⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1830873 | 0.81 | — | — | |
| SCHEMBL4243321 | 0.77 | — | — | |
| SCHEMBL701845 | 0.71 | ARG1 (0.32) | — | |
| Acrylic Acid SCHEMBL31539178 | 0.70 | ARG1 (0.31) | — | |
| SCHEMBL25298185 | 0.69 | SLC6A12 (0.35) | — | |
| SCHEMBL12132163 | 0.69 | SLC6A12 (0.35) | — | |
| SCHEMBL30937766 | 0.69 | — | — | |
| SCHEMBL10119350 | 0.68 | — | — | |
| SCHEMBL30969978 | 0.68 | ARG1 (0.32) | — | |
| SCHEMBL24848849 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112673043-B | Curing agent composition for epoxy resin mixtures, epoxy resin mixtures and multicomponent epoxy resin systems | 喜利得股份公司 | 2024-03-29 | — | — | CN | claimed |
| CN-111247190-B | Hardener component for a multi-component epoxy resin material and multi-component epoxy resin material | 喜利得股份公司 | 2022-11-04 | — | — | CN | claimed |
| EP-2357162-B1 | Resin mortar suitable for construction purposes, especially for chemical anchoring | HILTI AG (LI) | 2012-09-05 | — | — | EP | claimed |
| EP-2357162-A1 | Resin mortar suitable for construction purposes, especially for chemical anchoring | HILTI Aktiengesellschaft (LI) | 2011-08-17 | — | — | EP | claimed |
| EP-4636189-A1 | COUPLING OF ELONGATED ELEMENTS USING A MULTI-COMPONENT RESIN MORTAR SYSTEM | Hilti Aktiengesellschaft (LI) | 2025-10-22 | — | — | EP | disclosed |
| CN-112673043-B | Curing agent composition for epoxy resin mixtures, epoxy resin mixtures and multicomponent epoxy resin systems | 喜利得股份公司 | 2024-03-29 | — | — | CN | disclosed |
| WO-2023250315-A1 | ASPHALT ADDITIVES WITH MULTIPLE AMINES | ASCEND PERFORMANCE MATERIALS OPERATIONS LLC (US) | 2023-12-28 | — | — | WO | disclosed |
| WO-2023086555-A2 | BHM IN ADHESIVE COMPOSITIONS | ASCEND PERFORMANCE MATERIALS OPERATIONS LLC (US) | 2023-05-19 | — | — | WO | disclosed |
| CN-111372968-B | Multi-component epoxy resin compound with leak indicator and curing component for epoxy resin compound | 喜利得股份公司 | 2023-02-28 | — | — | CN | disclosed |
| CN-111247190-B | Hardener component for a multi-component epoxy resin material and multi-component epoxy resin material | 喜利得股份公司 | 2022-11-04 | — | — | CN | disclosed |
| EP-3713985-B1 | MULTI-COMPONENT EPOXY RESIN MASS WITH LEAKAGE INDICATOR AND CURING AGENTS FOR THE EPOXIDE RESIN | HILTI AG (LI) | 2022-09-21 | — | — | EP | disclosed |
| CN-114206989-A | Resin material and multilayer printed wiring board | 积水化学工业株式会社 | 2022-03-18 | — | — | CN | disclosed |
| CN-113136103-A | Polyimide precursor resin composition | 旭化成株式会社 | 2021-07-20 | — | — | CN | disclosed |
| CN-107429057-B | Polyimide precursor resin composition | 旭化成株式会社 | 2021-03-30 | — | — | CN | disclosed |
| CN-108431156-B | Oxalate-polyamine thermosetting compositions | 3M创新有限公司 | 2021-01-29 | — | — | CN | disclosed |
| US-20120115108-A1 | POLYMERIZABLE PHOSPHORIC ACID DERIVATIVES COMPRISING A POLYALICYLIC STRUCTURE ELEMENT | VOCO GMBH (DE) | 2012-05-10 | — | — | US | disclosed |
| US-20090068473-A1 | Epoxy Based Coatings | PPG B.V. (NL) | 2009-03-12 | — | — | US | disclosed |