SCHEMBL22367705

SCHEMBL22367705

COC(C)CCCC(=O)O.COCCC(C)OC(C)=O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.43
TSHR P16473 2/20 0.35
CHRM2 P08172 1/20 0.35
CHRM4 P08173 1/20 0.35
CHRM1 P11229 1/20 0.35
TBXA2R P21731 1/20 0.35
GALR3 O60755 1/20 0.34
MAPT P10636 1/20 0.34
BLM P54132 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
ALOX15 P16050 1/20 0.33
FOLH1 Q04609 1/20 0.32
FAAH O00519 1/20 0.31
ENPEP Q07075 2/20 0.31
GSTK1 Q9Y2Q3 1/20 0.31
CYP1A2 P05177 1/20 0.31
GABRP O00591 1/20 0.31
GABRD O14764 1/20 0.31
GABRA1 P14867 1/20 0.31
GABRB1 P18505 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4312997 0.85 TSHR (0.45) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL8891074 0.85 TSHR (0.45) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL29808159 0.83 ALOX15 (0.39) ALDH1A1TSHRCHRM2CHRM4CHRM1
SCHEMBL29895066 0.82 ALDH1A1 (0.51) ALDH1A1TSHRALOX15FOLH1ENPEP
SCHEMBL387923 0.82 TSHR (0.46) ALDH1A1TSHRENPEPGSTK1CYP1A2
SCHEMBL27242 0.82 TSHR (0.48) ALDH1A1TSHRCHRM2CHRM4CHRM1
SCHEMBL30924920 0.81 ALDH1A1 (0.56) ALDH1A1TSHRALOX15GSTK1
SCHEMBL10599208 0.79 FFAR4 (0.47) ALDH1A1TSHRALOX15FAAHGSTK1
SCHEMBL18994011 0.79 FFAR4 (0.47) ALDH1A1TSHRALOX15FAAHGSTK1
SCHEMBL4435634 0.78 TSHR (0.45) ALDH1A1TSHRCHRM2CHRM4CHRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215318-A1 ETCHING COMPOSITION, ETCHING METHOD USING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT TOKYO OHKA KOGYO CO., LTD. (JP) 2025-07-03 US disclosed
EP-3961676-B1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-01-22 EP disclosed
WO-2023204141-A1 ETCHING COMPOSITION, ETCHING METHOD USING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 東京応化工業株式会社 2023-10-26 WO disclosed
EP-3702387-B1 PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE TOKYO OHKA KOGYO CO LTD (JP) 2023-05-10 EP disclosed
EP-3961676-A1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2022-03-02 EP disclosed
EP-3702387-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2020-09-02 EP disclosed