1A1 (0.44) ALDH1A1TDP1KMT2AMAPTTSHR
SCHEMBL2218607 0.83 ALDH1A1 (0.36) ALDH1A1L3MBTL1LMNAMAPK1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8932800-B2 Positive photosensitive resin composition and method for forming cured film using the same FUJIFILM CORPORATION (JP) 2015-01-13 US disclosed
US-20130071787-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING CURED FILM USING THE SAME FUJIFILM CORPORATION (KP) 2013-03-21 US disclosed
US-8329380-B2 Positive photosensitive resin composition and method for forming cured film using the same FUJIFILM CORPORATION (JP) 2012-12-11 US disclosed
US-20100173246-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING CURED FILM USING THE SAME FUJIFILM CORPORATION (JP) 2010-07-08 US disclosed
EP-2154571-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM THEREFROM Fujifilm Corporation (JP) 2010-02-17 EP disclosed