Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.48 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.48 |
| ▸ | CHRM4 | P08173 | 1/20 | 0.48 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.48 |
| ▸ | TBXA2R | P21731 | 1/20 | 0.48 |
| ▸ | GALR3 | O60755 | 1/20 | 0.47 |
| ▸ | MAPT | P10636 | 1/20 | 0.47 |
| ▸ | BLM | P54132 | 1/20 | 0.47 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.47 |
| ▸ | TRPV1 | Q8NER1 | 1/20 | 0.36 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.35 |
| ▸ | FAAH | O00519 | 2/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4435634 | 0.87 | TSHR (0.45) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL16241152 | 0.84 | ALDH1A1 (0.32) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL10804192 | 0.83 | TSHR (0.58) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL10796086 | 0.83 | TSHR (0.58) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL10793944 | 0.83 | TSHR (0.58) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL5190206 | 0.82 | ALOX15 (0.48) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL28300930 | 0.82 | TSHR (0.48) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL5190164 | 0.82 | ALOX15 (0.48) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL2545617 | 0.82 | ALOX15 (0.48) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL1469329 | 0.82 | ALDH1A1 (0.35) | TSHRCHRM2CHRM4CHRM1TBXA2R |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 278 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12153345-B2 | Photosensitive resin composition | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-11-26 | — | — | US | claimed |
| US-20240045326-A1 | PHOTOSENSITIVE RESIN COMPOSITION | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-02-08 | — | — | US | claimed |
| WO-2022118853-A1 | THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | 住友ベークライト株式会社 | 2022-06-09 | — | — | WO | claimed |
| US-10712661-B2 | Negative tone photosensitive compositions | PROMERUS, LLC (US) | 2020-07-14 | — | — | US | claimed |
| US-20170357156-A1 | NEGATIVE TONE PHOTOSENSITIVE COMPOSITIONS | PROMERUS, LLC (US) | 2017-12-14 | — | — | US | claimed |
| US-9176381-B2 | Positive type photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2015-11-03 | — | — | US | claimed |
| US-20150160553-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Film, and Display Device Using the Same | CHEIL INDUSTRIES INC. (KR) | 2015-06-11 | — | — | US | claimed |
| US-8921019-B2 | Positive photosensitive resin composition, and photosensitive resin layer and display device using the same | CHEIL INDUSTRIES INC. (KR) | 2014-12-30 | — | — | US | claimed |
| US-8703367-B2 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2014-04-22 | — | — | US | claimed |
| US-8568954-B2 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2013-10-29 | — | — | US | claimed |
| US-8501375-B2 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2013-08-06 | — | — | US | claimed |
| US-20120156616-A1 | Positive Photosensitive Resin Composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-06-21 | — | — | US | claimed |
| US-8198002-B2 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2012-06-12 | — | — | US | claimed |
| US-20110171578-A1 | Positive Photosensitive Resin Composition | CHEIL INDUSTRIES INC. (KR) | 2011-07-14 | — | — | US | claimed |
| US-20110159428-A1 | Positive Type Photosensitive Resin Composition | CHEIL INDUSTRIES INC. (KR) | 2011-06-30 | — | — | US | claimed |
| US-20110003248-A1 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2011-01-06 | — | — | US | claimed |
| US-20100099043-A1 | Positive Photosensitive Resin Composition | CHEIL INDUSTRIES INC. | 2010-04-22 | — | — | US | claimed |
| WO-2010035925-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | CHEIL INDUSTRIES INC. (KR) | 2010-04-01 | — | — | WO | claimed |
| WO-2009116724-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | CHEIL INDUSTRIES INC. (KR) | 2009-09-24 | — | — | WO | claimed |
| US-20250250378-A1 | CYANONORBORNENE POLYMERS FOR OIL RESISTANT PHOTOIMAGEABLE COMPOSITIONS | PROMERUS, LLC (US) | 2025-08-07 | — | — | US | disclosed |
| US-20250138422-A1 | PHOTOSENSITIVE RESIN COMPOSITION, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2025-05-01 | — | — | US | disclosed |
| US-12153345-B2 | Photosensitive resin composition | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-11-26 | — | — | US | disclosed |
| US-20240321803-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-09-26 | — | — | US | disclosed |
| US-20240272551-A1 | NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-08-15 | — | — | US | disclosed |
| US-20240045326-A1 | PHOTOSENSITIVE RESIN COMPOSITION | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-02-08 | — | — | US | disclosed |
| WO-2023243593-A1 | RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED FILM, SUBSTRATE WITH MULTILAYER FILM, METHOD FOR MANUFACTURING SUBSTRATE WITH PATTERN, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND METHOD FOR MANUFACTURING RESIN COMPOSITION | セントラル硝子株式会社 | 2023-12-21 | — | — | WO | disclosed |
| WO-2023204141-A1 | ETCHING COMPOSITION, ETCHING METHOD USING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | 東京応化工業株式会社 | 2023-10-26 | — | — | WO | disclosed |
| CN-110989294-B | Photosensitive resin composition, photosensitive resin layer, and electronic device | 三星SDI株式会社 | 2023-08-01 | — | — | CN | disclosed |
| US-20230096472-A1 | METHOD FOR MANUFACTURING PHOTOSENSITIVE RESIN COMPOSITION | SUMITOMO BAKELITE CO., LTD. (JP) | 2023-03-30 | — | — | US | disclosed |
| WO-2023021688-A1 | PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE | 住友ベークライト株式会社 | 2023-02-23 | — | — | WO | disclosed |
| WO-2022270529-A1 | NEGATIVE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | 住友ベークライト株式会社 | 2022-12-29 | — | — | WO | disclosed |
| WO-2022270527-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE POLMER, CURED FILM AND SEMICONDUCTOR DEVICE | 住友ベークライト株式会社 | 2022-12-29 | — | — | WO | disclosed |
