SCHEMBL551941

SCHEMBL551941

CCCCCCC(CC)(SCc1cc(C(C)(C)C)c(O)c(C(C)(C)C)c1)C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 5/20 0.39
KMT2A Q03164 4/20 0.39
ALDH1A1 P00352 4/20 0.36
TSHR P16473 3/20 0.36
MEN1 O00255 3/20 0.36
CYP1A2 P05177 2/20 0.36
CYP3A4 P08684 2/20 0.36
MAPK1 P28482 2/20 0.36
BLM P54132 2/20 0.36
ATM Q13315 2/20 0.36
HIF1A Q16665 2/20 0.36
NPSR1 Q6W5P4 2/20 0.36
MAPT P10636 2/20 0.36
USP2 O75604 1/20 0.36
CYP2D6 P10635 1/20 0.36
LMNA P02545 3/20 0.35
F2R P25116 1/20 0.35
RECQL P46063 1/20 0.35
NR5A2 O00482 1/20 0.35
NR5A1 Q13285 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11175136 0.85 GAA (0.40) GAAKMT2AALDH1A1TSHRMEN1
SCHEMBL29171804 0.84 GAA (0.40) GAAKMT2AALDH1A1TSHRMEN1
SCHEMBL2348464 0.83 CNR2 (0.31) GAAATMNPSR1
SCHEMBL1873365 0.80 ALDH1A1 (0.41) GAAKMT2AALDH1A1TSHRMEN1
SCHEMBL1403736 0.76 ALDH1A1 (0.47) GAAKMT2AALDH1A1TSHRMEN1
SCHEMBL10706899 0.76 ALDH1A1 (0.47) GAAKMT2AALDH1A1TSHRMEN1
SCHEMBL9431214 0.76 ALDH1A1 (0.47) GAAKMT2AALDH1A1TSHRMEN1
SCHEMBL28371810 0.76 ALDH1A1 (0.47) GAAKMT2AALDH1A1TSHRMEN1
SCHEMBL20261733 0.76 ALDH1A1 (0.47) GAAKMT2AALDH1A1TSHRMEN1
SCHEMBL8954866 0.74 ALDH1A1 (0.46) GAAKMT2AALDH1A1TSHRMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1652891-B1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO LTD (JP) 2012-06-13 EP disclosed
US-8110645-B2 Curable resin composition KONISHI CO., LTD. (JP) 2012-02-07 US disclosed
EP-1788035-B1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE KONISHI CO LTD (JP) 2011-01-19 EP disclosed
US-20090264602-A1 Curable Resin Composition and Cold Setting Adhesive KONISHI CO., LTD. (JP) 2009-10-22 US disclosed
US-7576167-B2 Curable resin composition KONISHI CO., LTD. (JP) 2009-08-18 US disclosed
US-20080312401-A1 Reactive Hot-Melt Resin Composition and Reactive Hot-Melt Adhesive SATO SHINICHI 2008-12-18 US disclosed
EP-1788035-A1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE Konishi Co., Ltd. (JP) 2007-05-23 EP disclosed
US-20060189736-A1 Curable resin composition and cold-setting adhesive KONISHI CO., LTD. (JP) 2006-08-24 US disclosed
EP-1652891-A1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO., LTD. (JP) 2006-05-03 EP disclosed
EP-0374813-B1 Magnetic recording medium BASF AG (DE) 1996-07-24 EP disclosed
EP-0374813-A2 Magnetic recording medium BASF Aktiengesellschaft (DE) 1990-06-27 EP disclosed