SCHEMBL23358783

SCHEMBL23358783

O=C(OO)c1cccc(-c2ccccc2)c1O

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HNF4A P41235 1/20 0.68
BCAT2 O15382 1/20 0.52
HDAC4 P56524 1/20 0.48
HDAC2 Q92769 1/20 0.48
HDAC8 Q9BY41 1/20 0.48
HDAC6 Q9UBN7 1/20 0.48
SLC6A4 P31645 1/20 0.46
SLC6A3 Q01959 1/20 0.46
PTPN1 P18031 4/20 0.46
PLAU P00749 1/20 0.46
PLAT P00750 1/20 0.46
AKR1C3 P42330 1/20 0.44
AKR1C2 P52895 1/20 0.44
AKR1C1 Q04828 1/20 0.44
MEN1 O00255 1/20 0.43
KMT2A Q03164 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
PTPN6 P29350 2/20 0.42
PTPN2 P17706 1/20 0.42
SCN1A P35498 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8662843 0.85 BCAT2 (0.64) HNF4ABCAT2SLC6A4SLC6A3MEN1
SCHEMBL4827474 0.84 HNF4A (0.66) HNF4ASLC6A4SLC6A3PLAUPLAT
SCHEMBL28366814 0.83 BCAT2 (0.62) HNF4ABCAT2SLC6A4SLC6A3MEN1
SCHEMBL9306956 0.83 HNF4A (0.64) HNF4ABCAT2HDAC4HDAC2HDAC8
SCHEMBL8526504 0.82 BCAT2 (0.52) HNF4ABCAT2SLC6A4SLC6A3MEN1
SCHEMBL29838619 0.81 HNF4A (0.72) HNF4ABCAT2HDAC4HDAC2HDAC8
SCHEMBL8888647 0.81 HNF4A (0.72) HNF4ABCAT2HDAC4HDAC2HDAC8
SCHEMBL27673670 0.81 HNF4A (0.62) HNF4ABCAT2HDAC4HDAC2HDAC8
SCHEMBL29662951 0.81 HNF4A (1.00) HNF4ABCAT2HDAC4HDAC2HDAC8
SCHEMBL9245987 0.81 HNF4A (0.78) HNF4ABCAT2HDAC4HDAC2HDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11926695-B2 High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-03-12 US disclosed
US-20210147612-A1 HIGH-THERMAL CONDUCTIVE EPOXY COMPOUND AND COMPOSITION, MATERIAL FOR SEMICONDUCTOR PACKAGE, MOLDED PRODUCT, ELECTRIC AND ELECTRONIC DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2021-05-20 US disclosed