Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ARG1 | P05089 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30969978 | 0.79 | ARG1 (0.32) | ARG1 | |
| Acrylic Acid SCHEMBL31539178 | 0.75 | ARG1 (0.31) | ARG1 | |
| SCHEMBL1830873 | 0.74 | — | — | |
| SCHEMBL10119350 | 0.73 | — | — | |
| SCHEMBL16931562 | 0.73 | — | — | |
| SCHEMBL15299822 | 0.72 | ALDH1A1 (0.34) | — | |
| SCHEMBL18127693 | 0.71 | — | — | |
| SCHEMBL1087710 | 0.71 | — | — | |
| SCHEMBL2234104 | 0.71 | — | — | |
| SCHEMBL12396642 | 0.70 | TSHR (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3443048-B1 | METHOD FOR PRODUCING ENCAPSULATED QUANTUM DOTS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2021-07-14 | — | — | EP | claimed |
| EP-3443047-B1 | CURABLE RESIN SYSTEM CONTAINING QUANTUM DOTS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2021-06-02 | — | — | EP | claimed |
| US-8535872-B2 | Thermally cured underlayer for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2013-09-17 | — | — | US | claimed |
| US-20120178871-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | DE BINOD B (US) | 2012-07-12 | — | — | US | claimed |
| US-8153346-B2 | Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2012-04-10 | — | — | US | claimed |
| US-20080206676-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC | 2008-08-28 | — | — | US | claimed |
| US-7214471-B2 | Photosensitive resin film and cured film made therefrom | JSR CORPORATION (JP) | 2007-05-08 | — | — | US | claimed |
| US-20060210912-A1 | Alkali-soluble copolymer of p-isopropenylphenol, unsaturated carboxy acid, acrylic ester, and unsaturated aliphatic polycyclic compound, especially isobornyl (meth)acrylate and tricyclo[5.2.1.02,6]decanyl (meth)acrylate; unsaturated compound; and radical polymerization initiator; used for forming bumps | JSR CORPORATION (JP) | 2006-09-21 | — | — | US | claimed |
| EP-0585457-B1 | PHOTOCURABLE ADHESIVE | JAPAN INST ADVANCED DENTISTRY (JP) | 1996-10-02 | — | — | EP | claimed |
| US-10988616-B2 | Thermosetting resin composition, cured film, substrate with cured film, and electronic component | JNC CORPORATION (JP) | 2021-04-27 | — | — | US | disclosed |
| US-10808150-B2 | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-10-20 | — | — | US | disclosed |
| US-20180208807-A1 | RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING RESIN COMPOSITION, AND SOLID-STATE IMAGING ELEMENT | RESONAC CORPORATION (JP) | 2018-07-26 | — | — | US | disclosed |
| US-9966606-B2 | Binder composition for power storage devices | JSR CORPORATION (JP) | 2018-05-08 | — | — | US | disclosed |
| US-9920227-B2 | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-03-20 | — | — | US | disclosed |
| US-20070231747-A1 | Radiation-sensitive negative resin composition | JSR CORPORATION (JP) | 2007-10-04 | — | — | US | disclosed |
| US-7214471-B2 | Photosensitive resin film and cured film made therefrom | JSR CORPORATION (JP) | 2007-05-08 | — | — | US | disclosed |
| US-20060210912-A1 | Alkali-soluble copolymer of p-isopropenylphenol, unsaturated carboxy acid, acrylic ester, and unsaturated aliphatic polycyclic compound, especially isobornyl (meth)acrylate and tricyclo[5.2.1.02,6]decanyl (meth)acrylate; unsaturated compound; and radical polymerization initiator; used for forming bumps | JSR CORPORATION (JP) | 2006-09-21 | — | — | US | disclosed |
| EP-1354897-A1 | POLYMER FOR PHOTORESIST AND RESIN COMPOSITIONS THEREFOR | Daicel Chemical Industries, Ltd. (JP) | 2003-10-22 | — | — | EP | disclosed |
| EP-1102789-A1 | MONOCYCLIC COMPOUNDS HAVING NK-2 ANTAGONIST ACTION AND COMPOSITIONS CONTAINING THEM | Menarini Ricerche S.p.A. (IT) | 2001-05-30 | — | — | EP | disclosed |
| WO-2000008046-A1 | MONOCYCLIC COMPOUNDS HAVING NK-2 ANTAGONIST ACTION AND COMPOSITIONS CONTAINING THEM | MENARINI RICERCHE S.P.A. (IT) | 2000-02-17 | — | — | WO | disclosed |