SCHEMBL3004576

SCHEMBL3004576

C=C(C)C(=O)OC(C)OCC.C=C(C)C(=O)OCC1CO1.C=C(CC=C(C)C(=O)O)C(=O)OCc1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.42
MGLL Q99685 5/20 0.34
PREP P48147 1/20 0.31
CYP1A2 P05177 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2219388 0.90 ALDH1A1 (0.36) ALDH1A1
SCHEMBL2220918 0.90 ALDH1A1 (0.51) ALDH1A1MGLLCYP1A2
SCHEMBL2222635 0.89 ALDH1A1 (0.52) ALDH1A1MGLLPREP
SCHEMBL2221235 0.85 ALDH1A1 (0.47) ALDH1A1MGLLCYP1A2
SCHEMBL7966439 0.82 MGLL (0.40) ALDH1A1MGLLPREP
SCHEMBL2220932 0.82 ALDH1A1 (0.39) ALDH1A1
SCHEMBL7957773 0.80 MGLL (0.40) ALDH1A1MGLLPREP
Isobutane SCHEMBL28244327 0.80 ALDH1A1 (0.62) ALDH1A1MGLLCYP1A2
SCHEMBL3007166 0.80 ALDH1A1 (0.46) ALDH1A1
SCHEMBL7967625 0.79 ALDH1A1 (0.61) ALDH1A1MGLL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8932800-B2 Positive photosensitive resin composition and method for forming cured film using the same FUJIFILM CORPORATION (JP) 2015-01-13 US disclosed
US-20130071787-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING CURED FILM USING THE SAME FUJIFILM CORPORATION (KP) 2013-03-21 US disclosed
US-8329380-B2 Positive photosensitive resin composition and method for forming cured film using the same FUJIFILM CORPORATION (JP) 2012-12-11 US disclosed
US-20100173246-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING CURED FILM USING THE SAME FUJIFILM CORPORATION (JP) 2010-07-08 US disclosed
EP-2154571-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM THEREFROM Fujifilm Corporation (JP) 2010-02-17 EP disclosed