SCHEMBL30296291

SCHEMBL30296291

Nc1ccc2nc(-c3cccc(-c4nc5ccc(N)cc5o4)c3)oc2c1

nearest known ligand 0.75

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 16/20 0.75
RAB9A P51151 15/20 0.75
KDM4E B2RXH2 12/20 0.75
MAPT P10636 11/20 0.75
SMN1; SMN2 Q16637 11/20 0.75
ALDH1A1 P00352 10/20 0.75
KMT2A Q03164 7/20 0.75
HPGD P15428 7/20 0.75
MEN1 O00255 6/20 0.75
GAA P10253 4/20 0.75
GLA P06280 2/20 0.75
TP53 P04637 5/20 0.61
HSD17B10 Q99714 2/20 0.61
NFKB1 P19838 3/20 0.57
NFKB2 Q00653 3/20 0.57
RELA Q04206 3/20 0.57
GFER P55789 3/20 0.56
ATM Q13315 1/20 0.56
RXFP1 Q9HBX9 1/20 0.56
TDP1 Q9NUW8 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16424489 1.00 NPC1 (0.75) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL29363950 0.95 NPC1 (0.78) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL2268609 0.95 NPC1 (0.78) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL28291247 0.94 NPC1 (0.77) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL517126 0.90 NPC1 (0.81) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL2248791 0.89 NPC1 (0.65) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL2491134 0.87 RAB9A (0.96) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL16424109 0.86 NPC1 (0.80) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL29838123 0.86 NPC1 (0.80) NPC1RAB9AKDM4EMAPTSMN1; SMN2
SCHEMBL2245075 0.86 RAB9A (1.00) NPC1RAB9AKDM4EMAPTSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112368641-B Photosensitive resin composition, photosensitive sheet, cured film thereof, method for producing cured film, and electronic component 东丽株式会社 2025-05-02 CN disclosed
CN-118900872-A Polyimide resin precursor 东京应化工业株式会社 2024-11-05 CN disclosed
WO-2023233895-A1 POLYIMIDE RESIN PRECURSOR 東京応化工業株式会社 2023-12-07 WO disclosed
WO-2023233896-A1 PHOTOSENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2023-12-07 WO disclosed
CN-116802559-A Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound 东丽株式会社 2023-09-22 CN disclosed
WO-2023176172-A1 POLYIMIDE RESIN PRECURSOR 東京応化工業株式会社 2023-09-21 WO disclosed
WO-2023058385-A1 BLOCK COPOLYMER 東京応化工業株式会社 2023-04-13 WO disclosed
CN-111051432-B Resin composition, method for producing resin film, and method for producing electronic device 东丽株式会社 2023-04-04 CN disclosed
CN-115542668-A Photosensitive resin composition 东京应化工业株式会社 2022-12-30 CN disclosed