Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CD81 | P60033 | 2/20 | 0.34 |
| ▸ | ICAM1 | P05362 | 1/20 | 0.34 |
| ▸ | GRIK2 | Q13002 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2503576 | 0.92 | CD81 (0.38) | CD81ICAM1GRIK2 | |
| SCHEMBL5165178 | 0.85 | CD81 (0.34) | CD81ICAM1GRIK2 | |
| SCHEMBL15968781 | 0.85 | CD81 (0.34) | CD81ICAM1GRIK2 | |
| SCHEMBL5003950 | 0.84 | CD81 (0.36) | CD81ICAM1GRIK2 | |
| SCHEMBL14999865 | 0.83 | GABRA5 (0.40) | CD81ICAM1GRIK2 | |
| SCHEMBL25234936 | 0.82 | LMNA (0.38) | CD81ICAM1GRIK2 | |
| SCHEMBL464872 | 0.82 | LMNA (0.38) | CD81ICAM1GRIK2 | |
| SCHEMBL16267791 | 0.82 | LMNA (0.38) | CD81ICAM1GRIK2 | |
| SCHEMBL9090277 | 0.82 | LMNA (0.38) | CD81ICAM1GRIK2 | |
| SCHEMBL1770285 | 0.82 | LMNA (0.38) | CD81ICAM1GRIK2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 167 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3348623-B1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PROCESS FOR PRODUCING SAME, AND PRESSURE-SENSITIVE ADHESIVE FILM | MITSUI CHEMICALS TOHCELLO INC (JP) | 2023-10-11 | — | — | EP | claimed |
| EP-2551320-B1 | ACRYLIC ADHESIVE COMPOSITION AND ACRYLIC ADHESIVE TAPE | NITTO DENKO CORP (JP) | 2017-05-10 | — | — | EP | claimed |
| US-8617928-B2 | Dicing/die bonding film | NITTO DENKO CORPORATION (JP) | 2013-12-31 | — | — | US | claimed |
| US-20120070960-A1 | DICING DIE BOND FILM, METHOD OF MANUFACTURING DICING DIE BOND FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | NITTO DENKO CORPORATION (JP) | 2012-03-22 | — | — | US | claimed |
| US-20110104873-A1 | DICING/DIE BONDING FILM | NITTO DENKO CORPORATION (JP) | 2011-05-05 | — | — | US | claimed |
| US-20100028687-A1 | DICING DIE-BONDING FILM | NITTO DENKO CORPORATION (JP) | 2010-02-04 | — | — | US | claimed |
| WO-2024042892-A1 | ADHESIVE COMPOSITION AND OPTICAL LAMINATED BODY WITH ADHESIVE LAYER | 綜研化学株式会社 | 2024-02-29 | — | — | WO | disclosed |
| WO-2024014394-A1 | ADHESIVE LAYER-BEARING POLARIZING FILM AND IMAGE DISPLAY DEVICE | 綜研化学株式会社 | 2024-01-18 | — | — | WO | disclosed |
| US-20230303894-A1 | ELECTRICALLY DEBONDABLE ADHESIVE SHEET AND JOINED BODY | NITTO DENKO CORPORATION (JP) | 2023-09-28 | — | — | US | disclosed |
| EP-4194198-A1 | ELECTRICALLY PEELABLE ADHESIVE SHEET AND BONDED BODY | NITTO DENKO CORPORATION (JP) | 2023-06-14 | — | — | EP | disclosed |
| WO-2023074557-A1 | OPTICAL PRESSURE-SENSITIVE ADHESIVE SHEET | 日東電工株式会社 | 2023-05-04 | — | — | WO | disclosed |
| US-20220169002-A1 | METHOD FOR PRODUCING LAMINATE OF TWO-DIMENSIONAL MATERIAL AND LAMINATE | NITTO DENKO CORPORATION (JP) | 2022-06-02 | — | — | US | disclosed |
| EP-3950849-A1 | LATENT HEAT STORAGE MATERIAL | Kaneka Corporation (JP) | 2022-02-09 | — | — | EP | disclosed |
| US-20060257651-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR USE IN DICING AND METHOD OF PROCESSING PRODUCTS WORKED WITH IT | NITTO DENKO CORPORATION (JP) | 2006-11-16 | — | — | US | disclosed |
| US-20060100387-A1 | Stain-proofing agents, coating compositions comprising the stain-proofing agents and coated articles | ASAHI GLASS COMPANY LIMITED (JP) | 2006-05-11 | — | — | US | disclosed |
| US-20050191456-A1 | Adhesive sheet roll for wafer processing | NITTO DENKO CORPORATION (JP) | 2005-09-01 | — | — | US | disclosed |
| US-20050153129-A1 | Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the same | NITTO DENKO CORPORATION | 2005-07-14 | — | — | US | disclosed |
| US-20050139973-A1 | Dicing die-bonding film | NITTO DENKO CORPORATION (JP) | 2005-06-30 | — | — | US | disclosed |
| US-20040230000-A1 | Epoxy resins, phenolic resins, a synthetic rubber (acrylonitrile-butadiene), and microcapsules having a thermoplastic resin shell; improved bonding strength and storage stability; microelectronics; pressure sensitive adhesives | NITTO DENKO CORPORATION (JP) | 2004-11-18 | — | — | US | disclosed |
| EP-1437394-A1 | Adhesives composition, adhesive film, and semiconductor apparatus using the same | NITTO DENKO CORPORATION (JP) | 2004-07-14 | — | — | EP | disclosed |