SCHEMBL2348464

SCHEMBL2348464

CCCCCCC(CC)(SCc1c(C(C)(C)C)cc(O)cc1C(C)(C)C)C(=O)O

nearest known ligand 0.33

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
CNR2 P34972 7/20 0.31
PTGS2 P35354 2/20 0.31
GAA P10253 1/20 0.31
XBP1 P17861 1/20 0.31
ATM Q13315 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31
CNR1 P21554 6/20 0.31
HCAR2 Q8TDS4 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL551941 0.83 GAA (0.39) GAAATMNPSR1
SCHEMBL2464359 0.72 CES2 (0.39)
SCHEMBL28416156 0.69 PTGS2 (0.53) PTGS2
SCHEMBL21409779 0.69 CES2 (0.41)
SCHEMBL22345990 0.69 CES2 (0.41)
SCHEMBL11796242 0.69 CES2 (0.41)
SCHEMBL21409854 0.69 CES2 (0.41)
SCHEMBL11801909 0.69 CES2 (0.41)
SCHEMBL11799942 0.69 CES2 (0.41)
SCHEMBL6441148 0.69 CES2 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1666535-B1 RESIN COMPOSITION AND COMPOSITE USING THE COMPOSITION AND PRODUCTION PROCESS THEREOF DAICEL EVONIK LTD (JP) 2015-11-04 EP disclosed
US-8029910-B2 Resin composition and composite using the composition and production process thereof DAICEL-EVONIK LTD. (JP) 2011-10-04 US disclosed
US-7989540-B2 Resin composition and composite using the composition and production process thereof DAICEL-EVONIK LTD. (JP) 2011-08-02 US disclosed
US-20100215964-A1 RESIN COMPOSITION AND COMPOSITE USING THE COMPOSITION AND PRODUCTION PROCESS THEREOF IKUTA TORU 2010-08-26 US disclosed
US-20070292703-A1 Resin Composition and Composite Using the Composition and Production Process Thereof DAICEL-DEGUSSA LTD. (JP) 2007-12-20 US disclosed
EP-1666535-A1 RESIN COMPOSITIONS, COMPOSITES MADE BY USING THE SAME, AND PROCESS FOR PRODUCTION THEREOF Daicel-Degussa Ltd. (JP) 2006-06-07 EP disclosed