SCHEMBL2218607

SCHEMBL2218607

C=C(C)C(=O)OCCO.C=C(C)C(=O)OCc1ccccc1.C=CC(=O)OC(C)OCC

nearest known ligand 0.36

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.36
HCAR2 Q8TDS4 1/20 0.34
CTSL P07711 4/20 0.34
CTSB P07858 2/20 0.34
L3MBTL1 Q9Y468 3/20 0.33
LMNA P02545 3/20 0.33
THRB P10828 2/20 0.33
TSHR P16473 2/20 0.33
TGM2 P21980 1/20 0.33
CYP3A4 P08684 1/20 0.33
MAPK1 P28482 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
FFAR1 O14842 1/20 0.32
NR1H4 Q96RI1 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2221927 0.91 ALDH1A1 (0.40) ALDH1A1CTSLCTSBL3MBTL1LMNA
SCHEMBL2221235 0.84 ALDH1A1 (0.47) ALDH1A1
SCHEMBL1395905 0.83 ALDH1A1 (0.46) ALDH1A1HCAR2L3MBTL1LMNATHRB
SCHEMBL3007166 0.83 ALDH1A1 (0.46) ALDH1A1L3MBTL1LMNATSHRCYP3A4
SCHEMBL3504972 0.81 ALDH1A1 (0.54) ALDH1A1HCAR2L3MBTL1LMNATHRB
SCHEMBL2221181 0.80 ALDH1A1 (0.41) ALDH1A1TSHR
Acrylic Acid Ethyl Ester SCHEMBL3690840 0.79 ALDH1A1 (0.49) ALDH1A1HCAR2CTSLL3MBTL1LMNA
Methacrylic Acid SCHEMBL4890718 0.78 ALDH1A1 (0.51) ALDH1A1HCAR2L3MBTL1LMNATHRB
SCHEMBL17216232 0.78 TSHR (0.54) ALDH1A1CTSLCTSBL3MBTL1LMNA
Styrene SCHEMBL1533138 0.77 ALDH1A1 (0.42) ALDH1A1HCAR2L3MBTL1LMNATSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9964848-B2 Positive photosensitive resin composition and cured film forming method using the same FUJIFILM CORPORATION (JP) 2018-05-08 US disclosed
US-20150212406-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2015-07-30 US disclosed
US-9034440-B2 Positive photosensitive resin composition and cured film forming method using the same FUJIFILM CORPORATION (JP) 2015-05-19 US disclosed
US-8771907-B2 Positive photosensitive resin composition and method of forming cured film from the same FUJIFILM CORPORATION (JP) 2014-07-08 US disclosed
EP-2447774-B1 Positive photosensitive resin composition and method of forming cured film from the same FUJIFILM CORP (JP) 2014-02-26 EP disclosed
EP-2557456-A2 Positive photosensitive resin composition and method of forming cured film from the same Fujifilm Corporation (JP) 2013-02-13 EP disclosed
EP-2447774-A1 Positive photosensitive resin composition and method of forming cured film from the same Fujifilm Corporation (JP) 2012-05-02 EP disclosed
US-20110229661-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM FORMING METHOD USING THE SAME C/O FUJIFILM CORPORATION (JP) 2011-09-22 US disclosed
US-20110177302-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM FROM THE SAME FUJIFILM CORPORATION (JP) 2011-07-21 US disclosed
EP-2261737-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM FROM THE SAME FUJIFILM Corporation (JP) 2010-12-15 EP disclosed
EP-2196852-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMATION OF CURED FILM USING THE SAME Fujifilm Corporation (JP) 2010-06-16 EP disclosed