| WO-2022172988-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | 住友ベークライト株式会社 | 2022-08-18 | — | — | WO | disclosed |
| US-11309345-B2 | Protective film composition and method of manufacturing semiconductor package by using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2022-04-19 | — | — | US | disclosed |
| US-11287313-B2 | Detecting compositions and method of using same | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-03-29 | — | — | US | disclosed |
| WO-2021241581-A1 | PHOTOSENSITIVE RESIN COMPOSITION | 住友ベークライト株式会社 | 2021-12-02 | — | — | WO | disclosed |
| US-11048168-B2 | Permanent dielectric compositions containing photoacid generator and base | PROMERUS, LLC (US) | 2021-06-29 | — | — | US | disclosed |
| US-20210057480-A1 | PROTECTIVE FILM COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING THE SAME | DONGJIN SEMICHEM CO., LTD. (KR) | 2021-02-25 | — | — | US | disclosed |
| US-10854666-B2 | Protective film composition and method of manufacturing semiconductor package by using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2020-12-01 | — | — | US | disclosed |
| WO-2020226052-A1 | PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE | 住友ベークライト株式会社 | 2020-11-12 | — | — | WO | disclosed |
| US-10781373-B2 | Photoalignment film forming composition and LCD devices derived therefrom | PROMERUS, LLC (US) | 2020-09-22 | — | — | US | disclosed |
| CN-111624852-A | Photosensitive resin composition and method for etching glass substrate | 东京应化工业株式会社 | 2020-09-04 | — | — | CN | disclosed |
| US-10712661-B2 | Negative tone photosensitive compositions | PROMERUS, LLC (US) | 2020-07-14 | — | — | US | disclosed |
| CN-110989294-A | Photosensitive resin composition, photosensitive resin layer, and electronic device | 三星SDI株式会社 | 2020-04-10 | — | — | CN | disclosed |
| WO-2020067638-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM USING SAME, AND ELECTRONIC DEVICE | 삼성에스디아이 주식회사 | 2020-04-02 | — | — | WO | disclosed |
| US-10591818-B2 | Nadic anhydride polymers and photosensitive compositions derived therefrom | PROMERUS, LLC (US) | 2020-03-17 | — | — | US | disclosed |
| US-20190339617-A1 | PERMANENT DIELECTRIC COMPOSITIONS CONTAINING PHOTOACID GENERATOR AND BASE | PROMERUS, LLC (US) | 2019-11-07 | — | — | US | disclosed |
| US-10429734-B2 | Permanent dielectric compositions containing photoacid generator and base | PROMERUS, LLC (US) | 2019-10-01 | — | — | US | disclosed |
| US-20190245003-A1 | PROTECTIVE FILM COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING THE SAME | DONGJIN SEMICHEM CO., LTD. (KR) | 2019-08-08 | — | — | US | disclosed |
| US-20190195686-A1 | Detecting Compositions and Method of Using Same | RESONAC CORPORATION (JP) | 2019-06-27 | — | — | US | disclosed |
| US-10303057-B2 | Fluorine free photopatternable phenol functional group containing polymer compositions | PROMERUS, LLC (US) | 2019-05-28 | — | — | US | disclosed |
| US-20180329299-A1 | FLUORINE FREE PHOTOPATTERNABLE PHENOL FUNCTIONAL GROUP CONTAINING POLYMER COMPOSITIONS | SUMITOMO BAKELITE CO., LTD. (JP) | 2018-11-15 | — | — | US | disclosed |
| US-10054854-B2 | Fluorine free photopatternable phenol functional group containing polymer compositions | PROMERUS, LLC (US) | 2018-08-21 | — | — | US | disclosed |
| WO-2018148479-A1 | PHOTOALIGNMENT FILM FORMING COMPOSITION AND LCD DEVICES DERIVED THEREFROM | PROMERUS, LLC (US) | 2018-08-16 | — | — | WO | disclosed |
| US-20180223190-A1 | PHOTOALIGNMENT FILM FORMING COMPOSITION AND LCD DEVICES DERIVED THEREFROM | PROMERUS, LLC (US) | 2018-08-09 | — | — | US | disclosed |
| US-9944730-B2 | Polymers derived from norbornadiene and maleic anhydride and use thereof | PROMERUS, LLC (US) | 2018-04-17 | — | — | US | disclosed |
| US-9932432-B2 | Polymers of maleimide and cycloolefinic monomers as permanent dielectric materials | PROMERUS, LLC (US) | 2018-04-03 | — | — | US | disclosed |
| US-20180044449-A1 | POLYMERS DERIVED FROM NORBORNADIENE AND MALEIC ANHYDRIDE AND USE THEREOF | PROMERUS, LLC (US) | 2018-02-15 | — | — | US | disclosed |
| US-20180030189-A1 | NADIC ANHYDRIDE POLYMERS AND PHOTOSENSITIVE COMPOSITIONS DERIVED THEREFROM | PROMERUS, LLC (US) | 2018-02-01 | — | — | US | disclosed |
| US-9874813-B2 | Photosensitive resin material and resin film | SUMITOMO BAKELITE CO., LTD. (JP) | 2018-01-23 | — | — | US | disclosed |
| US-20170357156-A1 | NEGATIVE TONE PHOTOSENSITIVE COMPOSITIONS | PROMERUS, LLC (US) | 2017-12-14 | — | — | US | disclosed |
| US-9834627-B2 | Polymers derived from norbornadiene and maleic anhydride and use thereof | PROMERUS, LLC (US) | 2017-12-05 | — | — | US | disclosed |
| WO-2017117483-A1 | POLYMERS DERIVED FROM NORBORNADIENE AND MALEIC ANHYDRIDE AND USE THEREOF | PROMERUS, LLC (US) | 2017-07-06 | — | — | WO | disclosed |
| US-20170190810-A1 | POLYMERS DERIVED FROM NORBORNADIENE AND MALEIC ANHYDRIDE AND USE THEREOF | PROMERUS, LLC (US) | 2017-07-06 | — | — | US | disclosed |
| WO-2017095829-A2 | PERMANENT DIELECTRIC COMPOSITIONS CONTAINING PHOTOACID GENERATOR AND BASE | PROMERUS, LLC (US) | 2017-06-08 | — | — | WO | disclosed |
| US-20170153546-A1 | PERMANENT DIELECTRIC COMPOSITIONS CONTAINING PHOTOACID GENERATOR AND BASE | PROMERUS, LLC (US) | 2017-06-01 | — | — | US | disclosed |
| US-20170097566-A1 | FLUORINE FREE PHOTOPATTERNABLE PHENOL FUNCTIONAL GROUP CONTAINING POLYMER COMPOSITIONS | SUMITOMO BAKELITE CO., LTD. (JP) | 2017-04-06 | — | — | US | disclosed |
| US-9562124-B2 | Thermo-oxidatively stable, side chain polyether functionalized polynorbornenes for microelectronic and optoelectronic devices and assemblies thereof | PROMERUS, LLC (US) | 2017-02-07 | — | — | US | disclosed |
| US-20160326292-A1 | POLYMERS OF MALEIMIDE AND CYCLOOLEFINIC MONOMERS AS PERMANENT DIELECTRIC MATERIALS | SUMITOMO BAKELITE CO., LTD. (JP) | 2016-11-10 | — | — | US | disclosed |
| US-20160319060-A1 | Thermo-oxidatively Stable, Side Chain Polyether Functionalized Polynorbornenes for Microelectronic and Optoelectronic Devices and Assemblies Thereof | PROMERUS, LLC (US) | 2016-11-03 | — | — | US | disclosed |
