SCHEMBL2221181

SCHEMBL2221181

C=C(C)C(=O)OC(C)OCc1ccccc1.C=C(C)C(=O)OCCO.C=CC(=O)OCC1CO1

nearest known ligand 0.41

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.41
MGLL Q99685 6/20 0.36
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2221235 0.82 ALDH1A1 (0.47) ALDH1A1MGLL
SCHEMBL3062591 0.81 ALDH1A1 (0.58) ALDH1A1MGLL
SCHEMBL28216920 0.81 ALDH1A1 (0.63) ALDH1A1MGLLTSHR
SCHEMBL2220918 0.80 ALDH1A1 (0.51) ALDH1A1MGLL
SCHEMBL2218607 0.80 ALDH1A1 (0.36) ALDH1A1TSHR
SCHEMBL3047393 0.79 ALDH1A1 (0.50) ALDH1A1MGLLTSHR
SCHEMBL1395905 0.77 ALDH1A1 (0.46) ALDH1A1TSHR
SCHEMBL31144810 0.77 ALDH1A1 (0.66) ALDH1A1MGLLTSHR
Acrylic Acid Ethyl Ester SCHEMBL11217002 0.77 ALDH1A1 (0.57) ALDH1A1MGLLTSHR
SCHEMBL16442918 0.76 ALDH1A1 (0.68) ALDH1A1MGLLTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8932800-B2 Positive photosensitive resin composition and method for forming cured film using the same FUJIFILM CORPORATION (JP) 2015-01-13 US disclosed
US-8771907-B2 Positive photosensitive resin composition and method of forming cured film from the same FUJIFILM CORPORATION (JP) 2014-07-08 US disclosed
EP-2447774-B1 Positive photosensitive resin composition and method of forming cured film from the same FUJIFILM CORP (JP) 2014-02-26 EP disclosed
US-20130071787-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING CURED FILM USING THE SAME FUJIFILM CORPORATION (KP) 2013-03-21 US disclosed
EP-2557456-A2 Positive photosensitive resin composition and method of forming cured film from the same Fujifilm Corporation (JP) 2013-02-13 EP disclosed
US-8329380-B2 Positive photosensitive resin composition and method for forming cured film using the same FUJIFILM CORPORATION (JP) 2012-12-11 US disclosed
EP-2447774-A1 Positive photosensitive resin composition and method of forming cured film from the same Fujifilm Corporation (JP) 2012-05-02 EP disclosed
US-20110177302-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM FROM THE SAME FUJIFILM CORPORATION (JP) 2011-07-21 US disclosed
EP-2261737-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM FROM THE SAME FUJIFILM Corporation (JP) 2010-12-15 EP disclosed
US-20100173246-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING CURED FILM USING THE SAME FUJIFILM CORPORATION (JP) 2010-07-08 US disclosed
EP-2154571-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM THEREFROM Fujifilm Corporation (JP) 2010-02-17 EP disclosed