Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GABRA1 | P14867 | 2/20 | 0.41 |
| ▸ | GABRB2 | P47870 | 2/20 | 0.41 |
| ▸ | KCNA5 | P22460 | 1/20 | 0.36 |
| ▸ | KCNN4 | O15554 | 3/20 | 0.35 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.34 |
| ▸ | KIF11 | P52732 | 4/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.33 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.33 |
| ▸ | PTPN5 | P54829 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8084805 | 0.85 | GABRA1 (0.41) | GABRA1GABRB2KCNA5KCNN4TAAR1 | |
| SCHEMBL27845874 | 0.82 | GABRA1 (0.41) | GABRA1GABRB2KCNA5KCNN4TAAR1 | |
| SCHEMBL9563235 | 0.82 | GABRA1 (0.41) | GABRA1GABRB2KCNA5KCNN4TAAR1 | |
| SCHEMBL9576011 | 0.82 | KIF11 (0.40) | GABRA1GABRB2KCNN4TAAR1KIF11 | |
| SCHEMBL8051827 | 0.81 | GABRA1 (0.39) | GABRA1GABRB2KCNA5KCNN4TAAR1 | |
| SCHEMBL23044955 | 0.79 | GABRA1 (0.45) | GABRA1GABRB2KCNA5TAAR1ALDH1A1 | |
| SCHEMBL11081926 | 0.78 | GABRA1 (0.43) | GABRA1GABRB2TAAR1ALDH1A1MAPT | |
| SCHEMBL26909714 | 0.78 | GABRA1 (0.43) | GABRA1GABRB2TAAR1ALDH1A1MAPT | |
| SCHEMBL30498855 | 0.78 | GABRA1 (0.43) | GABRA1GABRB2TAAR1ALDH1A1MAPT | |
| SCHEMBL10482167 | 0.78 | GABRA1 (0.43) | GABRA1GABRB2TAAR1ALDH1A1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117625105-A | Epoxy resin adhesive and preparation method and application thereof | 韦尔通科技股份有限公司 | 2024-03-01 | — | — | CN | claimed |
| CN-104527181-A | Epoxy foamed sandwich composite material and preparation method thereof | QINGDAO ADVANCED MARINE MATERIAL TECHNOLOGY CO LTD | 2015-04-22 | — | — | CN | claimed |
| WO-2026100491-A1 | EPOXY RESIN COMPOSITION, CURED OBJECT, UNDERFILL MATERIAL, ADHESIVE, AND SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREFOR | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2025028605-A1 | CURING AGENT, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE | 旭化成株式会社 | 2025-02-06 | — | — | WO | disclosed |
| CN-118956309-A | Underfill adhesive, and preparation method and application thereof | 韦尔通科技股份有限公司 | 2024-11-15 | — | — | CN | disclosed |
| CN-118514398-A | Aluminum-based copper-clad plate and preparation method thereof | 金安国纪科技（珠海）有限公司 | 2024-08-20 | — | — | CN | disclosed |
| CN-113185807-B | Resin composition for underfill, electronic component device, and method for manufacturing electronic component device | 株式会社力森诺科 | 2024-03-29 | — | — | CN | disclosed |
| CN-117625105-A | Epoxy resin adhesive and preparation method and application thereof | 韦尔通科技股份有限公司 | 2024-03-01 | — | — | CN | disclosed |
| CN-117378043-A | Underfill resin composition, electronic component device, and method for manufacturing electronic component device | 株式会社力森诺科 | 2024-01-09 | — | — | CN | disclosed |
| CN-117337486-A | Underfill resin composition, electronic component device, and method for manufacturing electronic component device | 株式会社力森诺科 | 2024-01-02 | — | — | CN | disclosed |
| WO-2023033076-A1 | ADHESIVE COMPOSITION | 住友精化株式会社 | 2023-03-09 | — | — | WO | disclosed |
| US-20100001415-A1 | LIQUID EPOXY RESIN COMPOSITION | ASANO MASATOSHI | 2010-01-07 | — | — | US | disclosed |
| US-7642661-B2 | Flip-chip type semiconductor is encapsulated by a cured product of a liquid epoxy resin composition comprising a liquid epoxy resin, an amine type curing agent, sulfur-containing phenol compound, an inorganic filler; easy to handle and allows simplification of semiconductor device production process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-01-05 | — | — | US | disclosed |
| US-20090273070-A1 | Liquid Resin Composition for Electronic Components and Electronic Component Device | RESONAC CORPORATION (JP) | 2009-11-05 | — | — | US | disclosed |
| US-20080265438-A1 | LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-10-30 | — | — | US | disclosed |
| CN-1970623-A | Liquid epoxy resin composition | SHINETSU CHEMICAL CO (JP) | 2007-05-30 | — | — | CN | disclosed |
| US-20070116962-A1 | Liquid epoxy resin composition | SHIN-ETSU CHEMICAL CO., LTD. | 2007-05-24 | — | — | US | disclosed |
| US-20070104959-A1 | Liquid epoxy resin composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-10 | — | — | US | disclosed |
| CN-1958663-A | Liquid epoxy resin composition | SHINETSU CHEMICAL CO (JP) | 2007-05-09 | — | — | CN | disclosed |
| US-20060217499-A1 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. | 2006-09-28 | — | — | US | disclosed |