SCHEMBL2221146

SCHEMBL2221146

C=C(C)C(=O)OCC(CC)C1COC1

nearest known ligand 0.47

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.47
ALDH1A1 P00352 2/20 0.46
THRB P10828 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10292466 0.87 TSHR (0.41) TSHRALDH1A1THRB
SCHEMBL10002688 0.87 TSHR (0.44) TSHRALDH1A1THRB
SCHEMBL10292469 0.83 TSHR (0.41) TSHRALDH1A1THRB
SCHEMBL27818479 0.83 ALDH1A1 (0.51) TSHRALDH1A1THRB
SCHEMBL10002753 0.82 TSHR (0.40) TSHRALDH1A1THRB
SCHEMBL10292121 0.78 ALDH1A1 (0.38) TSHRALDH1A1THRB
SCHEMBL3951271 0.77 TSHR (0.46) TSHRALDH1A1THRB
SCHEMBL27604244 0.76 TSHR (0.49) TSHRALDH1A1THRB
SCHEMBL10292472 0.76 ALDH1A1 (0.36) TSHRALDH1A1
SCHEMBL10292112 0.76 THRB (0.47) TSHRALDH1A1THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8771907-B2 Positive photosensitive resin composition and method of forming cured film from the same FUJIFILM CORPORATION (JP) 2014-07-08 US disclosed
EP-2447774-B1 Positive photosensitive resin composition and method of forming cured film from the same FUJIFILM CORP (JP) 2014-02-26 EP disclosed
EP-2557456-A2 Positive photosensitive resin composition and method of forming cured film from the same Fujifilm Corporation (JP) 2013-02-13 EP disclosed
EP-2447774-A1 Positive photosensitive resin composition and method of forming cured film from the same Fujifilm Corporation (JP) 2012-05-02 EP disclosed
US-20110177302-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM FROM THE SAME FUJIFILM CORPORATION (JP) 2011-07-21 US disclosed
EP-2261737-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM FROM THE SAME FUJIFILM Corporation (JP) 2010-12-15 EP disclosed