SCHEMBL23207680

SCHEMBL23207680

CCCC(C)(CC)n1nnc2ccccc21

nearest known ligand 0.49

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
SLC9A1 P19634 8/20 0.49
CYP4Z1 Q86W10 6/20 0.43
KEAP1 Q14145 1/20 0.43
ATM Q13315 2/20 0.40
POLB P06746 1/20 0.40
MAPK1 P28482 1/20 0.40
ALDH1A1 P00352 1/20 0.40
CYP1A2 P05177 1/20 0.40
CYP3A4 P08684 1/20 0.40
CYP2D6 P10635 1/20 0.40
MAPT P10636 1/20 0.40
CYP2C9 P11712 1/20 0.40
THPO P40225 1/20 0.40
PTPRC P08575 1/20 0.39
PTPN1 P18031 1/20 0.39
GRM2 Q14416 1/20 0.38
ASAH1 Q13510 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23207655 0.94 SLC9A1 (0.51) SLC9A1CYP4Z1KEAP1ATMPOLB
SCHEMBL23207744 0.84 SLC9A1 (0.51) SLC9A1CYP4Z1KEAP1ATMPOLB
SCHEMBL22219968 0.82 SLC9A1 (0.56) SLC9A1CYP4Z1KEAP1ATMPOLB
SCHEMBL15444316 0.80 SLC9A1 (0.53) SLC9A1CYP4Z1KEAP1ATMPOLB
SCHEMBL10954913 0.77 SLC9A1 (0.55) SLC9A1CYP4Z1KEAP1ATMPOLB
SCHEMBL7760804 0.76 SLC9A1 (0.55) SLC9A1CYP4Z1KEAP1ATMPOLB
SCHEMBL10606076 0.76 SLC9A1 (0.51) SLC9A1CYP4Z1KEAP1ATMPOLB
SCHEMBL241996 0.76 SLC9A1 (0.51) SLC9A1CYP4Z1KEAP1ATMPOLB
SCHEMBL25877503 0.73 SLC9A1 (0.52) SLC9A1CYP4Z1KEAP1ATMPOLB
SCHEMBL10607208 0.73 SLC9A1 (0.52) SLC9A1CYP4Z1KEAP1ATMPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021067150-A1 ETCHING COMPOSITION AND METHOD FOR SELECTIVELY REMOVING SILICON NITRIDE DURING MANUFACTURE OF A SEMICONDUCTOR DEVICE VERSUM MATERIALS US, LLC (US) 2021-04-08 WO disclosed