Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 6/20 | 0.52 |
| ▸ | CA2 | P00918 | 6/20 | 0.52 |
| ▸ | ACHE | P22303 | 4/20 | 0.52 |
| ▸ | CYP1A1 | P04798 | 8/20 | 0.50 |
| ▸ | CYP1A2 | P05177 | 8/20 | 0.50 |
| ▸ | CYP1B1 | Q16678 | 8/20 | 0.50 |
| ▸ | LMNA | P02545 | 1/20 | 0.45 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.44 |
| ▸ | RAB9A | P51151 | 1/20 | 0.43 |
| ▸ | ATM | Q13315 | 1/20 | 0.43 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.43 |
| ▸ | EGFR | P00533 | 1/20 | 0.43 |
| ▸ | ERBB2 | P04626 | 1/20 | 0.43 |
| ▸ | ERBB3 | P21860 | 1/20 | 0.43 |
| ▸ | KDR | P35968 | 1/20 | 0.43 |
| ▸ | PTK2 | Q05397 | 1/20 | 0.43 |
| ▸ | MEN1 | O00255 | 1/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2253241 | 0.93 | CA1 (0.53) | CA1CA2ACHECYP1A1CYP1A2 | |
| SCHEMBL2255613 | 0.88 | CA1 (0.46) | CA1CA2ACHECYP1A1CYP1A2 | |
| SCHEMBL2255616 | 0.88 | CA1 (0.46) | CA1CA2ACHECYP1A1CYP1A2 | |
| SCHEMBL2254941 | 0.85 | CA1 (0.46) | CA1CA2ACHECYP1A1CYP1A2 | |
| SCHEMBL29106103 | 0.85 | CYP1A1 (0.50) | CYP1A1CYP1A2CYP1B1NFE2L2RAB9A | |
| SCHEMBL28024426 | 0.84 | CA1 (0.43) | CA1CA2ACHECYP1A1CYP1A2 | |
| SCHEMBL2249803 | 0.78 | CA1 (0.53) | CA1CA2ACHECYP1A1CYP1A2 | |
| SCHEMBL2253754 | 0.77 | NFE2L2 (0.49) | CA1CA2ACHECYP1A1CYP1A2 | |
| SCHEMBL29131697 | 0.76 | CYP1A1 (0.44) | CYP1A1CYP1A2CYP1B1LMNANFE2L2 | |
| SCHEMBL2251880 | 0.75 | ALDH1A1 (0.48) | CA1CA2ACHECYP1A1CYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100065-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 株式会社レゾナック | 2026-05-15 | — | — | WO | disclosed |
| US-12560867-B2 | Photosensitive element and method for producing photosensitive element | RESONAC CORPORATION (JP) | 2026-02-24 | — | — | US | disclosed |
| EP-4692936-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | Resonac Corporation (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-4675350-A1 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | Resonac Corporation (JP) | 2026-01-07 | — | — | EP | disclosed |
| US-20250278024-A1 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2025-09-04 | — | — | US | disclosed |
| EP-4607280-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | Resonac Corporation (JP) | 2025-08-27 | — | — | EP | disclosed |
| EP-4607279-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | Resonac Corporation (JP) | 2025-08-27 | — | — | EP | disclosed |
| WO-2025126273-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 株式会社レゾナック | 2025-06-19 | — | — | WO | disclosed |
| WO-2025127002-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 株式会社レゾナック | 2025-06-19 | — | — | WO | disclosed |
| WO-2025094282-A1 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | 株式会社レゾナック | 2025-05-08 | — | — | WO | disclosed |
| CN-104111583-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board | HITACHI CHEMICAL CO LTD | 2014-10-22 | — | — | CN | disclosed |
| CN-104081281-A | Photosensitive resin composition, photosensitive element using same, method for forming spacer, and spacer | HITACHI CHEMICAL CO LTD | 2014-10-01 | — | — | CN | disclosed |
| CN-103543608-A | Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same | HITACHI CHEMICAL CO LTD | 2014-01-29 | — | — | CN | disclosed |
| US-20130298398-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-11-14 | — | — | US | disclosed |
| US-8198008-B2 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-06-12 | — | — | US | disclosed |
| US-8192916-B2 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-06-05 | — | — | US | disclosed |
| US-7993809-B2 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-08-09 | — | — | US | disclosed |
| US-20100285408-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2010-11-11 | — | — | US | disclosed |
| US-20100279229-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2010-11-04 | — | — | US | disclosed |
| US-20090029289-A1 | Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern and Method for Producing Printed Wiring Board | RESONAC CORPORATION (JP) | 2009-01-29 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12560867-B2 | Photosensitive element and method for producing photosensitive element | TERB1, PRDM9, PRPF8 | CA1 3648/4885CA2 4438/4885ACHE 4534/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.