SCHEMBL2285907

SCHEMBL2285907

Cc1nc(C)c(N)c(N)c1C

nearest known ligand 0.38

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.38
ALDH1A1 P00352 2/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
KDM4E B2RXH2 1/20 0.35
IDO1 P14902 1/20 0.34
NOS1 P29475 2/20 0.33
NOS3 P29474 1/20 0.32
NOS2 P35228 1/20 0.32
MAPT P10636 1/20 0.31
TLR8 Q9NR97 1/20 0.30
TLR7 Q9NYK1 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1251696 0.87 IDO1 (0.39) LMNAALDH1A1L3MBTL1KDM4EIDO1
SCHEMBL11630670 0.86 LMNA (0.41) LMNAALDH1A1L3MBTL1KDM4EIDO1
SCHEMBL11717411 0.86 ALDH1A1 (0.40) LMNAALDH1A1L3MBTL1KDM4ENOS1
SCHEMBL19763140 0.77 ALDH1A1 (0.32) LMNAALDH1A1L3MBTL1
SCHEMBL2067816 0.75 LMNA (0.46) LMNAALDH1A1L3MBTL1KDM4EIDO1
SCHEMBL5924277 0.75 LMNA (0.46) LMNAALDH1A1L3MBTL1KDM4EIDO1
SCHEMBL29668443 0.75 LMNA (0.46) LMNAALDH1A1L3MBTL1KDM4EIDO1
SCHEMBL6366330 0.73 ALDH1A1 (0.33) LMNAALDH1A1L3MBTL1KDM4E
SCHEMBL2282867 0.73 ALDH1A1 (0.33) LMNAALDH1A1L3MBTL1KDM4EMAPT
Hydrochloric Acid SCHEMBL4932899 0.73 LMNA (0.44) LMNAALDH1A1L3MBTL1KDM4EIDO1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110115116-B Method for forming solderable solder deposits on contact pads 德国艾托特克公司 2022-05-27 CN disclosed
US-11032914-B2 Method of forming a solderable solder deposit on a contact pad ATOTECH DEUTSCHLAND GMBH (DE) 2021-06-08 US disclosed
EP-3560304-B1 METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD ATOTECH DEUTSCHLAND GMBH (DE) 2021-02-03 EP disclosed
US-20190350088-A1 METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2019-11-14 US disclosed
EP-3560304-A1 METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD ATOTECH Deutschland GmbH (DE) 2019-10-30 EP disclosed
CN-110115116-A Method for forming solderable solder deposits on contact pads 德国艾托特克公司 2019-08-09 CN disclosed
EP-2377376-B1 METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES ATOTECH DEUTSCHLAND GMBH (DE) 2019-08-07 EP disclosed
US-8507376-B2 Method to form solder deposits on substrates ATOTECH DEUTSCHLAND GMBH (DE) 2013-08-13 US disclosed
US-20110189848-A1 METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2011-08-04 US disclosed