SCHEMBL2323482

SCHEMBL2323482

C=CCc1ccc(COCC2CO2)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.50
TSHR P16473 4/20 0.41
CYP3A4 P08684 3/20 0.41
SMN1; SMN2 Q16637 3/20 0.41
TP53 P04637 2/20 0.41
ALOX15 P16050 1/20 0.41
ALOX12 P18054 1/20 0.41
LMNA P02545 1/20 0.37
CYP1A2 P05177 1/20 0.37
MAPT P10636 1/20 0.37
TDP1 Q9NUW8 1/20 0.36
HIF1A Q16665 1/20 0.35
MAPK1 P28482 1/20 0.34
PPARG P37231 1/20 0.34
PPARD Q03181 1/20 0.34
PPARA Q07869 1/20 0.34
TAAR1 Q96RJ0 1/20 0.34
MGLL Q99685 2/20 0.33
XDH P47989 1/20 0.33
GLA P06280 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Chavicol SCHEMBL6121991 0.87 ALDH1A1 (0.47) ALDH1A1TSHRCYP3A4SMN1; SMN2TP53
SCHEMBL28681163 0.87 ALDH1A1 (0.50) ALDH1A1TSHRCYP3A4SMN1; SMN2TP53
SCHEMBL731016 0.86 TSHR (0.48) ALDH1A1TSHRCYP3A4SMN1; SMN2TP53
SCHEMBL24172680 0.84 ALDH1A1 (0.45) ALDH1A1TSHRCYP3A4SMN1; SMN2TP53
SCHEMBL4955880 0.84 ALDH1A1 (0.47) ALDH1A1TSHRCYP3A4SMN1; SMN2TP53
SCHEMBL239227 0.83 ALDH1A1 (0.46) ALDH1A1TSHRCYP3A4SMN1; SMN2TP53
Allylbenzene SCHEMBL1358355 0.83 ALDH1A1 (0.50) ALDH1A1TSHRCYP3A4SMN1; SMN2TP53
SCHEMBL1471512 0.82 ALDH1A1 (0.42) ALDH1A1TSHRCYP3A4SMN1; SMN2TP53
SCHEMBL21863346 0.80 MGLL (0.47) ALDH1A1TSHRCYP3A4SMN1; SMN2TP53
SCHEMBL12172323 0.80 MGLL (0.47) ALDH1A1TSHRCYP3A4SMN1; SMN2TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112470318-B Electrolyte composition, electrolyte membrane, and method for producing electrolyte membrane 株式会社日本触媒 2024-08-16 CN disclosed
US-12027666-B2 Electrolyte composition, electrolyte film, and method of manufacturing electrolyte film NIPPON SHOKUBAI CO., LTD. (JP) 2024-07-02 US disclosed
WO-2024135615-A1 ELECTROLYTE COMPOSITION, ELECTROLYTE CURED ARTICLE OBTAINED BY CURING SAME, ELECTRODE, AND SECONDARY BATTERY 株式会社日本触媒 2024-06-27 WO disclosed
WO-2024024628-A1 METHOD FOR PRODUCING BATTERY CONSTITUENT MATERIAL AND ELECTRODE 株式会社日本触媒 2024-02-01 WO disclosed
WO-2024024624-A1 COMPOSITION AND SLURRY, BATTERY CONSTITUENT MATERIAL USING SAME, AND ELECTRODE AND ALL-SOLID-STATE BATTERY 株式会社日本触媒 2024-02-01 WO disclosed
CN-110770959-B Electrolyte composition, electrolyte membrane, electrode, battery, and method for evaluating electrolyte composition 株式会社日本触媒 2023-08-25 CN disclosed
EP-3817119-B1 ELECTROLYTE COMPOSITION, ELECTROLYTE FILM, AND METHOD OF MANUFACTURING ELECTROLYTE FILM NIPPON CATALYTIC CHEM IND (JP) 2022-08-17 EP disclosed
CN-111996563-B Hole metallization composition for vertical continuous pulse electroplating and electroplating method 广东硕成科技股份有限公司 2022-07-01 CN disclosed
US-11374258-B2 Electrolyte composition, electrolyte membrane, electrode, cell and method for evaluating electrolyte composition NIPPON SHOKUBAI CO., LTD. (JP) 2022-06-28 US disclosed
EP-3648226-B1 ELECTROLYTE COMPOSITION, ELECTROLYTE MEMBRANE, ELECTRODE AND BATTERY NIPPON CATALYTIC CHEM IND (JP) 2022-06-22 EP disclosed
US-20050211956-A1 Method for drying nonionic alkylene oxide-type water-soluble resin, method for packaging it, and method for transporting it NIPPON SHOKUBAI CO., LTD. (JP) 2005-09-29 US disclosed
US-20050197485-A1 Process for production of ethylene oxide copolymer NIPPON SHOKUBAI CO., LTD. 2005-09-08 US disclosed
EP-1568726-A1 Process for production of ethylene oxide copolymer Nippon Shokubai Co., Ltd. (JP) 2005-08-31 EP disclosed
EP-1566398-A1 Method for drying nonionic alkylene oxide-type water soluble resin, method for packaging it, and method for transporting it DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2005-08-24 EP disclosed
US-6864353-B2 Production process for ethylene oxide copolymer DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2005-03-08 US disclosed
US-6765084-B2 AFTER THE DEVOLATILIZATION, THE RESIN SHOULD HAVE A SOLVENT CONCENTRATION OF 0.01 TO 30 WEIGHT % AND A WATER CONTENT OF NOT MORE THAN 200 PPM, AND THE RESIN SHOULD CONTAIN NO ANTISTATIC AGENT. Dai-ichi Kogyo Seiyakn Co., Ltd. (JP) 2004-07-20 US disclosed
US-20030158374-A1 Production process for ethylene oxide copolymer DAI-ICHI KOGYO SEIYAKU CO., LTD. 2003-08-21 US disclosed
US-20030135022-A1 Production process for ethylene oxide resin DAI-ICHI KOGYO SEIYAKU CO., LTD. 2003-07-17 US disclosed
EP-1327650-A1 Production process for ethylene oxide copolymer Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) 2003-07-16 EP disclosed
EP-1327651-A1 Production process for ethylene oxide resin Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) 2003-07-16 EP disclosed