SCHEMBL8051827

SCHEMBL8051827

CCc1cccc(C(CC)(CC)c2ccccc2)c1CC

nearest known ligand 0.39

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 3/20 0.39
GABRB2 P47870 3/20 0.39
ESR1 P03372 2/20 0.36
ESR2 Q92731 2/20 0.36
KCNA5 P22460 1/20 0.35
KCNN4 O15554 1/20 0.32
PTPN5 P54829 1/20 0.32
TAAR1 Q96RJ0 2/20 0.32
HTR1A P08908 1/20 0.32
HTT P42858 1/20 0.31
CLCN2 P51788 1/20 0.31
CYP2C19 P33261 1/20 0.31
HIF1A Q16665 1/20 0.31
ALOX5AP P20292 1/20 0.31
KIF11 P52732 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9817122 0.85 ESR1 (0.40) GABRA1GABRB2ESR1ESR2KCNA5
SCHEMBL27845874 0.81 GABRA1 (0.41) GABRA1GABRB2ESR1ESR2KCNA5
SCHEMBL2230699 0.81 GABRA1 (0.41) GABRA1GABRB2KCNA5KCNN4PTPN5
SCHEMBL9344023 0.76 GABRA1 (0.46) GABRA1GABRB2TAAR1HTR1A
SCHEMBL11203718 0.74 HTR2A (0.39) ESR1ESR2
SCHEMBL30498855 0.73 GABRA1 (0.43) GABRA1GABRB2TAAR1HTR1AHTT
SCHEMBL11081926 0.73 GABRA1 (0.43) GABRA1GABRB2TAAR1HTR1AHTT
SCHEMBL8679290 0.73 GABRA1 (0.43) GABRA1GABRB2KCNA5TAAR1HTR1A
SCHEMBL10482167 0.73 GABRA1 (0.43) GABRA1GABRB2TAAR1HTR1A
SCHEMBL11014629 0.72 LMNA (0.38) GABRA1GABRB2KCNA5HTTCLCN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11667749-B2 Epoxy resin composition for fiber-reinforced composite materials, epoxy resin cured product, preform and fiber-reinforced composite material TORAY INDUSTRIES, INC. (JP) 2023-06-06 US disclosed
CN-111154072-B Epoxy resin composition, fiber-reinforced composite material, molded article, and pressure vessel 东丽株式会社 2022-09-30 CN disclosed
US-20210347982-A1 EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS, EPOXY RESIN CURED PRODUCT, PREFORM AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2021-11-11 US disclosed
CN-105131598-B Low-dielectric resin composition, resin film using same, prepreg and circuit board 台光电子材料股份有限公司 2017-08-04 CN disclosed
CN-104736982-B Sensor and its manufacture method 东洋橡胶工业株式会社 2017-07-14 CN disclosed
CN-106796096-A Detect the system and its manufacture method of the deformation of cushion pad 东洋橡胶工业株式会社 2017-05-31 CN disclosed
CN-106461368-A Cushion pad deformation detection system and production method therefor 东洋橡胶工业株式会社 2017-02-22 CN disclosed
CN-106414163-A System for detecting deformation in cushion pad and method for manufacturing same 东洋橡胶工业株式会社 2017-02-15 CN disclosed
CN-103958200-B Comprise the lacquer painting diaphragm of nano particle 3M INNOVATIVE PROPERTIES CO. (US) 2015-12-23 CN disclosed
CN-105131598-A Low-dielectric resin composition, resin film using same, prepreg and circuit board ELITE MATERIAL CO LTD 2015-12-09 CN disclosed
CN-101678653-A Multilayer assemblies, multilayer stretch releasing pressure sensitive adhesive assemblies, and methods of making and using the same 3M INNOVATIVE PROPERTIES CO 2010-03-24 CN disclosed
CN-101522417-A Method of making multilayer polyurethane protective film 3M INNOVATIVE PROPERTIES CO (US) 2009-09-02 CN disclosed
CN-101276146-A Colored photosensitive resin composition, and color filter array and solid-state image pickup device using the same SUMITOMO CHEMICAL CO (JP) 2008-10-01 CN disclosed
CN-101276145-A Colored photosensitive resin composition, and color filter array and solid-state image pickup device using the same SUMITOMO CHEMICAL CO (JP) 2008-10-01 CN disclosed
EP-0996690-A1 SILICONE COPOLYMER MODIFIED RELEASE TAPES MINNESOTA MINING AND MANUFACTURING COMPANY (US) 2000-05-03 EP disclosed
WO-1999003940-A1 SILICONE COPOLYMER MODIFIED RELEASE TAPES MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1999-01-28 WO disclosed
CN-1041034-C Heat-resistant adhesive HITACHI CHEMICAL CO LTD (JP) 1998-12-02 CN disclosed
EP-0282064-B1 METHOD FOR PRODUCING M-ETHYLDIPHENYLS NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) 1991-10-23 EP disclosed
US-4835337-A Method for producing m-ethyldiphenyls NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) 1989-05-30 US disclosed
EP-0282064-A1 Method for producing m-ethyldiphenyls NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) 1988-09-14 EP disclosed