| US-9482943-B2 | Positive photosensitive resin composition, and photosensitive resin film and display device prepared by using the same | CHEIL INDUSTRIES INC. (KR) | 2016-11-01 | — | — | US | disclosed |
| US-9465289-B2 | Photosensitive resin composition for display device insulation film, and display device insulation film and display device using same | CHEIL INDUSTRIES INC. (KR) | 2016-10-11 | — | — | US | disclosed |
| US-9425404-B2 | Thermo-oxidatively stable, side chain polyether functionalized polynorbornenes for microelectronic and optoelectronic devices and assemblies thereof | PROMERUS, LLC (US) | 2016-08-23 | — | — | US | disclosed |
| EP-2280309-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM | SUMITOMO BAKELITE CO (JP) | 2016-02-24 | — | — | EP | disclosed |
| US-9268221-B2 | Positive photosensitive resin composition, photosensitive resin layer prepared by using the same, and semiconductor device including the photosensitive resin layer | CHEIL INDUSTRIES INC. (KR) | 2016-02-23 | — | — | US | disclosed |
| CN-105339340-A | Base generator, base-reactive composition containing said base generator, and base generation method | WAKO PURE CHEM IND LTD | 2016-02-17 | — | — | CN | disclosed |
| US-9261782-B2 | Maleimide containing cycloolefinic polymers and applications thereof | PROMERUS, LLC (US) | 2016-02-16 | — | — | US | disclosed |
| US-9256118-B2 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2016-02-09 | — | — | US | disclosed |
| US-20150316845-A1 | PHOTOSENSITIVE RESIN MATERIAL AND RESIN FILM | SUMITOMO BAKELITE CO., LTD. (JP) | 2015-11-05 | — | — | US | disclosed |
| US-9176381-B2 | Positive type photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2015-11-03 | — | — | US | disclosed |
| EP-1491952-B1 | Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device | SUMITOMO BAKELITE CO (JP) | 2015-10-07 | — | — | EP | disclosed |
| US-9134608-B2 | Positive photosensitive resin composition, method for producing patterned cured film and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2015-09-15 | — | — | US | disclosed |
| US-20150185605-A1 | Photosensitive Resin Composition for Display Device Insulation Film, and Display Device Insulation Film and Display Device Using Same | CHEIL INDUSTRIES INC. (KR) | 2015-07-02 | — | — | US | disclosed |
| US-20150160553-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Film, and Display Device Using the Same | CHEIL INDUSTRIES INC. (KR) | 2015-06-11 | — | — | US | disclosed |
| US-9040213-B2 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film | CHEIL INDUSTRIES INC. (KR) | 2015-05-26 | — | — | US | disclosed |
| US-9023559-B2 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film | CHEIL INDUSTRIES INC. (KR) | 2015-05-05 | — | — | US | disclosed |
| US-9005876-B2 | Positive photosensitive resin composition for spray coating and method for producing through electrode using the same | SUMITOMO BAKELITE CO., LTD. (JP) | 2015-04-14 | — | — | US | disclosed |
| US-8987342-B2 | Photosensitive resin composition for insulating film of display device, insulating film using the same, and display device using the same | CHEIL INDUSTRIES INC. (KR) | 2015-03-24 | — | — | US | disclosed |
| US-8986923-B2 | Aqueous base-developable negative-tone films based on functionalized norbornene polymers | PROMERUS, LLC (US) | 2015-03-24 | — | — | US | disclosed |
| US-20150050594-A1 | Positive Photosensitive Resin Composition, and Photosensitive Resin Film and Display Device Prepared by Using the Same | CHEIL INDUSTRIES INC. (KR) | 2015-02-19 | — | — | US | disclosed |
| US-8956790-B2 | Positive photosensitive resin composition, and organic insulator film for display device and display device fabricated using the same | CHEIL INDUSTRIES INC. (KR) | 2015-02-17 | — | — | US | disclosed |
| US-8921019-B2 | Positive photosensitive resin composition, and photosensitive resin layer and display device using the same | CHEIL INDUSTRIES INC. (KR) | 2014-12-30 | — | — | US | disclosed |
| US-8871422-B2 | Negative-type photosensitive resin composition, pattern forming method and electronic parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2014-10-28 | — | — | US | disclosed |
| EP-2196850-B1 | CURED FILM OBTAINED USING A POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | SUMITOMO BAKELITE CO (JP) | 2014-10-08 | — | — | EP | disclosed |
| US-8841064-B2 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film | CHEIL INDUSTRIES INC. (KR) | 2014-09-23 | — | — | US | disclosed |
| US-8815489-B2 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film | CHEIL INDUSTRIES INC. (KR) | 2014-08-26 | — | — | US | disclosed |
| US-8785103-B2 | Photosensitive novolac resin, positive photosensitive resin composition including same, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film | CHEIL INDUSTRIES INC. (KR) | 2014-07-22 | — | — | US | disclosed |
| US-20140186768-A1 | Photosensitive Resin Composition for Insulating Film of Display Device, Insulating Film Using the Same, and Display Device Using the Same | CHEIL INDUSTRIES INC. (KR) | 2014-07-03 | — | — | US | disclosed |
| US-20140178816-A1 | Positive Photosensitive Resin Composition, and Organic Insulator Film for Display Device and Display Device Fabricated Using the Same | CHEIL INDUSTRIES INC. (KR) | 2014-06-26 | — | — | US | disclosed |
| CN-101727006-B | Positive type photosensitive resin composition | CHEIL IND INC | 2014-06-25 | — | — | CN | disclosed |
| US-8758977-B2 | Negative-type photosensitive resin composition, pattern forming method and electronic parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-06-24 | — | — | US | disclosed |
| US-20140170562-A1 | Positive Photosensitive Resin Composition | SAMSUNG SDI CO., LTD. (KR) | 2014-06-19 | — | — | US | disclosed |
| US-8735029-B2 | Positive photosensitive resin composition, and display device and organic light emitting device using the same | CHEIL INDUSTRIES INC. (KR) | 2014-05-27 | — | — | US | disclosed |
