Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HPGD | P15428 | 3/20 | 0.62 |
| ▸ | TNKS | O95271 | 1/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 7/20 | 0.44 |
| ▸ | GAA | P10253 | 6/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.44 |
| ▸ | MEN1 | O00255 | 5/20 | 0.44 |
| ▸ | MAPT | P10636 | 3/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | USP2 | O75604 | 1/20 | 0.44 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.44 |
| ▸ | TLR9 | Q9NR96 | 2/20 | 0.41 |
| ▸ | PKM | P14618 | 1/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.39 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.39 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.39 |
| ▸ | CASP3 | P42574 | 2/20 | 0.38 |
| ▸ | CASP6 | P55212 | 2/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL367429 | 0.81 | HPGD (0.68) | HPGDTNKSKMT2AGAAALDH1A1 | |
| SCHEMBL6329014 | 0.81 | HPGD (0.68) | HPGDTNKSKMT2AGAAALDH1A1 | |
| SCHEMBL31422646 | 0.78 | HPGD (1.00) | HPGDTNKSKMT2AGAAALDH1A1 | |
| SCHEMBL143970 | 0.78 | HPGD (1.00) | HPGDTNKSKMT2AGAAALDH1A1 | |
| SCHEMBL16474465 | 0.77 | HPGD (0.62) | HPGDTNKSKMT2AGAAALDH1A1 | |
| SCHEMBL16456324 | 0.75 | HPGD (0.74) | HPGDTNKSKMT2AGAAMEN1 | |
| SCHEMBL6328308 | 0.75 | HPGD (0.74) | HPGDTNKSKMT2AGAAALDH1A1 | |
| SCHEMBL4463146 | 0.75 | HPGD (0.74) | HPGDTNKSKMT2AGAAMEN1 | |
| SCHEMBL6327688 | 0.75 | HPGD (0.74) | HPGDTNKSKMT2AGAAMEN1 | |
| SCHEMBL6765903 | 0.75 | HPGD (0.74) | HPGDTNKSKMT2AGAAALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115175951-B | Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-07-12 | — | — | CN | disclosed |
| EP-4357375-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-04-24 | — | — | EP | disclosed |
| EP-4357376-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-04-24 | — | — | EP | disclosed |
| EP-4357374-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-04-24 | — | — | EP | disclosed |
| EP-4321541-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-02-14 | — | — | EP | disclosed |
| CN-117529509-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-06 | — | — | CN | disclosed |
| CN-117500850-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-117500851-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-117355545-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-01-05 | — | — | CN | disclosed |
| CN-117222682-A | Cured resin composition and cured product thereof | 日本化药株式会社 | 2023-12-12 | — | — | CN | disclosed |
| CN-116940617-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 日本化药株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-116888189-A | Thermosetting resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device | 日本化药株式会社 | 2023-10-13 | — | — | CN | disclosed |
| CN-116829619-A | Resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device | 日本化药株式会社 | 2023-09-29 | — | — | CN | disclosed |
| EP-3950334-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2023-08-16 | — | — | EP | disclosed |
| WO-2021117762-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2021-06-17 | — | — | WO | disclosed |
| WO-2021117764-A1 | COMPOUND, METHOD FOR PRODUCING SAME, RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2021-06-17 | — | — | WO | disclosed |
| WO-2021117760-A1 | COMPOUND AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2021-06-17 | — | — | WO | disclosed |