SCHEMBL2268609

SCHEMBL2268609

Nc1cccc(-c2nc3ccc(N)cc3o2)c1

nearest known ligand 0.78

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 16/20 0.78
RAB9A P51151 15/20 0.78
KDM4E B2RXH2 12/20 0.78
MAPT P10636 11/20 0.78
SMN1; SMN2 Q16637 11/20 0.78
ALDH1A1 P00352 10/20 0.78
HPGD P15428 7/20 0.78
KMT2A Q03164 7/20 0.73
MEN1 O00255 6/20 0.73
GAA P10253 4/20 0.73
GLA P06280 2/20 0.73
NFKB1 P19838 3/20 0.64
NFKB2 Q00653 3/20 0.64
RELA Q04206 3/20 0.64
TP53 P04637 5/20 0.60
HSD17B10 Q99714 2/20 0.60
CACNA1B Q00975 1/20 0.59
APBA1 Q02410 1/20 0.59
TDP1 Q9NUW8 1/20 0.56
GFER P55789 3/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29363950 1.00 NPC1 (0.78) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL16424489 0.95 NPC1 (0.75) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL30296291 0.95 NPC1 (0.75) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL12209706 0.90 NPC1 (0.72) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL28291247 0.89 NPC1 (0.77) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL12209714 0.88 NPC1 (0.70) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL517126 0.88 NPC1 (0.81) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL2494171 0.88 NPC1 (1.00) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL4055951 0.88 NPC1 (0.70) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL6683035 0.88 NPC1 (0.70) NPC1RAB9AKDM4EMAPTSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 249 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12060457-B2 Resin composition for display substrate, resin film for display substrate and laminate body containing this, image display device, organic EL display, and manufacturing method of these TORAY INDUSTRIES, INC. (JP) 2024-08-13 US claimed
CN-112384546-B Thermally conductive resin composition 东洋纺株式会社 2024-01-16 CN claimed
CN-106543720-B A kind of Kapton of low thermal coefficient of expansion and preparation method thereof 武汉依麦德新材料科技有限责任公司 2019-08-23 CN claimed
CN-109134861-A A kind of preparation method of the fire-retardant polyimides new material of solubility 王金桢 2019-01-04 CN claimed
US-9394638-B2 Polyimide nonwoven fabric and process for production thereof TOYO BOSEKI KABUSHIKI KAISHA (JP) 2016-07-19 US claimed
US-12479194-B2 Laminate TOYOBO CO., LTD. (JP) 2025-11-25 US disclosed
EP-4651185-A1 LAMINATE, SEMICONDUCTOR ELEMENT, AND MEMS ELEMENT Toray Industries, Inc. (JP) 2025-11-19 EP disclosed
EP-4651186-A1 METHOD FOR PRODUCING MULTILAYER BODY, AND RESIN COMPOSITION Toray Industries, Inc. (JP) 2025-11-19 EP disclosed
US-12472732-B2 Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device TOYOBO CO., LTD. (JP) 2025-11-18 US disclosed
US-20250321481-A1 PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-10-16 US disclosed
US-12391813-B2 Layered body including inorganic substrate and polyamic acid cured product TOYOBO CO., LTD. (JP) 2025-08-19 US disclosed
US-20250189891-A1 POLYIMIDE RESIN PRECURSOR TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-12 US disclosed
EP-1880834-A1 APPARATUS FOR PRODUCING POLYMER FILM AND PROCESS FOR PRODUCING POLYMER FILM Toyo Boseki Kabushiki Kasisha (JP) 2008-01-23 EP disclosed
EP-1872940-A1 ADHESIVE SHEET, METAL-LAMINATED SHEET AND PRINTED WIRING BOARD Toyo Boseki Kabushiki Kasisha (JP) 2008-01-02 EP disclosed
EP-1872941-A1 THIN FILM-LAMINATED POLYIMIDE FILM AND FLEXIBLE PRINTED WIRING BOARD Toyo Boseki Kabushiki Kasisha (JP) 2008-01-02 EP disclosed
US-20070293588-A1 Curable Composition TOYO BOSEKI KABUSHIKI KAISHA (JP) 2007-12-20 US disclosed
US-20070293588-A1 Curable Composition TOYO BOSEKI KABUSHIKI KAISHA (JP) 2007-12-20 US disclosed
US-20070272124-A1 Polyimide film TOYO BOSEKI KABUSHIKI KAISHA (JP) 2007-11-29 US disclosed
US-20070272124-A1 Polyimide film TOYO BOSEKI KABUSHIKI KAISHA (JP) 2007-11-29 US disclosed
US-4024125-A Dis-azo pigments deriving from bis-diazotized diamino-2-phenyl-benzazolones HOECHST AKTIENGESELLSCHAFT (DT) 1977-05-17 US disclosed