⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8720 | 0.76 | DPP4 (0.50) | — | |
| SCHEMBL8923168 | 0.75 | LMNA (0.44) | — | |
| Diphenylmethanol SCHEMBL6434457 | 0.73 | SMN1; SMN2 (0.61) | — | |
| Diphenylmethanol SCHEMBL41571 | 0.73 | SMN1; SMN2 (0.61) | — | |
| SCHEMBL1417856 | 0.73 | LMNA (0.62) | — | |
| Diphenylmethanol SCHEMBL10868602 | 0.73 | SMN1; SMN2 (0.61) | — | |
| SCHEMBL108052 | 0.73 | — | — | |
| SCHEMBL915218 | 0.73 | LMNA (0.62) | — | |
| SCHEMBL2889714 | 0.73 | LMNA (0.62) | — | |
| SCHEMBL3055513 | 0.73 | LMNA (0.62) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025053791-A1 | ONE-POT GRAFTING OF POLYMERS FROM ALCOHOLS AND BIOMASSES | NANYANG TECHNOLOGICAL UNIVERSITY (SG) | 2025-03-13 | — | — | WO | claimed |
| WO-2025053791-A1 | ONE-POT GRAFTING OF POLYMERS FROM ALCOHOLS AND BIOMASSES | NANYANG TECHNOLOGICAL UNIVERSITY (SG) | 2025-03-13 | — | — | WO | disclosed |
| CN-116075368-B | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2024-06-11 | — | — | CN | disclosed |
| CN-116075368-A | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2023-05-05 | — | — | CN | disclosed |
| CN-110249004-B | Polyimide precursor composition | 东京应化工业株式会社 | 2022-07-19 | — | — | CN | disclosed |
| CN-108389512-B | Laminate, flexible device, and method for producing laminate | 东京应化工业株式会社 | 2022-04-15 | — | — | CN | disclosed |
| CN-108250754-B | Silicon-containing resin composition, silicon-containing resin film, silica film, light-emitting display element panel, and light-emitting display device | 东京应化工业株式会社 | 2022-01-25 | — | — | CN | disclosed |
| CN-108387954-B | Laminate, flexible device, and method for producing laminate | 东京应化工业株式会社 | 2022-01-18 | — | — | CN | disclosed |
| CN-107709464-B | Silicon-containing resin composition | 东京应化工业株式会社 | 2021-09-28 | — | — | CN | disclosed |
| CN-112334795-A | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | 东京应化工业株式会社 | 2021-02-05 | — | — | CN | disclosed |
| CN-108389512-A | The manufacturing method of laminated body, flexible devices and laminated body | 东京应化工业株式会社 | 2018-08-10 | — | — | CN | disclosed |
| CN-108250754-A | Containing silicone resin composition, containing silicone resin film, silica membrane, illuminated display element panel and luminous display unit | 东京应化工业株式会社 | 2018-07-06 | — | — | CN | disclosed |
| CN-107922733-A | Polyimide precursor composition | 东京应化工业株式会社 | 2018-04-17 | — | — | CN | disclosed |
| CN-107709464-A | Containing silicone resin composition | 东京应化工业株式会社 | 2018-02-16 | — | — | CN | disclosed |
| EP-3275940-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-01-31 | — | — | EP | disclosed |
| CN-107429059-A | ENERGY-SENSITIVE RESIN COMPOSITION | 东京应化工业株式会社 | 2017-12-01 | — | — | CN | disclosed |
| EP-2141188-B1 | SILICON-CONTAINING COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT | ADEKA CORP (JP) | 2014-04-23 | — | — | EP | disclosed |
| US-8003736-B2 | Silicon-containing compound, curable composition and cured product | ADEKA CORPORATION (JP) | 2011-08-23 | — | — | US | disclosed |
| US-20100179283-A1 | SILICON-CONTAINING COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT | ADEKA CORPORATION (JP) | 2010-07-15 | — | — | US | disclosed |
| EP-2141188-A1 | SILICON-CONTAINING COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT | Adeka Corporation (JP) | 2010-01-06 | — | — | EP | disclosed |