SCHEMBL232398

SCHEMBL232398

O=P(OCC(Br)C(Br)Br)(OCC(Br)C(Br)Br)OCC(Br)C(Br)Br

nearest known ligand 0.40

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.40
TSHR P16473 1/20 0.35
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2414731 0.79 PGK1 (0.46)
SCHEMBL27302 0.79 CYP3A4 (0.38) CYP3A4L3MBTL1TSHRALDH1A1
SCHEMBL11224375 0.79 CYP3A4 (0.38) CYP3A4L3MBTL1TSHR
SCHEMBL9579450 0.77 CYP3A4 (0.43) CYP3A4L3MBTL1TSHRALDH1A1
SCHEMBL5085596 0.75 CYP3A4 (0.39) CYP3A4L3MBTL1
SCHEMBL5704321 0.72 CYP3A4 (0.45) CYP3A4L3MBTL1TSHRALDH1A1
SCHEMBL11598129 0.71 CYP3A4 (0.36) CYP3A4L3MBTL1
Tris(2,3-Dibromopropyl)Phosphate SCHEMBL26576 0.70 CYP3A4 (0.39) CYP3A4L3MBTL1TSHRALDH1A1
SCHEMBL4963435 0.69 ALDH1A1 (0.40) CYP3A4L3MBTL1TSHRALDH1A1
SCHEMBL5851904 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4726011-A1 FLAME RETARDANT, COMPOSITION, AND MOLDED ARTICLE ADEKA CORPORATION (JP) 2026-04-15 EP disclosed
WO-2024252972-A1 FLAME RETARDANT, COMPOSITION, AND MOLDED ARTICLE 株式会社ADEKA 2024-12-12 WO disclosed
US-10123412-B2 Thermosetting polymer formulations, circuit materials, and methods of use thereof ROGERS CORPORATION (US) 2018-11-06 US disclosed
US-20170218171-A1 THERMOSETTING POLYMER FORMULATIONS, CIRCUIT MATERIALS, AND METHODS OF USE THEREOF JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT 2017-08-03 US disclosed
WO-2017132310-A1 THERMOSETTING POLYMER FORMULATIONS, CIRCUIT MATERIALS, AND METHODS OF USE THEREOF ROGERS CORPORATION (US) 2017-08-03 WO disclosed
EP-2392603-B1 EPOXY RESIN COMPOSITION, CURING AGENT, AND CURING ACCELERATOR NIPPON SODA CO (JP) 2017-07-26 EP disclosed
EP-2489689-B1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NIPPON SODA CO (JP) 2017-05-10 EP disclosed
US-9068074-B2 Composition for formation of cured epoxy resin, and cured products thereof NIPPON SODA CO., LTD. (JP) 2015-06-30 US disclosed
US-9023956-B2 Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor NIPPON SODA CO., LTD. (JP) 2015-05-05 US disclosed
EP-2476710-B1 METHOD FOR PRODUCING POLYBUTADIENE NIPPON SODA CO (JP) 2015-03-18 EP disclosed
US-20130059942-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME NIPPON SODA CO., LTD. (JP) 2013-03-07 US disclosed
EP-2489689-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF Nippon Soda Co., Ltd. (JP) 2012-08-22 EP disclosed
US-20120202910-A1 METHOD FOR PRODUCING POLYBUTADIENE NIPPON SODA CO., LTD. (JP) 2012-08-09 US disclosed
US-20120196991-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) 2012-08-02 US disclosed
EP-2476710-A1 METHOD FOR PRODUCING POLYBUTADIENE Nippon Soda Co., Ltd. (JP) 2012-07-18 EP disclosed
EP-2410001-A1 INCLUSION COMPLEX, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR Nippon Soda Co., Ltd. (JP) 2012-01-25 EP disclosed
US-20120004349-A1 Epoxy resin composition, curing agent, and curing accelerator NIPPON SODA CO., LTD. 2012-01-05 US disclosed
US-20120004377-A1 CLATHRATE, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR NIPPON SODA CO., LTD. 2012-01-05 US disclosed
US-20100179250-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION NIPPON SODA CO., LTD. (JP) 2010-07-15 US disclosed
EP-2192139-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION Nippon Soda Co., Ltd. (JP) 2010-06-02 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120004377-A1 CLATHRATE, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR SEM1, RCC1, BMI1 CYP3A4 2727/4885L3MBTL1 3185/4885TSHR 4464/4885
US-20120004349-A1 Epoxy resin composition, curing agent, and curing accelerator DCTN1, ARCN1, UNC119 CYP3A4 2486/4885L3MBTL1 2138/4885TSHR 4259/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.