⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29568659 | 1.00 | — | — | |
| SCHEMBL28396442 | 0.79 | ALDH1A1 (0.52) | — | |
| SCHEMBL4156640 | 0.78 | TSHR (0.35) | — | |
| SCHEMBL19809449 | 0.77 | ALDH1A1 (0.53) | — | |
| SCHEMBL8018541 | 0.74 | — | — | |
| SCHEMBL9775497 | 0.70 | LMNA (0.45) | — | |
| SCHEMBL19809418 | 0.69 | TSHR (0.38) | — | |
| SCHEMBL29776859 | 0.69 | — | — | |
| SCHEMBL1054362 | 0.69 | — | — | |
| Catechol SCHEMBL6544958 | 0.68 | ALDH1A1 (0.83) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-11413682-B2 | Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-08-16 | — | — | US | disclosed |
| US-20220220338-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| US-20220213348-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-07 | — | — | US | disclosed |
| US-11377522-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-05 | — | — | US | disclosed |
| EP-3971229-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-03-23 | — | — | EP | disclosed |
| EP-3957678-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2022-02-23 | — | — | EP | disclosed |
| EP-3318606-B1 | SILICON-CONTAINING RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2020-03-18 | — | — | EP | disclosed |
| EP-3275940-B1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2019-12-18 | — | — | EP | disclosed |
| US-20190225804-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-07-25 | — | — | US | disclosed |
| EP-3330320-B1 | POLYIMIDE PRECURSOR COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2019-04-24 | — | — | EP | disclosed |
| US-20180223045-A1 | POLYIMIDE PRECURSOR COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-08-09 | — | — | US | disclosed |
| US-20180187010-A1 | SILICON-CONTAINING RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-07-05 | — | — | US | disclosed |
| EP-3330320-A1 | POLYIMIDE PRECURSOR COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-06-06 | — | — | EP | disclosed |
| EP-3318606-A1 | SILICON-CONTAINING RESIN COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-05-09 | — | — | EP | disclosed |
| EP-3275940-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-01-31 | — | — | EP | disclosed |
| US-20110195259-A1 | Metallizable and Metallized Polyolefin Films and a Process of Making Same | JINDAL FILMS AMERICAS LLC | 2011-08-11 | — | — | US | disclosed |