SCHEMBL2385229

SCHEMBL2385229

C[SiH](C)O[Si](C)(C)CCCN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7751767 0.93 NFKB1 (0.32)
SCHEMBL23071494 0.91 DNM1 (0.35)
SCHEMBL28380082 0.85
SCHEMBL11911710 0.85
SCHEMBL15283109 0.85
SCHEMBL11911714 0.82
SCHEMBL11911718 0.82
SCHEMBL19702986 0.82
SCHEMBL515099 0.79
SCHEMBL47725 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 813 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117598931-A Efficient repairing conditioner based on silicone oil mixture and preparation method thereof 古新(中山)新材料科技有限公司 2024-02-27 CN claimed
CN-117510847-A Polyimide film and electronic device 杜邦电子公司 2024-02-06 CN claimed
CN-111607225-B Polyimide film and electronic device 杜邦电子公司 2024-01-26 CN claimed
CN-112480442-B Polyimide film and electronic device 杜邦电子公司 2024-01-23 CN claimed
CN-116285058-B Network sheath material for burning crust 广东安拓普聚合物科技有限公司 2023-09-19 CN claimed
CN-115873522-A Wear-resistant and impact-resistant UV (ultraviolet) photocuring protective film and preparation process thereof 上海兰庆新材料技术股份有限公司 2023-03-31 CN claimed
CN-115700267-A Printed circuit board packaging adhesive and preparation method thereof 深圳市米韵科技有限公司 2023-02-07 CN claimed
CN-115678098-A Simple preparation method of ultra-smooth surface formed by polyimide composite microspheres 常州大学 2023-02-03 CN claimed
CN-115594851-A Reactive amphiphilic additive and preparation method and application thereof 华南理工大学(CN) 2023-01-13 CN claimed
CN-115536901-A Preparation method of silica hybrid polyimide ultra-smooth surface material with good stability 常州大学 2022-12-30 CN claimed
US-7416830-B2 Photosensitive resin compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-26 US claimed
EP-1680711-A2 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS Fujifilm Electronic Materials USA, Inc. (US) 2006-07-19 EP claimed
US-20060063095-A9 Novel photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2006-03-23 US claimed
EP-1609026-A2 PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE FujiFilm Electronic Materials USA, Inc. (US) 2005-12-28 EP claimed
EP-1579272-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS Fujifilm Electronic Materials USA, Inc. (US) 2005-09-28 EP claimed
US-20050181297-A1 Novel photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2005-08-18 US claimed
WO-2005038524-A2 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS ARCH SPECIALTY CHEMICALS, INC. (US) 2005-04-28 WO claimed
US-20040161619-A1 Process for producing a heat resistant relief structure ARCH SPECIALTY CHEMICALS, INC. 2004-08-19 US claimed
WO-2004055592-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOISTIONS FOR USE IN BILAYER IMAGING SYSTEMS ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO claimed
WO-2004055593-A2 PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO claimed