| CN-102566274-B | Positive photosensitive resin composition, photosensitive resin film prepared by using same, and semiconductor device including photosensitive resin film | CHEIL IND INC | 2014-05-07 | — | — | CN | disclosed |
| EP-1965256-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, AND USE OF THE SAME FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A DISPLAY | SUMITOMO BAKELITE CO (JP) | 2014-04-30 | — | — | EP | disclosed |
| US-20140113448-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND METHOD FOR PRODUCING THROUGH ELECTRODE USING THE SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-04-24 | — | — | US | disclosed |
| US-8703367-B2 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2014-04-22 | — | — | US | disclosed |
| US-8697320-B2 | Phenol compounds and positive photosensitive resin composition including the same | CHEIL INDUSTRIES INC. (KR) | 2014-04-15 | — | — | US | disclosed |
| US-20140087293-A1 | MALEIMIDE CONTAINING CYCLOOLEFINIC POLYMERS AND APPLICATIONS THEREOF | PROMERUS, LLC (US) | 2014-03-27 | — | — | US | disclosed |
| US-20140038112-A1 | AQUEOUS BASE-DEVELOPABLE NEGATIVE-TONE FILMS BASED ON FUNCTIONALIZED NORBORNENE POLYMERS | PROMERUS, LLC (US) | 2014-02-06 | — | — | US | disclosed |
| US-8604113-B2 | Photosensitive resin composition, insulating film, protective film, and electronic equipment | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-12-10 | — | — | US | disclosed |
| US-8592131-B2 | Ortho-nitrobenzyl ester compound and positive type photosensitive resin composition including the same | CHEIL INDUSTRIES INC. (KR) | 2013-11-26 | — | — | US | disclosed |
| US-8580477-B2 | Aqueous base-developable negative-tone films based on functionalized norbornene polymers | PROMERUS LLC (US) | 2013-11-12 | — | — | US | disclosed |
| EP-2306244-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM AND USE OF THE CURED FILM | SUMITOMO BAKELITE CO (JP) | 2013-11-06 | — | — | EP | disclosed |
| US-8568954-B2 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2013-10-29 | — | — | US | disclosed |
| US-20130280654-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM | SUMITOMO BAKELITE CO (JP) | 2013-10-24 | — | — | US | disclosed |
| EP-2639638-A1 | Positive photosensitive resin composition, and semiconductor device and display therewith | Sumitomo Bakelite Co., Ltd. (JP) | 2013-09-18 | — | — | EP | disclosed |
| US-8530119-B2 | Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-09-10 | — | — | US | disclosed |
| US-20130207215-A1 | SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE | SONY CORPORATION (JP) | 2013-08-15 | — | — | US | disclosed |
| US-8501375-B2 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2013-08-06 | — | — | US | disclosed |
| WO-2013109529-A1 | THERMO-OXIDATIVELY STABLE, SIDE CHAIN POLYETHER FUNCTIONALIZED POLYNORBORNENES FOR MICROELECTRONIC AND OPTOELECTRONIC DEVICES AND ASSEMBLIES THEREOF | PROMERUS LLC (US) | 2013-07-25 | — | — | WO | disclosed |
| US-8492469-B2 | Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-07-23 | — | — | US | disclosed |
| US-20130181199-A1 | Thermo-oxidatively Stable, Side Chain Polyether Functionalized Polynorbornenes for Microelectronic and Optoelectronic Devices and Assemblies Thereof | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-07-18 | — | — | US | disclosed |
| US-20130171568-A1 | Positive Photosensitive Resin Composition, and Photosensitive Resin Layer and Display Device Using the Same | CHEIL INDUSTRIES INC. (KR) | 2013-07-04 | — | — | US | disclosed |
| US-20130171563-A1 | Photosensitive Novolac Resin, Positive Photosensitive Resin Composition Including Same, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film | CHEIL INDUSTRIES INC. (KR) | 2013-07-04 | — | — | US | disclosed |
| WO-2013100298-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | CHEIL INDUSTRIES INC. (KR) | 2013-07-04 | — | — | WO | disclosed |
| US-20130171564-A1 | Positive Photosensitive Resin Composition, and Display Device and Organic Light Emitting Device Using the Same | CHEIL INDUSTRIES INC. (KR) | 2013-07-04 | — | — | US | disclosed |
| US-20130164682-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film | CHEIL INDUSTRIES INC. (KR) | 2013-06-27 | — | — | US | disclosed |
| US-20130137036-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film | CHEIL INDUSTRIES INC. (KR) | 2013-05-30 | — | — | US | disclosed |
| US-8440734-B2 | Positive photosensitive resin composition, cured film, protecting film, insulating film, and semiconductor device and display device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2013-05-14 | — | — | US | disclosed |
| US-20130108963-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING PHOTOSENSITIVE COMPOSITION | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-05-02 | — | — | US | disclosed |
| US-20130108967-A1 | METHOD FOR FORMING CURED FILM | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-05-02 | — | — | US | disclosed |
| US-20130100324-A1 | METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP ELEMENT, SOLID-STATE IMAGE PICKUP ELEMENT, IMAGE PICKUP DEVICE, ELECTRONIC APPARATUS, SOLID-STATE IMAGE PICKUP DEVICE, AND METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE | SONY CORPORATION (JP) | 2013-04-25 | — | — | US | disclosed |
| CN-103066082-A | Method of manufacturing solid-state image pickup element, solid-state image pickup element, image pickup device, electronic apparatus, solid-state image pickup device, and method of manufacturing solid-state image pickup device | SONY CORP | 2013-04-24 | — | — | CN | disclosed |
| US-8420287-B2 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2013-04-16 | — | — | US | disclosed |
| US-8420291-B2 | Positive photosensitive resin composition, method for forming pattern, electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2013-04-16 | — | — | US | disclosed |
| US-8373786-B2 | Solid-state imaging device, manufacturing method thereof, and electronic device | SONY CORPORATION (JP) | 2013-02-12 | — | — | US | disclosed |
