⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4407181 | 0.73 | — | — | |
| SCHEMBL10387343 | 0.63 | TP53 (0.39) | — | |
| SCHEMBL27690963 | 0.62 | — | — | |
| SCHEMBL13952188 | 0.62 | ALDH1A1 (0.36) | — | |
| SCHEMBL29031707 | 0.61 | TP53 (0.33) | — | |
| SCHEMBL28185012 | 0.61 | CA12 (0.33) | — | |
| SCHEMBL216109 | 0.61 | CYP1A2 (0.39) | — | |
| SCHEMBL890045 | 0.60 | MAOA (0.32) | — | |
| SCHEMBL28792144 | 0.60 | HTT (0.35) | — | |
| SCHEMBL2783327 | 0.60 | ALDH1A1 (0.48) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 227 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024134929-A1 | SHEET MOLDING COMPOUND AND MOLDED ARTICLE | DIC株式会社 | 2024-06-27 | — | — | WO | disclosed |
| WO-2024111245-A1 | CURABLE COMPOSITION, FIBER COMPOSITE MATERIAL, SHEET MOLDING COMPOUND, AND MOLDED ARTICLE | DIC株式会社 | 2024-05-30 | — | — | WO | disclosed |
| CN-116057043-B | Urea derivatives and their use as curing agents and curing accelerators for resin systems | 赫克塞尔合成有限公司 | 2024-04-16 | — | — | CN | disclosed |
| WO-2024075339-A1 | LAMINATED BODY, LAMINATED BODY PRODUCTION METHOD, AND BATTERY CASE | DIC株式会社 | 2024-04-11 | — | — | WO | disclosed |
| WO-2024075361-A1 | LAMINATED BODY, METHOD FOR MANUFACTURING LAMINATED BODY, AND BATTERY CASE | DIC株式会社 | 2024-04-11 | — | — | WO | disclosed |
| US-11939421-B2 | Or relating to curing agents | HEXCEL COMPOSITES LIMITED (GB) | 2024-03-26 | — | — | US | disclosed |
| WO-2024048076-A1 | APPARATUS FOR PRODUCING FIBER-REINFORCED COMPOSITE SHEET AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE SHEET | DIC株式会社 | 2024-03-07 | — | — | WO | disclosed |
| US-11879052-B2 | Curatives | HEXCEL COMPOSITES LIMITED (GB) | 2024-01-23 | — | — | US | disclosed |
| EP-3553100-B1 | RESIN COMPOSITION FOR VARTM MOLDING, MOLDING MATERIAL, MOLDED ARTICLE AND METHOD FOR PRODUCING MOLDED ARTICLE | DAINIPPON INK & CHEMICALS (JP) | 2023-11-15 | — | — | EP | disclosed |
| US-20230323057-A1 | RADICAL CURABLE RESIN COMPOSITION, FIBER-REINFORCED MOLDING MATERIAL, AND MOLDED ARTICLE USING SAME | DIC CORPORATION (JP) | 2023-10-12 | — | — | US | disclosed |
| US-5491202-A | A CURABLE POLYESTER BLENDS WITH A HARDENER | NOF CORPORATION (JP) | 1996-02-13 | — | — | US | disclosed |
| EP-0686651-A1 | Grafting reaction product and method for producing the same | Toyo Boseki Kabushiki Kaisha (JP) | 1995-12-13 | — | — | EP | disclosed |
| US-5451695-A | Acrylic ester monomer with carbamate group, glazing for windows | MITSUI TOATSU CHEMICALS, INC. (JP) | 1995-09-19 | — | — | US | disclosed |
| US-5449707-A | Graft polymer; inks, paints; storage stability | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 1995-09-12 | — | — | US | disclosed |
| US-5393607-A | Glazing materials; hardness, impact strength, scratch resistance | MITSUI TOATSU CHEMICLAS, INC. (JP) | 1995-02-28 | — | — | US | disclosed |
| EP-0551867-A1 | Laminated transparent plastic material and polymerizable monomer | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-07-21 | — | — | EP | disclosed |
| EP-0493123-A1 | Composite vibration-damping material and process for producing the same | KAWASAKI STEEL CORPORATION (JP) | 1992-07-01 | — | — | EP | disclosed |
| US-5124234-A | Protective coating for printed circuits | FUJI PHOTO FILM CO., LTD. (JP) | 1992-06-23 | — | — | US | disclosed |
| US-4882216-A | Epoxy resin film covered with metal foil and flexible printed wiring board | KASHIMA INDUSTRIES CO. (JP) | 1989-11-21 | — | — | US | disclosed |
| EP-0303225-A2 | Epoxy resin film covered with metal foil and flexible printed wiring board | KASHIMA INDUSTRIES, CO. (JP) | 1989-02-15 | — | — | EP | disclosed |