Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.33 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.32 |
| ▸ | LMNA | P02545 | 2/20 | 0.32 |
| ▸ | GAA | P10253 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2279621 | 0.83 | ALDH1A1 (0.33) | ALDH1A1L3MBTL1KDM4ELMNAGAA | |
| SCHEMBL2282478 | 0.78 | NQO2 (0.33) | — | |
| SCHEMBL2282238 | 0.77 | SRC (0.33) | — | |
| SCHEMBL2285907 | 0.73 | LMNA (0.38) | ALDH1A1L3MBTL1KDM4ELMNAMAPT | |
| SCHEMBL11717411 | 0.72 | ALDH1A1 (0.40) | ALDH1A1L3MBTL1KDM4ELMNAMAPT | |
| SCHEMBL2842749 | 0.71 | ALDH1A1 (0.46) | ALDH1A1KDM4ELMNAGAAMAPT | |
| SCHEMBL2840770 | 0.71 | ALDH1A1 (0.36) | ALDH1A1L3MBTL1KDM4ELMNAMAPT | |
| Hydrochloric Acid SCHEMBL3685807 | 0.67 | KDM4E (0.37) | ALDH1A1KDM4ELMNA | |
| SCHEMBL1251696 | 0.67 | IDO1 (0.39) | ALDH1A1L3MBTL1KDM4ELMNAMAPT | |
| SCHEMBL7608160 | 0.67 | LMNA (0.33) | ALDH1A1L3MBTL1LMNAMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110115116-B | Method for forming solderable solder deposits on contact pads | 德国艾托特克公司 | 2022-05-27 | — | — | CN | disclosed |
| US-11032914-B2 | Method of forming a solderable solder deposit on a contact pad | ATOTECH DEUTSCHLAND GMBH (DE) | 2021-06-08 | — | — | US | disclosed |
| EP-3560304-B1 | METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD | ATOTECH DEUTSCHLAND GMBH (DE) | 2021-02-03 | — | — | EP | disclosed |
| US-20190350088-A1 | METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2019-11-14 | — | — | US | disclosed |
| EP-3560304-A1 | METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD | ATOTECH Deutschland GmbH (DE) | 2019-10-30 | — | — | EP | disclosed |
| EP-2377376-B1 | METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES | ATOTECH DEUTSCHLAND GMBH (DE) | 2019-08-07 | — | — | EP | disclosed |
| US-8507376-B2 | Method to form solder deposits on substrates | ATOTECH DEUTSCHLAND GMBH (DE) | 2013-08-13 | — | — | US | disclosed |
| EP-2377376-A1 | METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES | ATOTECH Deutschland GmbH (DE) | 2011-10-19 | — | — | EP | disclosed |
| CN-102187749-A | Method to form solder deposits on substrates | ATOTECH DEUTSCHLAND GMBH | 2011-09-14 | — | — | CN | disclosed |
| US-20110189848-A1 | METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2011-08-04 | — | — | US | disclosed |
| WO-2010046235-A1 | METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES | ATOTECH DEUTSCHLAND GMBH (DE) | 2010-04-29 | — | — | WO | disclosed |