Butyric Acid

Butyric Acid

SCHEMBL487283

CCC(C)[O-].CCC(C)[O-].CCCC(=O)[O-].[Al+3]

nearest known ligand 0.67

Full drug profile on Sugi Atlas →

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
FFAR3 O14843 2/20 0.67
HDAC3 O15379 2/20 0.67
HDAC1 Q13547 2/20 0.67
HDAC2 Q92769 2/20 0.67
HDAC8 Q9BY41 2/20 0.67
CA1 P00915 3/20 0.46
CA2 P00918 3/20 0.45
NFKB1 P19838 1/20 0.44
CES2 O00748 1/20 0.43
CES1 P23141 1/20 0.43
GPR84 Q9NQS5 1/20 0.42
BBOX1 O75936 2/20 0.40
FABP3 P05413 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Butyric Acid SCHEMBL6250020 0.90 FFAR3 (0.74) FFAR3HDAC3HDAC1HDAC2HDAC8
Butyric Acid SCHEMBL2230696 0.90 FFAR3 (0.74) FFAR3HDAC3HDAC1HDAC2HDAC8
Butyric Acid SCHEMBL8027476 0.85 FFAR3 (0.74) FFAR3HDAC3HDAC1HDAC2HDAC8
Butyric Acid SCHEMBL30879925 0.85 FFAR3 (0.74) FFAR3HDAC3HDAC1HDAC2HDAC8
Butyric Acid SCHEMBL8027475 0.85 FFAR3 (0.74) FFAR3HDAC3HDAC1HDAC2HDAC8
Butyric Acid SCHEMBL1035581 0.85 FFAR3 (0.82) FFAR3HDAC3HDAC1HDAC2HDAC8
Butyric Acid SCHEMBL112217 0.84 FFAR3 (0.93) FFAR3HDAC3HDAC1HDAC2HDAC8
Stearic Acid SCHEMBL9502069 0.83 FABP3 (0.58) CA1CA2NFKB1CES2CES1
SCHEMBL1684083 0.83 HDAC3 (0.44) FFAR3HDAC3HDAC1HDAC2HDAC8
Butyric Acid SCHEMBL11286276 0.82 FFAR3 (0.88) FFAR3HDAC3HDAC1HDAC2HDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2180019-B1 Resin composition, method of its composition, and cured formulation NIPPON CATALYTIC CHEM IND (JP) 2012-02-01 EP disclosed
CN-101831142-B Resin composition, preparation method thereof, and cured formulation NIPPON SHOKUBAI CO.,LTD. (JP) 2012-02-01 CN disclosed
CN-101831142-A Resin composition, method of its composition, and cured formulation NIPPON CATALYTIC CHEM IND 2010-09-15 CN disclosed
CN-1730548-B Resin composition, method for producing same, and cured product NIPPON CATALYTIC CHEM IND 2010-06-16 CN disclosed
US-7723407-B2 mixing a phenolic compound containing the inorganic microfine particle(SiO2) and a compound containing at least one of the glycidyl group and/or an epoxy group containing the inorganic microfine particle; fireproofing; good mechanical properties; heat resistance; automobiles, construction, electronics NIPPON SHOKUBAI CO., LTD. (JP) 2010-05-25 US disclosed
EP-2180019-A1 Resin composition, method of its composition, and cured formulation Nippon Shokubai Co., Ltd. (JP) 2010-04-28 EP disclosed
EP-1626065-B1 Resin composition, method of its composition, and cured formulation NIPPON CATALYTIC CHEM IND (JP) 2010-01-20 EP disclosed
EP-1626065-A1 Resin composition, method of its composition, and cured formulation Nippon Shokubai Co., Ltd. (JP) 2006-02-15 EP disclosed
US-20060029811-A1 mixing a phenolic compound containing the inorganic microfine particle(SiO2) and a compound containing at least one of the glycidyl group and/or an epoxy group containing the inorganic microfine particle; fireproofing; good mechanical properties; heat resistance; automobiles, construction, electronics NIPPON SHOKUBAI CO., LTD. (JP) 2006-02-09 US disclosed
CN-1730548-A Resin composition, method for producing same, and cured product NIPPON CATALYTIC CHEM IND (JP) 2006-02-08 CN disclosed