Predicted protein targets (top 2)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 1/20 | 0.32 |
| ▸ | PARL | Q9H300 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22974937 | 0.76 | LMNA (0.34) | — | |
| SCHEMBL22974918 | 0.76 | — | — | |
| SCHEMBL22974945 | 0.76 | — | — | |
| SCHEMBL22974933 | 0.73 | ALOX12 (0.34) | — | |
| SCHEMBL22974923 | 0.71 | PIK3CD (0.32) | — | |
| SCHEMBL784740 | 0.71 | — | — | |
| SCHEMBL22974916 | 0.70 | ALOX12 (0.36) | — | |
| SCHEMBL22974925 | 0.67 | ALOX12 (0.47) | PARL | |
| SCHEMBL13212098 | 0.67 | POLB (0.35) | POLBPARL | |
| SCHEMBL8348981 | 0.64 | PARL (0.39) | POLBPARL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3778715-B1 | POLYMETALLOXANE, COMPOSITION, CURED FILM, MEMBER, ELECTRONIC COMPONENT, FIBER, BINDER FOR CERAMIC MOLDING, CURED FILM PRODUCTION METHOD, AND FIBER PRODUCTION METHOD | TORAY INDUSTRIES (JP) | 2022-05-25 | — | — | EP | disclosed |
| US-20210371599-A1 | POLYMETALLOXANE, COMPOSITION, CURED FILM, MEMBER, ELECTRONIC COMPONENT, FIBER, BINDER FOR CERAMIC MOLDING, CURED FILM PRODUCTION METHOD, AND FIBER PRODUCTION METHOD | TORAY INDUSTRIES, INC. (JP) | 2021-12-02 | — | — | US | disclosed |
| EP-3778715-A1 | POLYMETALLOXANE, COMPOSITION, CURED FILM, MEMBER, ELECTRONIC COMPONENT, FIBER, BINDER FOR CERAMIC MOLDING, CURED FILM PRODUCTION METHOD, AND FIBER PRODUCTION METHOD | Toray Industries, Inc. (JP) | 2021-02-17 | — | — | EP | disclosed |