SCHEMBL22444372

SCHEMBL22444372

CCS(=O)(=O)N(C(=O)O)S(=O)(=O)CC

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FFAR3 O14843 2/20 0.36
HDAC1 Q13547 2/20 0.36
HDAC2 Q92769 2/20 0.36
HDAC3 O15379 1/20 0.36
HDAC8 Q9BY41 1/20 0.36
CA1 P00915 2/20 0.33
TDP1 Q9NUW8 3/20 0.32
CHRM1 P11229 1/20 0.32
AKR1A1 P14550 1/20 0.32
CHRM3 P20309 1/20 0.32
HTR2A P28223 1/20 0.32
HTR2C P28335 1/20 0.32
ADRA1A P35348 1/20 0.32
HRH1 P35367 1/20 0.32
DRD3 P35462 1/20 0.32
SLC6A3 Q01959 1/20 0.32
AKR1B1 P15121 1/20 0.32
CES2 O00748 1/20 0.32
CES1 P23141 1/20 0.32
CA12 O43570 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7701050 0.74 CA1 (0.35) CA1CES2CES1CA12CA2
SCHEMBL29202325 0.69 KDM4E (0.31) CA2SMN1; SMN2ALDH1A1
SCHEMBL14252322 0.67 FFAR3 (0.39) FFAR3HDAC1HDAC2HDAC3HDAC8
SCHEMBL16478592 0.67 CA1 (0.42) FFAR3HDAC1HDAC2HDAC3HDAC8
SCHEMBL13406336 0.65 ALDH1A1 (0.40) FFAR3HDAC1HDAC2HDAC3HDAC8
SCHEMBL27891788 0.65
SCHEMBL16583710 0.65 CA5A (0.33) ALDH1A1
SCHEMBL2079051 0.63 CA1 (0.42) CA1CA12CA2CA14
SCHEMBL1756719 0.63 FFAR3 (0.33) FFAR3CHRM1CHRM3SMN1; SMN2ALDH1A1
SCHEMBL672336 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021065540-A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED OBJECT, AND ELECTRONIC COMPONENT 太陽ホールディングス株式会社 2021-04-08 WO disclosed
WO-2020188921-A1 ESTER-DIAMINE-CONTAINING POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT 太陽ホールディングス株式会社 2020-09-24 WO disclosed