| US-8367283-B2 | Positive photosensitive resin composition, cured film, protecting film, insulating film and semiconductor and display devices using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2013-02-05 | — | — | US | disclosed |
| US-20130022913-A1 | METHOD FOR PRODUCING POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND FILTER | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-01-24 | — | — | US | disclosed |
| EP-2077291-B1 | BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING THE SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PROTECTIVE FILM, INTERLAYER DIELECTRIC, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT | SUMITOMO BAKELITE CO (JP) | 2013-01-09 | — | — | EP | disclosed |
| US-20120288798-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM AND ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2012-11-15 | — | — | US | disclosed |
| US-8309280-B2 | Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-11-13 | — | — | US | disclosed |
| US-8269358-B2 | Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2012-09-18 | — | — | US | disclosed |
| US-20120171610-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film | CHEIL INDUSTRIES INC. (KR) | 2012-07-05 | — | — | US | disclosed |
| US-20120171614-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film | CHEIL INDUSTRIES INC. (KR) | 2012-07-05 | — | — | US | disclosed |
| US-20120171609-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Layer Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Layer | CHEIL INDUSTRIES INC. (KR) | 2012-07-05 | — | — | US | disclosed |
| US-20120156622-A1 | Ortho-Nitrobenzyl Ester Compound and Positive Type Photosensitive Resin Composition Including the Same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-06-21 | — | — | US | disclosed |
| US-20120156616-A1 | Positive Photosensitive Resin Composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-06-21 | — | — | US | disclosed |
| US-20120156614-A1 | Novel Phenol Compounds and Positive Photosensitive Resin Composition Including the Same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-06-21 | — | — | US | disclosed |
| US-8198006-B2 | Process for producing semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-06-12 | — | — | US | disclosed |
| US-8198002-B2 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2012-06-12 | — | — | US | disclosed |
| US-20120142879-A1 | COMPOSITION FOR FILM FORMATION, INSULATING FILM AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2012-06-07 | — | — | US | disclosed |
| EP-2457932-A1 | COMPOSITION FOR FILM FORMATION, INSULATING FILM, AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company Limited (JP) | 2012-05-30 | — | — | EP | disclosed |
| US-8178631-B2 | Resin composition, varnish, resin film and semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2012-05-15 | — | — | US | disclosed |
| EP-2000510-B1 | RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM | SUMITOMO BAKELITE CO (JP) | 2012-05-02 | — | — | EP | disclosed |
| US-20120097640-A1 | RESIN COMPOSITION FOR PATTERN FORMATION, PATTERN FORMATION METHOD AND PROCESS FOR PRODUCING LIGHT-EMITTING ELEMENT | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2012-04-26 | — | — | US | disclosed |
| US-20120100484-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INTERLAYER INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY ELEMENT USING THE SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-04-26 | — | — | US | disclosed |
| EP-2083326-B1 | PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM, PROTECTIVE FILM, AND ELECTRONIC EQUIPMENT | SUMITOMO BAKELITE CO (JP) | 2012-01-11 | — | — | EP | disclosed |
| EP-2381308-A2 | Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device | SUMITOMO BAKELITE CO., LTD. (JP) | 2011-10-26 | — | — | EP | disclosed |
| US-20110200937-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND METHOD FOR PRODUCING THROUGH ELECTRODE USING THE SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2011-08-18 | — | — | US | disclosed |
| EP-2345933-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND METHOD FOR PRODUCING THROUGH ELECTRODE USING SAME | Sumitomo Bakelite Co., Ltd. (JP) | 2011-07-20 | — | — | EP | disclosed |
| US-20110171578-A1 | Positive Photosensitive Resin Composition | CHEIL INDUSTRIES INC. (KR) | 2011-07-14 | — | — | US | disclosed |
| US-20110171436-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2011-07-14 | — | — | US | disclosed |
| US-20110159428-A1 | Positive Type Photosensitive Resin Composition | CHEIL INDUSTRIES INC. (KR) | 2011-06-30 | — | — | US | disclosed |
| US-20110159432-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTING FILM, INSULATING FILM AND SEMICONDUCTOR AND DISPLAY DEVICES USING THE SAME | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-06-30 | — | — | US | disclosed |
| US-20110136952-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM | SUMITOMO BAKELITE CO., LTD. (JP) | 2011-06-09 | — | — | US | disclosed |
| US-20110118375-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTING FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-05-19 | — | — | US | disclosed |
| US-20110111346-A1 | Positive Photosensitive Resin Composition | CHEIL INDUSTRIES INC. (KR) | 2011-05-12 | — | — | US | disclosed |
| EP-2306244-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATION FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING SAME | Sumitomo Bakelite Company Limited (JP) | 2011-04-06 | — | — | EP | disclosed |
| US-20110070543-A1 | Aqueous Base-Developable Negative-Tone Films Based On Functionalized Norbornene Polymers | PROMERUS LLC (US) | 2011-03-24 | — | — | US | disclosed |
| EP-2280309-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM | Sumitomo Bakelite Co., Ltd. (JP) | 2011-02-02 | — | — | EP | disclosed |
| US-20110003248-A1 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2011-01-06 | — | — | US | disclosed |
