SCHEMBL2220932

SCHEMBL2220932

C=C(C)C(=O)OC(C)OCCCC.C=C(CC=C(C)C(=O)O)C(=O)OCc1ccccc1

nearest known ligand 0.39

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.39
TDP1 Q9NUW8 2/20 0.39
L3MBTL1 Q9Y468 2/20 0.39
CYP3A4 P08684 1/20 0.39
TSHR P16473 1/20 0.39
MAPK1 P28482 1/20 0.39
CETP P11597 3/20 0.33
MBOAT4 Q96T53 1/20 0.33
CTSL P07711 2/20 0.32
CTSS P25774 2/20 0.32
CTSK P43235 1/20 0.32
POLB P06746 1/20 0.32
APEX1 P27695 1/20 0.32
HTT P42858 1/20 0.32
MEN1 O00255 1/20 0.32
HPGD P15428 1/20 0.32
KMT2A Q03164 1/20 0.32
LMNA P02545 1/20 0.31
PRTN3 P24158 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2219388 0.90 ALDH1A1 (0.36) ALDH1A1L3MBTL1CTSLLMNAPRTN3
SCHEMBL8942785 0.87 TSHR (0.47) ALDH1A1TDP1L3MBTL1CYP3A4TSHR
SCHEMBL2221918 0.85 ALDH1A1 (0.33) ALDH1A1TDP1MAPK1
SCHEMBL6319583 0.83 TSHR (0.44) ALDH1A1TDP1L3MBTL1CYP3A4TSHR
SCHEMBL16651566 0.83 TSHR (0.50) ALDH1A1TDP1L3MBTL1CYP3A4TSHR
SCHEMBL2689920 0.83 TSHR (0.50) ALDH1A1TDP1L3MBTL1CYP3A4TSHR
SCHEMBL3004576 0.82 ALDH1A1 (0.42) ALDH1A1
SCHEMBL189711 0.81 ALDH1A1 (0.50) ALDH1A1TDP1L3MBTL1TSHRMAPK1
SCHEMBL15511028 0.80 TSHR (0.47) ALDH1A1TSHRCTSLCTSSCTSK
SCHEMBL1228085 0.79 ALDH1A1 (0.43) ALDH1A1TDP1L3MBTL1MAPK1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9964848-B2 Positive photosensitive resin composition and cured film forming method using the same FUJIFILM CORPORATION (JP) 2018-05-08 US disclosed
US-20150212406-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2015-07-30 US disclosed
US-9034440-B2 Positive photosensitive resin composition and cured film forming method using the same FUJIFILM CORPORATION (JP) 2015-05-19 US disclosed
US-8771907-B2 Positive photosensitive resin composition and method of forming cured film from the same FUJIFILM CORPORATION (JP) 2014-07-08 US disclosed
EP-2447774-B1 Positive photosensitive resin composition and method of forming cured film from the same FUJIFILM CORP (JP) 2014-02-26 EP disclosed
EP-2557456-A2 Positive photosensitive resin composition and method of forming cured film from the same Fujifilm Corporation (JP) 2013-02-13 EP disclosed
EP-2447774-A1 Positive photosensitive resin composition and method of forming cured film from the same Fujifilm Corporation (JP) 2012-05-02 EP disclosed
US-20110229661-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM FORMING METHOD USING THE SAME C/O FUJIFILM CORPORATION (JP) 2011-09-22 US disclosed
US-20110177302-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM FROM THE SAME FUJIFILM CORPORATION (JP) 2011-07-21 US disclosed
EP-2261737-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM FROM THE SAME FUJIFILM Corporation (JP) 2010-12-15 EP disclosed
EP-2196852-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMATION OF CURED FILM USING THE SAME Fujifilm Corporation (JP) 2010-06-16 EP disclosed