Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC9A1 | P19634 | 8/20 | 0.51 |
| ▸ | POLB | P06746 | 2/20 | 0.47 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.47 |
| ▸ | ATM | Q13315 | 1/20 | 0.47 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.47 |
| ▸ | DGAT1 | O75907 | 1/20 | 0.43 |
| ▸ | CYP4Z1 | Q86W10 | 6/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.43 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.43 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.43 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.43 |
| ▸ | MAPT | P10636 | 1/20 | 0.43 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.43 |
| ▸ | THPO | P40225 | 1/20 | 0.43 |
| ▸ | PTPRC | P08575 | 1/20 | 0.41 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.41 |
| ▸ | GRM2 | Q14416 | 1/20 | 0.41 |
| ▸ | APAF1 | O14727 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15444316 | 0.81 | SLC9A1 (0.53) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL25877503 | 0.80 | SLC9A1 (0.52) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL10606076 | 0.79 | SLC9A1 (0.51) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL23077724 | 0.77 | POLB (0.52) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL8631035 | 0.77 | MAPT (0.52) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL7760804 | 0.76 | SLC9A1 (0.55) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL23207680 | 0.76 | SLC9A1 (0.49) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL23207744 | 0.75 | SLC9A1 (0.51) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL23207655 | 0.75 | SLC9A1 (0.51) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL16578109 | 0.73 | SLC9A1 (0.45) | SLC9A1POLBMAPK1ATMKEAP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 557 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3774680-B1 | CLEANING COMPOSITIONS | FUJIFILM ELECTRONIC MAT USA INC (US) | 2025-09-24 | — | — | EP | claimed |
| US-12187984-B2 | Treatment liquid and method for treating object to be treated | FUJIFILM CORPORATION (JP) | 2025-01-07 | — | — | US | claimed |
| US-12139693-B2 | Treatment liquid and method for treating object to be treated | FUJIFILM CORPORATION (JP) | 2024-11-12 | — | — | US | claimed |
| EP-3672944-B1 | CLEANING COMPOSITIONS | FUJIFILM ELECTRONIC MAT USA INC (US) | 2024-08-07 | — | — | EP | claimed |
| US-20240174924-A1 | ETCHING COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2024-05-30 | — | — | US | claimed |
| EP-3719105-B1 | CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES | FUJIFILM ELECTRONIC MAT USA INC (US) | 2023-09-27 | — | — | EP | claimed |
| US-20230159864-A1 | TREATMENT LIQUID AND METHOD FOR TREATING OBJECT TO BE TREATED | FUJIFILM CORPORATION (JP) | 2023-05-25 | — | — | US | claimed |
| US-11499099-B2 | Etching composition | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2022-11-15 | — | — | US | claimed |
| CN-115044375-A | Etching composition | 富士胶片电子材料美国有限公司 | 2022-09-13 | — | — | CN | claimed |
| US-20220282182-A1 | TREATMENT LIQUID AND METHOD FOR TREATING OBJECT TO BE TREATED | FUJIFILM CORPORATION (JP) | 2022-09-08 | — | — | US | claimed |
| US-20070128872-A1 | Polishing composition and polishing method | SHOWA DENKO K.K. (JP) | 2007-06-07 | — | — | US | claimed |
| US-7186354-B2 | Anticorrosive treating concentrate | NEC ELECTRONICS CORPORATION (JP) | 2007-03-06 | — | — | US | claimed |
| EP-1687387-A1 | POLISHING COMPOSITION COMPRISING PHOSPHATE ESTERS AND POLISHING METHOD | Showa Denko K.K. (JP) | 2006-08-09 | — | — | EP | claimed |
| WO-2005047409-A1 | POLISHING COMPOSITION AND POLISHING METHOD | SHOWA DENKO K.K. (JP) | 2005-05-26 | — | — | WO | claimed |
| US-6897150-B1 | Semiconductor wafer surface and method of treating a semiconductor wafer surface | NEC ELECTRONICS CORPORATION (JP) | 2005-05-24 | — | — | US | claimed |
| US-6890864-B2 | Semiconductor device fabricating method and treating liquid | NEC ELECTRONICS CORPORATION (JP) | 2005-05-10 | — | — | US | claimed |
| US-6833109-B1 | Method and apparatus for storing a semiconductor wafer after its CMP polishing | NEC ELECTRONICS CORPORATION (JP) | 2004-12-21 | — | — | US | claimed |
| US-20030134507-A1 | Semiconductor device fabricating method and treating liquid | NEC CORPORATION (JP) | 2003-07-17 | — | — | US | claimed |
| US-20030027418-A1 | Semiconductor device fabricating method and treating liquid | NEC CORPORATION (JP) | 2003-02-06 | — | — | US | claimed |
| US-20010030315-A1 | Anticorrosive treating concentrate | NEC CORPORATION AND SUMITOMO CHEMICAL COMPANY LIMITED | 2001-10-18 | — | — | US | claimed |