| US-7863347-B2 | Resin composition, varnish, resin film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-01-04 | — | — | US | disclosed |
| US-7858721-B2 | Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films | PROMERUS LLC (US) | 2010-12-28 | — | — | US | disclosed |
| US-20100258336-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2010-10-14 | — | — | US | disclosed |
| US-20100239977-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-09-23 | — | — | US | disclosed |
| US-7781131-B2 | Positive photosensitive resin composition, cured layer , protecting layer, insulating layer and semiconductor device and display therewith | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-08-24 | — | — | US | disclosed |
| EP-1331517-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR ITS PREPARATION, AND SEMICONDUCTOR DEVICES | SUMITOMO BAKELITE CO (JP) | 2010-08-18 | — | — | EP | disclosed |
| US-20100196808-A1 | Positive photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device therewith | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-08-05 | — | — | US | disclosed |
| US-20100193971-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING, METHOD FOR FORMING CURED FILM USING THE SAME, CURED FILM, AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2010-08-05 | — | — | US | disclosed |
| US-20100183985-A1 | PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-07-22 | — | — | US | disclosed |
| US-20100159217-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERNS, AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD (JP) | 2010-06-24 | — | — | US | disclosed |
| EP-2196850-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Co., Ltd. (JP) | 2010-06-16 | — | — | EP | disclosed |
| CN-101727006-A | Positive type photosensitive resin composition | CHEIL IND INC | 2010-06-09 | — | — | CN | disclosed |
| US-20100099043-A1 | Positive Photosensitive Resin Composition | CHEIL INDUSTRIES INC. | 2010-04-22 | — | — | US | disclosed |
| WO-2010041795-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | CHEIL INDUSTRIES INC. (KR) | 2010-04-15 | — | — | WO | disclosed |
| EP-2175319-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING, METHOD FOR FORMING CURED FILM USING THE SAME, CURED FILM AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company Limited (JP) | 2010-04-14 | — | — | EP | disclosed |
| WO-2010035925-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | CHEIL INDUSTRIES INC. (KR) | 2010-04-01 | — | — | WO | disclosed |
| US-7687208-B2 | Positive photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2010-03-30 | — | — | US | disclosed |
| US-20100076156-A1 | PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM, PROTECTIVE FILM, AND ELECTRONIC EQUIPMENT | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-03-25 | — | — | US | disclosed |
| US-7678514-B2 | Positive-type photosensitive resin composition, cured film, protecting film, insulating film and semiconductor device and display device using these films | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-03-16 | — | — | US | disclosed |
| US-20100062273-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME | SUMITOMO BAKELITE CO., LTD (JP) | 2010-03-11 | — | — | US | disclosed |
| US-7674566-B2 | Positive photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2010-03-09 | — | — | US | disclosed |
| EP-2159830-A1 | PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE | Sumitomo Bakelite Co., Ltd. (JP) | 2010-03-03 | — | — | EP | disclosed |
| US-20100044888-A1 | BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2010-02-25 | — | — | US | disclosed |
| US-7652125-B2 | Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2010-01-26 | — | — | US | disclosed |
| US-20090324831-A1 | CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING CURED COATING USING THE SAME | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2009-12-31 | — | — | US | disclosed |
| US-20090303359-A1 | SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE | SONY CORPORATION (JP) | 2009-12-10 | — | — | US | disclosed |
| EP-2131238-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE CURED FILM | Sumitomo Bakelite Co., Ltd. (JP) | 2009-12-09 | — | — | EP | disclosed |
| EP-2113810-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME, AND DISPLAY DEVICE | Sumitomo Bakelite Co., Ltd. (JP) | 2009-11-04 | — | — | EP | disclosed |
| US-7608928-B2 | Laminated body and semiconductor device | JSR CORPORATION (JP) | 2009-10-27 | — | — | US | disclosed |
| WO-2009116724-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | CHEIL INDUSTRIES INC. (KR) | 2009-09-24 | — | — | WO | disclosed |
| US-20090233228-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | ASAHI KASEI EMD CORPORATION (JP) | 2009-09-17 | — | — | US | disclosed |
| US-20090214860-A1 | Resin Composition, Varnish, Resin Film and Semiconductor Device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2009-08-27 | — | — | US | disclosed |
| US-20090215976-A1 | Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films | PROMERUS LLC | 2009-08-27 | — | — | US | disclosed |
| US-20090202794-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | ASAHI KASEI EMD CORPORATION (JP) | 2009-08-13 | — | — | US | disclosed |
| EP-2083326-A1 | PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM, PROTECTIVE FILM, AND ELECTRONIC EQUIPMENT | Sumitomo Bakelite Company, Ltd. (JP) | 2009-07-29 | — | — | EP | disclosed |
| US-20090181224-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2009-07-16 | — | — | US | disclosed |
| EP-2077291-A1 | BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING THE SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PROTECTIVE FILM, INTERLAYER DIELECTRIC, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT | Sumitomo Bakelite Company, Ltd. (JP) | 2009-07-08 | — | — | EP | disclosed |
| US-20090166818-A1 | Positive Photosensitive Resin Composition, and Semiconductor Device and Display Therewith | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2009-07-02 | — | — | US | disclosed |
