SCHEMBL2296549

SCHEMBL2296549

O=C(Oc1ccc(Cl)cc1)c1ccc2ccccc2c1O

nearest known ligand 0.58

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CYP1B1 Q16678 4/20 0.56
CYP1A1 P04798 3/20 0.56
LDHA P00338 1/20 0.53
KMT2A Q03164 3/20 0.49
MAPT P10636 2/20 0.49
KDM4E B2RXH2 2/20 0.49
MEN1 O00255 2/20 0.49
LMNA P02545 1/20 0.49
HTT P42858 1/20 0.49
TP53 P04637 1/20 0.47
THRB P10828 1/20 0.47
ABCG2 Q9UNQ0 2/20 0.46
ATM Q13315 1/20 0.44
NPC1 O15118 1/20 0.44
RAB9A P51151 1/20 0.44
ESR1 P03372 1/20 0.44
PKM P14618 1/20 0.44
ESR2 Q92731 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29361815 0.88 LDHA (0.64) CYP1B1CYP1A1LDHAKMT2AMAPT
SCHEMBL27607 0.88 LDHA (0.64) CYP1B1CYP1A1LDHAKMT2AMAPT
SCHEMBL2293614 0.85 MEN1 (0.57) LDHAKMT2AMAPTMEN1LMNA
SCHEMBL17601924 0.84 LDHA (0.59) CYP1B1CYP1A1LDHAKMT2AMAPT
SCHEMBL27621843 0.83 KMT2A (0.56) KMT2AMAPTKDM4EMEN1HTT
SCHEMBL12732139 0.82 KMT2A (0.62) LDHAKMT2AMAPTMEN1LMNA
SCHEMBL932000 0.80 LDHA (0.54) CYP1B1CYP1A1LDHAKMT2AMAPT
SCHEMBL2354604 0.79 THRB (0.53) KMT2AMAPTKDM4EMEN1LMNA
SCHEMBL2354410 0.79 KMT2A (0.56) CYP1B1CYP1A1LDHAKMT2AMAPT
SCHEMBL5210988 0.79 LDHA (0.56) LDHAKMT2AMAPTKDM4EMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8354359-B2 Heat-sensitive adhesive agent and heat-sensitive adhesive sheet RICOH COMPANY, LTD. (JP) 2013-01-15 US disclosed
EP-2062953-B1 Heat-sensitive adhesive material RICOH CO LTD (JP) 2011-08-17 EP disclosed
US-7993732-B2 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2011-08-09 US disclosed
EP-2062953-A1 Heat-sensitive adhesive material Ricoh Company, Ltd. (JP) 2009-05-27 EP disclosed
US-20090130441-A1 HEAT-SENSITIVE ADHESIVE MATERIAL RICOH COMPANY, LTD (JP) 2009-05-21 US disclosed
US-20080176012-A1 Heat-sensitive adhesive agent and heat-sensitive adhesive sheet RICOH COMPANY, LTD. (JP) 2008-07-24 US disclosed
EP-1897925-A1 Heat-sensitive adhesive agent and heat-sensitive adhesive sheet Ricoh Company, Ltd. (JP) 2008-03-12 EP disclosed
US-20080026205-A1 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2008-01-31 US disclosed
EP-1882726-A1 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material Ricoh Company, Ltd. (JP) 2008-01-30 EP disclosed