SCHEMBL23071476

SCHEMBL23071476

C[SiH](C)O[Si](C)(C)CN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28380082 0.78
SCHEMBL515099 0.75
SCHEMBL2385229 0.74
SCHEMBL47730 0.73
SCHEMBL12431110 0.73
SCHEMBL7751767 0.72 NFKB1 (0.32)
SCHEMBL23071494 0.71 DNM1 (0.35)
SCHEMBL5053954 0.71
SCHEMBL1869258 0.71
SCHEMBL11911710 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108586650-B P-N-Si flame-retardant nanogel and preparation method and application thereof 东华大学 2020-04-21 CN claimed
CN-114026150-A Polyamide-imide resin, resin composition, and semiconductor device 昭和电工材料株式会社 2022-02-08 CN disclosed
WO-2021045004-A1 POLYAMIDE IMIDE RESIN, RESIN COMPOSITION AND SEMICONDUCTOR DEVICE 昭和電工マテリアルズ株式会社 2021-03-11 WO disclosed
CN-109593197-B N-Si series nano hydrogel flame retardant and preparation and application thereof 东华大学 2021-01-05 CN disclosed
CN-108586650-B P-N-Si flame-retardant nanogel and preparation method and application thereof 东华大学 2020-04-21 CN disclosed