| US-20090170026-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED LAYER, PROTECTING LAYER, INSULATING LAYER AND SEMICONDUCTOR DEVICE AND DISPLAY THEREWITH | SUMITOMO BAKELITE CO., LTD. (JP) | 2009-07-02 | — | — | US | disclosed |
| US-20090118431-A1 | RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE COMPANY, LTD (JP) | 2009-05-07 | — | — | US | disclosed |
| EP-2056163-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2009-05-06 | — | — | EP | disclosed |
| US-7524594-B2 | Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films | PROMERUS LLC (US) | 2009-04-28 | — | — | US | disclosed |
| EP-2048196-A1 | CURABLE RESIN COMPOSITION AND METHOD FOR FORMING CURED COATING FILM | Daicel Chemical Industries, Ltd. (JP) | 2009-04-15 | — | — | EP | disclosed |
| US-20090068584-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED LAYER, PROTECTING LAYER, INSULATING LAYER AND SEMICONDUCTOR DEVICE AND DISPLAY THEREWITH | SUMITOMO BAKELITE CO., LTD. (JP) | 2009-03-12 | — | — | US | disclosed |
| EP-2000510-A1 | RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM | Sumitomo Bakelite Company, Ltd. (JP) | 2008-12-10 | — | — | EP | disclosed |
| EP-1778759-B1 | PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES | PROMERUS LLC (US) | 2008-11-12 | — | — | EP | disclosed |
| US-20080255335-A1 | Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same | SUMITOMO BAKELITE COMPANY LTD. (JP) | 2008-10-16 | — | — | US | disclosed |
| EP-1965256-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE AND DISPLAY USING SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2008-09-03 | — | — | EP | disclosed |
| US-7416822-B2 | Resin and resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2008-08-26 | — | — | US | disclosed |
| EP-1953181-A1 | RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Ltd. (JP) | 2008-08-06 | — | — | EP | disclosed |
| US-7368205-B2 | Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device | SUMITOMO BAKELITE CO., LTD. (JP) | 2008-05-06 | — | — | US | disclosed |
| US-7368216-B2 | Photosensitive resin composition and manufacturing method of semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2008-05-06 | — | — | US | disclosed |
| US-7361445-B2 | Mixture of alkali soluble resin, quinonediazide compound and alcohol | SUMITOMO BAKELITE COMPANY (JP) | 2008-04-22 | — | — | US | disclosed |
| US-20080044664-A1 | Laminated Body and Semiconductor Drive | JSR CORPORATION (JP) | 2008-02-21 | — | — | US | disclosed |
| EP-1852743-A1 | Method for manufacturing photosensitive resin composition and relief pattern using the same | FUJIFILM Corporation (JP) | 2007-11-07 | — | — | EP | disclosed |
| US-20070254243-A1 | METHOD FOR MANUFACTURING PHOTOSENSITIVE RESIN COMPOSITION AND RELIEF PATTERN USING THE SAME | FUJIFILM CORPORATION (JP) | 2007-11-01 | — | — | US | disclosed |
| EP-1813637-A1 | RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME | Sumitomo Bakelite Company, Limited (JP) | 2007-08-01 | — | — | EP | disclosed |
| US-20070172753-A1 | Photosensitive resin composition and manufacturing method of semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2007-07-26 | — | — | US | disclosed |
| EP-1811340-A2 | Photosensitive resin composition and manufacturing method of semiconductor device using the same | Fujifilm Corporation (JP) | 2007-07-25 | — | — | EP | disclosed |
| US-20070166643-A1 | Photosensitive resin composition and manufacturing method of semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2007-07-19 | — | — | US | disclosed |
| US-20070154843-A1 | Resin and resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-07-05 | — | — | US | disclosed |
| US-7238455-B2 | Mixture of alkali soluble resin, quinonediazide compound and alcohol | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2007-07-03 | — | — | US | disclosed |
| EP-1778759-A1 | PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES | Promerus, LLC (US) | 2007-05-02 | — | — | EP | disclosed |
| EP-1760774-A1 | LAMINATED BODY AND SEMICONDUCTOR DEVICE | JSR Corporation (JP) | 2007-03-07 | — | — | EP | disclosed |
| EP-1333050-B1 | MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE CO (JP) | 2006-12-27 | — | — | EP | disclosed |
| EP-1707588-A1 | RESIN AND RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2006-10-04 | — | — | EP | disclosed |
| US-7049371-B2 | Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2006-05-23 | — | — | US | disclosed |
| WO-2006017035-A1 | PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES | PROMERUS LLC (US) | 2006-02-16 | — | — | WO | disclosed |
| US-20060008734-A1 | Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films | SUMITOMO BAKELITE CO., LTD. (JP) | 2006-01-12 | — | — | US | disclosed |
| US-20050266334-A1 | Mixture of alkali soluble resin, quinonediazide compound and alcohol | FUJI JUKOGYO KABUSHIKI KAISHA (JP) | 2005-12-01 | — | — | US | disclosed |
| US-6927013-B2 | Positive photosensitive resin compositions and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2005-08-09 | — | — | US | disclosed |
| US-6908717-B2 | Positive photosensitive resin composition, process for its preparation, and semiconductor devices | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2005-06-21 | — | — | US | disclosed |
| EP-1513014-A2 | Polyamide resin, positive-working photosensitive resin composition, and method for producing pattern-formed resin film | SUMITOMO BAKELITE CO., LTD. (JP) | 2005-03-09 | — | — | EP | disclosed |
| US-20050031994-A1 | Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device | SUMITOMO BAKELITE CO., LTD. (JP) | 2005-02-10 | — | — | US | disclosed |
| US-20040259020-A1 | Mixture of alkali soluble resin, quinonediazide compound and alcohol | SUMITOMO BAKELITE CO., LTD. (JP) | 2004-12-23 | — | — | US | disclosed |
| US-20040146801-A1 | Positive photosensitive resin compositions and semiconductor device | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2004-07-29 | — | — | US | disclosed |
