SCHEMBL2240459

SCHEMBL2240459

C=CC(=O)OCCOc1ccc(-c2nc(-c3ccccc3)nc(-c3ccccc3)n2)c(O)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.56
ALOX15 P16050 2/20 0.39
ADORA3 P0DMS8 1/20 0.39
TSHR P16473 1/20 0.39
ADORA2A P29274 1/20 0.39
ADORA2B P29275 1/20 0.39
ADORA1 P30542 1/20 0.39
MAPT P10636 5/20 0.38
NPSR1 Q6W5P4 4/20 0.38
MAPK1 P28482 4/20 0.38
KDM4E B2RXH2 3/20 0.38
TDP1 Q9NUW8 2/20 0.38
HSP90AA1 P07900 1/20 0.38
MEN1 O00255 4/20 0.38
KMT2A Q03164 4/20 0.38
LMNA P02545 3/20 0.38
ALOX12 P18054 1/20 0.38
SMN1; SMN2 Q16637 2/20 0.38
USP2 O75604 1/20 0.38
TP53 P04637 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29512550 1.00 THRB (0.56) THRBALOX15ADORA3TSHRADORA2A
SCHEMBL13897527 0.98 THRB (0.54) THRBALOX15ADORA3TSHRADORA2A
SCHEMBL30887136 0.93 THRB (0.48) THRBALOX15ADORA3TSHRADORA2A
SCHEMBL8383344 0.93 THRB (0.48) THRBALOX15ADORA3TSHRADORA2A
SCHEMBL8518340 0.93 THRB (0.48) THRBALOX15ADORA3TSHRADORA2A
SCHEMBL8517765 0.89 THRB (0.45) THRBALOX15MAPTNPSR1MEN1
SCHEMBL225454 0.89 THRB (0.45) THRBTSHRMAPTNPSR1MAPK1
SCHEMBL29664981 0.89 THRB (0.45) THRBTSHRMAPTNPSR1MAPK1
SCHEMBL14017595 0.88 THRB (0.51) THRBALOX15TSHRMAPTKDM4E
SCHEMBL28047260 0.88 THRB (0.47) THRBADORA3TSHRMAPTNPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109699189-B Mask-integrated surface protective tape and method for manufacturing semiconductor chip using the same 古河电气工业株式会社 2024-01-30 CN disclosed
US-11862504-B2 Mask-integrated surface protective tape, and method of producing a semiconductor chip using the same FURUKAWA ELECTRIC CO., LTD. (JP) 2024-01-02 US disclosed
CN-114502680-B Adhesive composition 住友化学株式会社 2023-12-01 CN disclosed
CN-109937469-B Mask material for plasma dicing, mask-integrated surface protective tape, and method for manufacturing semiconductor chip 古河电气工业株式会社 2023-09-08 CN disclosed
US-11437243-B2 Mask material for plasma dicing, mask-integrated surface protective tape and method of producing semiconductor chip FURUKAWA ELECTRIC CO., LTD. (JP) 2022-09-06 US disclosed
CN-114502680-A Adhesive composition 住友化学株式会社 2022-05-13 CN disclosed
CN-114502687-A Adhesive composition 住友化学株式会社 2022-05-13 CN disclosed
CN-114450375-A Adhesive composition 住友化学株式会社 2022-05-06 CN disclosed
US-11110689-B2 Pressure sensitive adhesive composition including ultraviolet light-absorbing oligomer 3M INNOVATIVE PROPERTIES COMPANY (US) 2021-09-07 US disclosed
WO-2021070799-A1 ADHESIVE AGENT COMPOSITION 住友化学株式会社 2021-04-15 WO disclosed
EP-1752508-B1 Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board NITTO DENKO CORP (JP) 2009-10-14 EP disclosed
US-20090110936-A1 Resin Composition for Forming Ultraviolet Absorbing Layer and Laminate Comprising Ultraviolet Absorbing Layer NIPPON SHOKUBAI CO., LTD. (JP) 2009-04-30 US disclosed
WO-2007037501-A9 RESIN COMPOSITION FOR FORMING ULTRAVIOLET ABSORBING LAYER AND LAMINATE COMPRISING ULTRAVIOLET ABSORBING LAYER NIPPON CATALYTIC CHEM IND (JP) 2007-05-24 WO disclosed
US-20070036953-A1 Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board NITTO DENKO CORPORATION 2007-02-15 US disclosed
EP-1752508-A1 Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board. NITTO DENKO CORPORATION (JP) 2007-02-14 EP disclosed
CN-1912042-A Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board NITTO DENKO CORP (JP) 2007-02-14 CN disclosed
EP-0441746-B1 Light-stabilised binding agent for coatings CIBA GEIGY AG (CH) 1995-06-21 EP disclosed
US-5356995-A Silicon-containing copolymer, acrylic copolymer, curing agent cabable of reacting with both copolymers, uv rad stabilizer of benzotriazole or triazine derivative copolymerized CIBA-GEIGY CORPORATION (US) 1994-10-18 US disclosed
US-5198498-A Light-stabilized binders for coating compositions CIBA-GEIGY CORPORATION (US) 1993-03-30 US disclosed
EP-0441746-A2 Light-stabilised binding agent for coatings CIBA-GEIGY AG (CH) 1991-08-14 EP disclosed