SCHEMBL23326466

SCHEMBL23326466

CC1(C)CC(CCCCCCC2CC(C)(C)N(O)C(C)(C)C2)CC(C)(C)N1O

nearest known ligand 0.41

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28996771 0.90 GAA (0.38) GAAL3MBTL1
SCHEMBL9063104 0.86 TSHR (0.40)
SCHEMBL10135303 0.85 GAA (0.38) GAAL3MBTL1
SCHEMBL17640134 0.83 GAA (0.33) GAAL3MBTL1
SCHEMBL28533937 0.83 LMNA (0.38) L3MBTL1
SCHEMBL15681313 0.82 GAA (0.41) GAAL3MBTL1
SCHEMBL16710265 0.82 GAA (0.41) GAAL3MBTL1
SCHEMBL9400295 0.82 GAA (0.30) GAAL3MBTL1
SCHEMBL20537295 0.81 ALOX5 (0.39) GAAL3MBTL1
SCHEMBL757831 0.80 SMN1; SMN2 (0.37) GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12037436-B2 Unsaturated polyester resin composition, molding material, molded article, and battery pack housing for electric vehicles JAPAN COMPOSITE CO., LTD. (JP) 2024-07-16 US disclosed
US-20230183433-A1 THIN PLATE MOLDING MATERIAL AND MOLDED ARTICLE JAPAN COMPOSITE CO., LTD. (JP) 2023-06-15 US disclosed
US-20210380801-A1 UNSATURATED POLYESTER RESIN COMPOSITION, MOLDING MATERIAL, MOLDED ARTICLE, AND BATTERY PACK HOUSING FOR ELECTRIC VEHICLES JAPAN COMPOSITE CO., LTD. (JP) 2021-12-09 US disclosed
US-20210139629-A1 UNSATURATED POLYESTER RESIN COMPOSITION, MOLDING MATERIAL, MOLDED ARTICLE, AND BATTERY PACK HOUSING FOR ELECTRIC VEHICLES JAPAN COMPOSITE CO., LTD. (JP) 2021-05-13 US disclosed