| EP-0997488-B1 | Polybenzoxazole resin and precursor thereof | SUMITOMO BAKELITE CO (JP) | 2004-04-28 | — | — | EP | disclosed |
| EP-1400849-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2004-03-24 | — | — | EP | disclosed |
| US-20040023147-A1 | Positive photosensitive resin composition, process for its preparation, and semiconductor devices | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2004-02-05 | — | — | US | disclosed |
| US-20040002572-A1 | Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2004-01-01 | — | — | US | disclosed |
| EP-1195811-B1 | SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO (JP) | 2003-10-15 | — | — | EP | disclosed |
| US-6607865-B2 | Mixture of polyamide and sensitizer | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2003-08-19 | — | — | US | disclosed |
| EP-1333050-A1 | MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2003-08-06 | — | — | EP | disclosed |
| EP-1331517-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR ITS PREPARATION, AND SEMICONDUCTOR DEVICES | SUMITOMO BAKELITE CO., LTD. (JP) | 2003-07-30 | — | — | EP | disclosed |
| US-6576381-B1 | Polybenzoxazole resin film for chip protection; positive photosensitive polyamide; photosensitive diazoquinone compound; flip chips | SUMITOMO BAKELITE CO., LTD. (JP) | 2003-06-10 | — | — | US | disclosed |
| US-20020119389-A1 | Positive photosensitive resin composition | SUMITOMO BAKELITE CO., LTD. (JP) | 2002-08-29 | — | — | US | disclosed |
| US-6436593-B1 | A POLYIMIDE PRECURSOR OR A POLYOXAZOLE PRECURSOR HAVING A GROUP REPRESENTED BY--OR, ACID GENERATION WITH RADIATION | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2002-08-20 | — | — | US | disclosed |
| US-6380271-B1 | MIXING A POLYBENZOXAZOLE PRECURSOR OR A POLYBENZOXAZOLE RESIN WITH AN OLIGOMER, FORMING FILM FROM RESULTING MIXTURE, HEATING FILM IN NITROGEN CONTAINING OXYGEN TO GIVE RISE TO THERMAL DECOMPOSITION AND GASIFICATION OF OLIGOMER TO FORM RESIN LAYER | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2002-04-30 | — | — | US | disclosed |
| US-6376151-B1 | HYDROXYPOLYAMIDES | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2002-04-23 | — | — | US | disclosed |
| EP-1195811-A1 | SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2002-04-10 | — | — | EP | disclosed |
| EP-0990673-B1 | Polybenzoxazole resin and precursor thereof | SUMITOMO BAKELITE CO (JP) | 2002-03-20 | — | — | EP | disclosed |
| US-6297351-B1 | EXCELLENT IN ELECTRIC CHARACTERISTICS AND HEAT RESISTANCE, PRECURSOR FROM A DICARBOXYLIC ACID AND A BISAMINOPHENOL COMPOUND OR A DIAMINODIHYDROXY | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2001-10-02 | — | — | US | disclosed |
| US-6235436-B1 | BLEND OF POLYBENZOXAZOLE, PHENOLIC RESIN AND POLYAMIDE; PREBAKING, EXPOSURE, DEVELOPMENT, HEAT CURING | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2001-05-22 | — | — | US | disclosed |
| EP-1096316-A1 | POSITIVE RESIST COMPOSITION | Asahi Kasei Kabushiki Kaisha (JP) | 2001-05-02 | — | — | EP | disclosed |
| EP-1089129-A1 | Positive type photosensitive resin composition, process for producing pattern and electronic parts | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2001-04-04 | — | — | EP | disclosed |
| EP-0807852-B1 | Positive type photosensitive resin composition and semiconductor device using the same | SUMITOMO BAKELITE CO (JP) | 2001-03-21 | — | — | EP | disclosed |
| US-6204356-B1 | CYCLIZATION | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2001-03-20 | — | — | US | disclosed |
| US-6114497-A | POLYBENOXAZOLE PRECURSOR HAVING RECURRING UNIT OF AROMATIC DICARBOXYLIC ACID AND 2,2'-BIS(3-AMINO-4-HYDROXY-5 OR 6-FLUOROALKYLSUBSTITUTED PHENYL)-TRIFLUOROMETHYLPHENYL)HEXAFLUOROPROPANE | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2000-09-05 | — | — | US | disclosed |
| US-6071666-A | POLYBENZOXAXOLE PRECURSOR POLYAMIDE MIXED WITH A PHOTOSENSITIVE QUINONEDIAZIDE COMPOUND AND A BIS- OR TRISPHENOLIC COMPOUND WHICH ENHANCES SENSITIVITY AND SOLUBILITY OF EXPOSED PORTION OF PHOTORESIST | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2000-06-06 | — | — | US | disclosed |
| EP-0997488-A1 | Polybenzoxazole resin and precursor thereof | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2000-05-03 | — | — | EP | disclosed |
| US-6048924-A | AMINO RESIN FROM CARBOXY AMINO COMPOUND BENZOGUANIMINE | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2000-04-11 | — | — | US | disclosed |
| EP-0990673-A2 | Polybenzoxazole resin and precursor thereof | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2000-04-05 | — | — | EP | disclosed |
| EP-0860473-A1 | AQUEOUS RESIN COMPOSITION AND AQUEOUS PAINT | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1998-08-26 | — | — | EP | disclosed |
| US-5756260-A | POLYAMIC ACID ESTER, PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1998-05-26 | — | — | US | disclosed |
| EP-0807852-A1 | Positive type photosensitive resin composition and semiconductor device using the same | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1997-11-19 | — | — | EP | disclosed |
| EP-0637776-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR FORMING RELIEF PATTERN THEREFROM | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1995-02-08 | — | — | EP | disclosed |
| EP-0637776-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR FORMING RELIEF PATTERN THEREFROM | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1995-02-08 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20100044888-A1 | BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT | RARA, AASDHPPT, GABRP | TSHR 3650/4885CHRM2 4503/4885CHRM4 3975/4885 |
| US-20120156622-A1 | Ortho-Nitrobenzyl Ester Compound and Positive Type Photosensitive Resin Composition Including the Same | RER1, TAS1R1, PSMA1 | TSHR 4795/4885CHRM2 4843/4885CHRM4 4613/4885 |
| US-20120156614-A1 | Novel Phenol Compounds and Positive Photosensitive Resin Composition Including the Same | SUN2, TYR, PSMD2 | TSHR 4836/4885CHRM2 4846/4885CHRM4 4809/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.