SCHEMBL22485754

SCHEMBL22485754

Cc1c(OC#N)cccc1[N+](=O)[O-]

nearest known ligand 0.58

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 4/20 0.58
TSHR P16473 3/20 0.53
SMN1; SMN2 Q16637 2/20 0.53
ALDH1A1 P00352 4/20 0.47
HSD17B10 Q99714 1/20 0.43
L3MBTL1 Q9Y468 4/20 0.42
NPC1 O15118 2/20 0.42
RECQL P46063 1/20 0.42
RAB9A P51151 1/20 0.42
MAPT P10636 1/20 0.41
MAPK1 P28482 1/20 0.41
KDM4E B2RXH2 1/20 0.40
LMNA P02545 1/20 0.40
HPGD P15428 2/20 0.40
GPR35 Q9HC97 1/20 0.40
POLB P06746 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30255416 0.82 ALDH1A1 (0.58) TDP1SMN1; SMN2ALDH1A1HSD17B10L3MBTL1
SCHEMBL530340 0.82 ALDH1A1 (0.58) TDP1SMN1; SMN2ALDH1A1HSD17B10L3MBTL1
SCHEMBL29229957 0.80 TDP1 (0.69) TDP1TSHRSMN1; SMN2ALDH1A1HSD17B10
SCHEMBL943484 0.79 TDP1 (0.69) TDP1TSHRSMN1; SMN2ALDH1A1HSD17B10
SCHEMBL29391066 0.79 TDP1 (0.69) TDP1TSHRSMN1; SMN2ALDH1A1HSD17B10
SCHEMBL30072983 0.78 TDP1 (0.60) TDP1TSHRSMN1; SMN2ALDH1A1HSD17B10
SCHEMBL18541925 0.78 MAPT (0.39) TDP1TSHRSMN1; SMN2ALDH1A1HSD17B10
SCHEMBL19006811 0.77 TDP1 (0.64) TDP1TSHRSMN1; SMN2ALDH1A1HSD17B10
SCHEMBL10629488 0.77 TDP1 (0.42) TDP1TSHRSMN1; SMN2ALDH1A1L3MBTL1
SCHEMBL28712296 0.76 ALDH1A1 (0.40) TDP1TSHRSMN1; SMN2ALDH1A1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020196764-A1 ALKALI-SOLUBLE POLYIMIDE AND PRODUCTION METHOD THEREOF, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND PRODUCTION METHOD OF PATTERN CURED FILM 株式会社カネカ 2020-10-01 WO disclosed