Aniline

Aniline

SCHEMBL224547

C1CC1.CCO[SiH](OCC)OCC.Nc1ccccc1

nearest known ligand 0.44

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.44
TDP1 Q9NUW8 3/20 0.38
CYP3A4 P08684 4/20 0.37
TP53 P04637 1/20 0.37
ALDH1A1 P00352 2/20 0.35
CYP19A1 P11511 2/20 0.35
ESR1 P03372 1/20 0.35
ESR2 Q92731 1/20 0.35
MAOA P21397 6/20 0.34
MAOB P27338 6/20 0.34
MAPT P10636 2/20 0.34
L3MBTL1 Q9Y468 2/20 0.34
CYP1A2 P05177 2/20 0.34
KDM4E B2RXH2 1/20 0.34
CYP2D6 P10635 1/20 0.34
CYP2C9 P11712 1/20 0.34
CYP2C19 P33261 1/20 0.34
SMN1; SMN2 Q16637 2/20 0.33
RAB9A P51151 2/20 0.33
GAA P10253 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Aniline SCHEMBL2797779 0.94 TSHR (0.50) TSHRTDP1CYP3A4TP53ALDH1A1
Aniline SCHEMBL27575192 0.92 TSHR (0.48) TSHRTDP1CYP3A4TP53ALDH1A1
Aniline SCHEMBL14802038 0.92 TSHR (0.48) TSHRTDP1CYP3A4TP53ALDH1A1
Aniline SCHEMBL223573 0.77 TSHR (0.50) TSHRTDP1CYP3A4ALDH1A1CYP19A1
Biphenyl SCHEMBL3480054 0.76 ALDH1A1 (0.45) TP53ALDH1A1MAPTL3MBTL1KDM4E
Aniline SCHEMBL28486506 0.76 TSHR (0.44) TSHRTDP1CYP3A4TP53ALDH1A1
SCHEMBL6052706 0.75 LTA4H (0.33) TP53SMN1; SMN2
Cyclopropane SCHEMBL20694865 0.75
Cyclooctane SCHEMBL28671573 0.75
Cyclohexane SCHEMBL28994879 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106459362-B Silylated polyurethanes 亨茨曼国际有限公司 2020-10-13 CN claimed
EP-3157970-B1 SILYLATED POLYURETHANES HUNTSMAN INT LLC (US) 2019-02-06 EP claimed
WO-2024043285-A1 RESIN COMPOSITION, COMPOSITE REINFORCING MATERIAL, MOLDED BODY, AND METHOD FOR RECOVERING REINFORCING FIBERS FROM COMPOSITE REINFORCING MATERIAL 旭化成株式会社 2024-02-29 WO disclosed
WO-2023189996-A1 RESIN COMPOSITION FOR MOLDING, MANUFACTURING METHOD FOR SEALING STRUCTURE, AND SEALING STRUCTURE 住友ベークライト株式会社 2023-10-05 WO disclosed
WO-2023190309-A1 SURFACE-MODIFIER RESIN COMPOSITION 住友ベークライト株式会社 2023-10-05 WO disclosed
WO-2023182485-A1 RESIN COMPOSITION FOR ENCAPSULATION AND METHOD FOR PRODUCING SINGLE-SIDED-ENCAPSULATION STRUCTURE 住友ベークライト株式会社 2023-09-28 WO disclosed
EP-3859944-B1 FIXING RESIN COMPOSITION FOR USE IN ROTOR SUMITOMO BAKELITE CO (JP) 2023-06-28 EP disclosed
CN-116348501-A Liquid crystal composition, method for manufacturing liquid crystal display element, and liquid crystal display element 日产化学株式会社 2023-06-27 CN disclosed
US-20220220247-A1 Composition Comprising Silylated Polymer HUNTSMAN INTERNATIONAL LLC 2022-07-14 US disclosed
EP-3976707-A1 COMPOSITION COMPRISING SILYLATED POLYMER Huntsman International LLC (US) 2022-04-06 EP disclosed
CN-110168033-B Photocatalyst coating set 盛势达技研株式会社 2022-03-29 CN disclosed
US-20120205822-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION SUMITOMO BAKELITE CO., LTD. (JP) 2012-08-16 US disclosed
US-20120080809-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2012-04-05 US disclosed
US-20120061861-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2012-03-15 US disclosed
US-20120001350-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2012-01-05 US disclosed
WO-2011161011-A1 ALKOXYSILANE FUNCTIONALIZED ISOCYANATE BASED MATERIALS HUNTSMAN INTERNATIONAL LLC (US) 2011-12-29 WO disclosed
US-20110124775-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD (JP) 2011-05-26 US disclosed
US-7569649-B2 Film forming composition, insulating film, and electronic device FUJIFILM CORPORATION (JP) 2009-08-04 US disclosed
US-20080076888-A1 FILM FORMING COMPOSITION, INSULATING FILM, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-6348123-B1 AUTOMOBILE WINDOW GLASS TO MOLDING; MOISTURE-CURING POLYURETHANE ADHESIVE, TWO KINDS OF PRIMERS, DURABILITY AND EXTENED WORKING LIFE, FIRST PRIMER IS A POLYBUTADIENE RESIN, SECOND PRIMER IS POLYISOCYANATE COMPOUND OR AN ALKOXYSILANE SUNSTAR GIKEN KABUSHIKI KAISHA (JP) 2002-02-19 US disclosed