Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 2/20 | 0.34 |
| ▸ | LMNA | P02545 | 4/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.33 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.33 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 2/20 | 0.32 |
| ▸ | TLR4 | O00206 | 1/20 | 0.31 |
| ▸ | TLR2 | O60603 | 1/20 | 0.31 |
| ▸ | HPGD | P15428 | 1/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23037322 | 1.00 | GAA (0.34) | GAALMNAALDH1A1CYP1A2CYP2C9 | |
| SCHEMBL23037376 | 0.83 | — | — | |
| SCHEMBL30059774 | 0.83 | — | — | |
| SCHEMBL23037378 | 0.83 | — | — | |
| SCHEMBL23037316 | 0.81 | EZH2 (0.31) | — | |
| SCHEMBL23037318 | 0.81 | EZH2 (0.31) | — | |
| SCHEMBL23037119 | 0.74 | GAA (0.46) | GAALMNAALDH1A1CYP1A2CYP2C9 | |
| SCHEMBL23037118 | 0.74 | GAA (0.46) | GAALMNAALDH1A1CYP1A2CYP2C9 | |
| SCHEMBL8973157 | 0.72 | ALDH1A1 (0.41) | GAAALDH1A1HPGDKMT2A | |
| SCHEMBL23037148 | 0.71 | LMNA (0.53) | GAALMNAALDH1A1CYP1A2CYP2C9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11924979-B2 | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-03-05 | — | — | US | disclosed |
| US-20210147629-A1 | RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-05-20 | — | — | US | disclosed |
| EP-3786233-A1 | RESIN COMPOSITION, LAMINATE, RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR WAFER, SUBSTRATE FOR MOUNTING RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-03-03 | — | — | EP | disclosed |