SCHEMBL22472284

SCHEMBL22472284

C=C(CCCC)c1cccc(C)c1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 1/20 0.45
TDP1 Q9NUW8 1/20 0.45
TAS1R3 Q7RTX0 1/20 0.43
TAS1R1 Q7RTX1 1/20 0.43
PARP1 P09874 1/20 0.43
SMN1; SMN2 Q16637 3/20 0.42
ALDH1A1 P00352 1/20 0.42
MAPT P10636 1/20 0.42
PTGS2 P35354 1/20 0.41
HDAC8 Q9BY41 1/20 0.41
HDAC6 Q9UBN7 1/20 0.41
CES2 O00748 1/20 0.40
CES1 P23141 1/20 0.40
CTNNB1 P35222 1/20 0.39
WNT3A P56704 1/20 0.39
CNR2 P34972 1/20 0.39
SLC6A2 P23975 1/20 0.38
SLC6A4 P31645 1/20 0.38
SLC6A3 Q01959 1/20 0.38
ACHE P22303 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29175151 0.95 HPGD (0.44) HPGDTDP1TAS1R3TAS1R1PARP1
SCHEMBL29263437 0.82 ESR1 (0.44) PARP1ALDH1A1PTGS2CES2CES1
SCHEMBL8444352 0.81 HPGD (0.50) HPGDTDP1TAS1R3TAS1R1PARP1
SCHEMBL2018709 0.81 ALDH1A1 (0.50) HPGDPARP1ALDH1A1MAPTPTGS2
SCHEMBL27509235 0.79 LPL (0.45) HPGDCES2CES1
SCHEMBL20448 0.79 PTGS2 (0.57) ALDH1A1PTGS2CES2CES1
SCHEMBL4931177 0.79 CTNNB1 (0.56) HPGDTDP1TAS1R3TAS1R1PARP1
SCHEMBL20906989 0.78 HPGD (0.43) HPGDTDP1SMN1; SMN2ALDH1A1PTGS2
SCHEMBL9556851 0.77 ESR1 (0.49)
SCHEMBL20827503 0.77 HPGD (0.44) HPGDTDP1PARP1SMN1; SMN2HDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117720787-A Flexible metal clad laminate and method of making the same 科腾聚合物荷兰有限责任公司 2024-03-19 CN disclosed
WO-2021079819-A1 COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN パナソニックIPマネジメント株式会社 2021-04-29 WO disclosed
WO-2021079817-A1 METAL CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND RESIN COMPOSITION パナソニックIPマネジメント株式会社 2021-04-29 WO disclosed
WO-2021060178-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2021-04-01 WO disclosed
WO-2021024923-A1 RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD パナソニックIPマネジメント株式会社 2021-02-11 WO disclosed
WO-2020230870-A1 COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL パナソニックIPマネジメント株式会社 2020-11-19 WO disclosed
WO-2020196759-A1 PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2020-10-01 WO disclosed